Dr. David Wang
Analyst · The Benchmark Company. Please go ahead
Thanks, Gary, and welcome, everyone, to today's call. With completion of first full year as a public company, I'm now even more confident in ACM's mission to become a major player in the semiconductor capital equipment business. We believe we are in a great position to participate in a build-out of a next generation of fabs for years to come. We have technology leadership, proximity to large customers in Asia and we have recently expanded our production capacity. We have built a solid foundation with important semiconductor customers who are deploying our tools at a scale in some of their major and most advanced production lines. Our growth is driven by share gains in a $3 billion market for single wafer cleaning tools. We have again shared with new customers, new product and the penetration of additional production steps. We also believe our opportunity will increase as industrial moves forward to more advanced nodes and three dimensional architectures. Our 2018 results demonstrate excellent progress toward our strategic objectives. In the fourth quarter, we delivered strong revenue, profitability and cash flow from operations. For the full year, we grew revenue by 104% to $74.6 million, driven by robust customer demand for our tools and crisp executions. Our product differentiation, improved production scale and expanded operating leverage drove non-GAAP gross margin of 46.2% and non-GAAP operating margin of 13.2%. We generate $6.9 million in cash flow from operations and ended the year with more than $27 million of cash. Total shipments, which including two deliveries but not yet fully recognized as revenue were $95 million, up 137% from $40 million in 2017. In addition to strong financial results, we made a significant operational progress in 2018. We solidified our position and major customers. We successfully ramped production at our second factory. We delivered a significant number of first tools in the second half of the year, and we introduced our newest major platform, Ultra-C Tahoe. Please turn to Slide 4. With more than 20 years of history at ACM Research, we're often asked what is driving our business growth now? We attribute our success to: number one, our differentiated and patent-protected technology; number two, timing in the industry. Our customer face real cleaning challenge at advanced nodes. Our breakthrough moment occur with industrial founder traditional cleaning technology to be least effective at a process node starting at 15 nano. Even the tiniest defect began to hurt production yields. We believe our innovative megasonic cleaning process offers perfect solution. Tools with our SAPS technology can remove this tiny defects uniformly across entire 12-inch wafer and deliver better yields. The industry is now taking notice. Our first major SAPS customer, SK Hynix, placed the production order in 2011. They improved yield by more than 1.5 percentage points by using SAPS for just 2 cleaning steps in their DRAM fab process. In 2015, we added 3 more customers, SMIC, Huali and YMTC all with fab near our Shanghai headquarters. This customer is intending to use our platform beyond DRAM into 3D NAND, Foundry and Logic. We appreciate our customer base as they consistently push for improved production and put us at the forefront of resolving their most pressing industrial challenges. Please turn to Slide 5. While our customers deploy our tools to drive their own yields, we often collaborate to deliver new technologies. This interaction combined with the talent and creativity of our Shanghai-based world-class engineering team developed to commercialize our TEBO technology in 2016. TEBO is a different approach to megasonic cleaning. It extends our technology to remove unwanted particles from 3D structures, such as firm fabs, without damaging. We delivered our first TEBO tool to Huali in 2017 and recognized revenue in the same year. We work very closely with our customers and have made a great progress in further developing TEBO technology for optimizing process conditions. We believe it is early days for TEBO, which we expect to become more important as industry broadens its use of vertical structures. In a similar manner, we introduced our third major platform, the Ultra-C Tahoe, last August. Tahoe is the first of its kind that uses 1/10 of the sulfuric acid of competing single-wafer tools. We estimate that Tahoe can help our customers save an order of $10 million a year for typical 100,000 wafers per month DRAM fab. Beyond the cost saving, Tahoe meets the environmental requirement of modern fab around the world. Tahoe is another example of our focus on differentiated, patent-protected product offerings. I am pleased to report that we delivered our first Tahoe to a important strategic customer in January, and a technical evaluation is on schedule. Also feedback for Tahoe has been quite positive from both existing customers and potential new customers. They are very interested in the combination tool, which can integrate the chemical saving of Tahoe with a single-wafer cleaning benefit of fab and TEBO. We believe the Tahoe tool will become a mainstream product to solve today's and future challenges faced by customer for post-CMP cleaning and post-edging cleaning when moving to advanced nodes. Adding it all together, on Slide 6, we estimate that our full portfolio of SAPS, TEBO and Tahoe addresses more than 1/2 of the 3 billion single-wafer wet-cleaning market. We also offer a family of tools for back-end wafer assembly and packaging. Customers for this product, including Technologies. Our product line includes coater, developer, striper, scrubber, edger and plating tools. We believe the back end presented good opportunity for the post-Morris law era. The industry is pushing for increased cheap performance with more advanced packaging solutions. Our engineering team has been very productive, working on several new innovative solutions in the space. The first, which you will hear more about soon, is a brand-new tool with a unique ACM electroplating technology. We believe this tool will be hit as it offers significant performance advantages versus competitors. One of our first packaging customer who has a number of tools in production has placed multiple production orders for this tool. With our newest electroplating technology, we are on the track for delivery in the coming months. We now want to provide an update on our new factory shown on Slide 7. During 2018, we opened our second production facility. The factory is a new leased building around a 10-mile from our Shanghai headquarter. The new factory has 50,000 square feet of production capacity. This complements our original factory, which is located at our Shanghai headquarter. The factory ramped from a very small output in Q3 to more than 40% of our tool production in Q4. We expect to ship majority of our production to the new factory in 2019. Our original factory will be used for small tools and advanced development activities. We believe the new factory and our ability to scale production will support our efforts to win new large customers in the future. Now I will address our performance in light of a recent spending trend in the broader industry. Despite volatility in semiconductor industry, capital spending, we delivered solid growth in 2018. [indiscernible] following orders before and after the Chinese New Year holiday, we're looking forward to another year of solid growth in 2019. As discussed on our last call, most of our customers are in a early to middle stage of the multiyear investment to expand capacity. With their production ramps based on hitting internal year targets, we have orders and a firm forecast for specific projects from several of our top customers, which we expect to contribute in 2019 and beyond. Let me now turn the call over to Lisa, who will discuss our Q4 and fiscal year 2018 financial results in more detail.