David Wang
Analyst · Roth Capital
Thanks, Gary. And welcome everyone for today's call. We are off to a greater start to 2019. It is the momentum to continue into the first quarter. We delivered a solid revenue growth, excellent profitability, and we introduce key new electrical plating or ECP products. First-quarter results demonstrate the competitive strength of our technical expertise. Product differentiation and the production scale. Revenue would double from the same period last year, solid operating leverage grew gross margin of a 43.1% and operating margin of 14.6%. We ended the quarter with more than $27 million of cash. Total shipment which include tools deliver another year recognized as revenue where $14 million, up 40% year over year. In addition, portfolio of the financial results, we made a good operational progress in a quarter. Orders were quite strong, and we completed all planned to delivers. At SEMICON China to a show in March, we launched two products with unique ACM electroplating technology which I would talk more about a moment. Now I will highlight three operations achievements. From the first quarter, we go to slide 4. First, we deliver our first Ultra-C Tahoe evaluation tool to an important strategic customer testing is unplanned and we are on track for customer acceptance later in the year. Because of the environment and the cost benefits, we are now seeing tremendous interest in Ultra-C Tahoe from three other major customers, as well as several new prospects. Tahoe is an excellent example of our focus on differentiated patent protected product offerings by using one tenths of sulfuric acid typically used by competing single wafer cleaning tools. Tahoe meet the environmental requirements more than facts around the world. Reducing the use of sulfuric acid also delivers tremendous cost savings. We estimate that Tahoe can help customers saving around $10 million a year for typical hand use single wafer per month. Feedback on Tahoe is quite a positive. We believe the Tahoe will eventually become a mainstream product that will solve the challenges faced by a customer or post empty cleaning and oppose the action clean. We move to advanced notice. Second, we introduce two electro- plating products at SEMICON China in March. This will show on Slide 5. Their first product is the Ultra ECP AP, AP stands for Advanced Packaging. AP is the backhander assembly tool used for bumpy or plain copper, tin, nickel to wafers at the die level before packaging. The ultra ECP AP deliver more uniform mantle layers and a match area by incorporating our proprietary technologies. This advanced technology solution delivers a better yield, greater efficiency, and a higher throughput due to the fabrication process. Furthermore, Ultra ECP AP, also support a wide range of packaging solutions including Caterpillar, soda bump, redistribution layer, fan out application, [indiscernible]. We also introduce our Ultra ECP MAP. MAP stands for Multi Anode Partial Plating. This new tool is used in front and wafer fabrication process and use our proprietary technology to deliver water cost electrochemical copper plating for copper interconnect applications. The ECP MAP offers improved gas feeding performance for plating ultra thin seed layer. This is a mission critical for advanced nodes at a 14 nano, 12 nano [indiscernible]. We're excited about this new ECB tool. They demonstrate our commitment to technology leadership by delivering innovative proprietary high-performance products in single wafer cleaning solutions. We believe in advanced palladium markets represent a great growth opportunity for us, and we are in great position to capitalize. Market acceptance of the new plating tool is already promising. In Q1, we received the repeater purchase order for two Ultra ECP AP tools, from one of our major packaging customers. And our first tool purchase order for Ultra ECP MAP from our key foundry customer. We deliver the one of this tool in the first quarter by a week's back to the deliver, the other two tours in the coming months. Beyond this new electro-plating solution, our engineering team remains productive and are working on additional new products as we show on Slide 6, innovations through research is our strength. We are standing upon our investment in our need in order to further mounting our competitive need. So stay tuned for more exciting new product announcements from us in the quarters ahead. Third. Our new Shanghai factory is remaining as a plan as shown on Slide 7. A common date for majority of a new production in Q1. For comparison in Q4, the new factory handle 40% of our production. Based on the ramp, we expect the new factory will be made to full support on demand in Q2 and beyond. We intend to ship substantially all our production to the new factory over the course in 2019. All regional factory will be used for small tools, and advanced development activities. Going forward, we believe our expanded capacity and our ability to scale production will support our efforts to win new large customers. Our new factory shows our commitment to scale capacity which will help us achieve our goal of becoming a major player in the industry. Before I turn the call over to Lisa, I want to say a few words about the broader industry. We are monitoring the spending trends in the industry just like everyone else. While semi-industry capital spending is a volatile, we are optimistic about another year of solid growth in 2019 based on orders from our customers. We have orders and their firm forecast tied to a specific products and as several of our top customers. Most of our customer are in early though a stage of multi-year investment to expand the capacity. They're ramping up based on the internal production plan, so less impact by cycle. For example, one PC is using our tool of how to improve yield in a 3D NAND production line and it is being ramped. Another example is a body which is in their MID meters of planned multi-year capacity expansion. On [indiscernible] we're actively fulfill order as we speak. Furthermore, we believe we can dampen the effect of the cycle by delivering new products and adding new customer at all stage. Today, we have plenty of room to grow over 3 billion addressable market. To conclude, we have excellent position dissipate in a build out of a next generation fab for years to come. We have a technology leadership proximity to large customer and a production capacity. We have a build a solid foundation with a strategic semiconductor customer who are deploying our tools at a skier in some of their most advanced production line. And we expect to win new customer around the world as industrial progresses to more advanced nodes and a three dimensional architectures. Let me now turn the call over to Lisa, who will discuss financial results in more detail.