David Wang
Analyst · Roth Capital. Please ask your question
Thanks, Gary, and thanks, everyone for joining us on the call today. Our business momentum continued in the third quarter. We delivered strong financial results. Achieved record shipments, introduced Ultra-C Tahoe project – product, and then began production at our second factory in Shanghai. Revenue more than tripled from the third quarter of 2017, and grew by 11% from last quarter. Strength was driven by continued demand and a great execution with additional contribution from a customer acceptance on an important evaluation tool. Solid growth, margin – gross margin and good leverage drove operating margin to 16.5%. We generated a positive cash flow from operations, and ended the quarter with more than $18 million of cash. Total shipments were approximately $32 million as measured by sale price. We have begun to report total shipments this quarter because we believe quarterly shipment information provides additional context for evaluating our operating results and the business prospects. Total shipments, including two main components, the first is a repeat delivery of tools that are recognized as revenue when shift. The second, as the first tool delivers for which we expect the revenue at a later date. First tool deliveries can be to either existing customer, who hasn't accepted that specific tool yet, for example, the first Tahoe tool deliver to the SAPs customer or to a brand new customer, who has never purchased a tool from ACM before. In each case, first-tool shipments remain on our books as a finished goods inventory, and are carried at a cost onto until customer accepts the product. And ACM recognizes revenue – first-tool shipment repeating represent a positive next step in our sales process. The opportunity shifts from high-level discussions, analysis and in many case we have a demo in our crew to a more comprehensive evaluation phase. The customer commits resources to confirm and validate the benefit of ACM technology in the customer own production line environment. This provides confidence that we are close to a sale of the first tool, and to establishing a relationship that could provide much larger business opportunity. Our second factory shown on the Slide 4 is starting up just in time to support additional demands. This factory is a true game changer, adding 50,000 square feet of available floor space on top of a 36,000 square feet at our first factory. We plan to ramp the new factory from very small output in Q3 to more than 25% of our total production in Q4. We are off to a great start. We have already delivered several machines built at a new factory in October, and early November. When we began ACM, it was our vision that new generation technology would be required as a semiconductor industry, moving to a more advanced nodes. Then in 2006, we locate our operation in Shanghai, China to be the need of Asia where we expect that some of the largest new fab to be constructed. Two decades later, we are even more convinced that our vision was right then, and that is right now. Results that find 2018 confirming our vision, including significant growth in total shipments and the revenue, the need for a second factory as a strong reception for our current and new product offering. To date, we have delivered more than 50 single wafer cleaning tool, mostly SAPS tool to leading large scale memory and logic manufacturers. We believe our patent megasonic leading technology provides the best method for removing tiny killer defect from 2D semiconductor wafers with increased effectiveness on the production nodes beyond 3D nano. Our customers have reported yield improvements range from 2% to more than 5%, depending on their number of cleaning steps that are using SAPS. We see several growth drivers for SAPS including: one, a continue ramp-up of our customer fab capacity; deployments of new of our SAPS technology into more production steps; three, the addition of new customer. We are optimistic for TEBO, which extend our technology to remove unwanted particle for 3D structure or FinFET without damaging. In addition to volume production units, we remain in detailed discussion with all of our customers. Furthermore, several other major semiconductor player are considering TEBO for their advanced 3-D cleaning requirements. On August 23, we introduced the newest addition from our innovation pipeline, Ultra-C Tahoe. Tahoe is a first kind of its kind, a unique cleaning tool that uses 1/10 of the sulfuric acid of a competing single wafer tools. We estimate the Ultra-C Tahoe platform can save more than $10 million a year for typical 100,000 wafer per month DRAM fab. Be on the cost saving, Tahoe meets the requirements of more than environmentally aware IC fabs from around the world including, Yangtze River in China and Icheon region in Korea. Tahoe is another example of our continued focus on differentiated and patent protective product offerings, which can expand our market opportunity and drive profitable long-term growth. We announced our first purchase order for the Tahoe evaluation tool and it is on a track for delivery in Q4. When we add it all up, we estimate that ACM now addresses more than 1/2 of the – 2.5 – $2.7 billion total single wafer cleaning market, with our SAPS TEBO and Tahoe products. We plan to further leverage our position as a key supplier to some of the largest fab projects in Asia, with a range of new product innovation in various stage of development. Before I turn it over to Lisa, I want to comment on our performance in light of our recent spending trends in the broader semiconductor space. While no company can be completely immune for the global semiconductor cycle, we are happy to report that demand remains strong. Our visibility extended well into 2019, as the several of our major customers are in early stage of multiyear fab projects. As one example, we have a good exposure to SK Hynix, who continue to invest in new fab through other cycle. Our net and logical [ph] customer are aggressively expanding capacity as well. In general, the CapEx plans of our customers are highly driven by the need ramping fab to scale. Most importantly, we remain committed to expanding our product offering, winning new customers and drive our technology into more production steps as industry move into more advanced process nodes and the 3D structures. I will now turn the call over to Lisa to discuss our financial results please turn to Slide 5.