David Wang
Analyst · Roth Capital. Please ask your question
Thank you, Mark. Our build momentum accelerated in the second quarter with record revenue, strong profitability, active customer engagements and a new product development. During the quarter, we announced a significant order with a strategically important DRAM customer in China and we anticipate continued order strength for the remainder of the year. We also completed the first phase of the capacity expansion at our new Shanghai facility and it is on track for initial production later this quarter. I am pleased with our second quarter financial results. Revenue more than doubled from the first quarter and grew 138% from last year. Solid execution and a steady customer demand contributed to the upside of the quarter. Profitability was strong with expanded gross margin and improved operating leverage delivering non-GAAP operating margin of approximately 12%. And our cash balance remains solid. We generated positive cash flow from operation and grew net cash by several million dollar from last quarter. We are also making great progress with our customers. During the quarter, we announced the first purchase order with a new and a strategically important DRAM customer with a production facility in China. This extends our SAPS customer count to five major semiconductor manufacturers. Our product supports multiple chemicals and is intended to be qualify for a large number of cleaning steps. We expect to deliver the product this quarter with revenue upon customer acceptance in 2019. This customer select ACM for its high performance, its technologic road map and, most importantly, the expected enhancement to their product yields. We also received numerous order P.O.s for additional advanced packing tool during quarter. Our pipeline continue improve. We are actively supporting evaluation effort for new tool and additional product at virtually all of our existing customer. And we continue to pursue opportunity with several new major IC manufacturer company. We are getting positive feedback and we hope to announce one or more large new customer and additional new products by end of this year. Stepping back, we have been monitoring recent events at the large semiconductor players. We are happy to report that we have seen no change to spending plans at our customers, and demand remains strong. Most of our customer are in early to middle stage of multi-year investment to grow capacity. As such, our customer ramps are based more on hitting their yield targets rather than global semiconductor cycle. At ACM, we are 100% focused on helping our fab customer to achieve their highest goals by providing them with a best-in-class cleaning tool to drive higher yields for their advanced geometry and architectures. Even the tiniest of defect measured in nanometer can impact yields of these more advanced nodes. Our first breakthrough advanced cleaning technology is SAPS. This is our main product line and it drives majority of our current sales. While the rest of the industry abandoned single wafer megasonic cleaning at a large wafer size and a small geometry, we embrace it and have delivered meaningful results. Our SAPS technology applies uniform megasonic energy distribution across the entire wafer and provides the best particle remove efficiency. SAPS benefits began with a 2-D wafer at 45-nano nodes with increased efficiency versus competition at 25-nano node and below. We have demonstrated commercial success with more than 40 machines delivered to leading memory and large scale manufacturers. Our customer have reported yield improvement ranging from 2% to more than 5% while using our patent SAPS technology in multiple cleaning process steps. Our TEBO platform extending ACM cleaning expertise to the next level with advanced feature to expect to be remove unwanted particle in 3-D structure, known as a FinFET, without damage. We delivered our first commercial TEBO platform to HLMC in July of last year. We’re also in detailed discussion with all of our remaining customer and several additional major semiconductor player, who are considering TEBO for a range of their advanced cleaning requirements. Our proximity to large customer in China and the rest of Asia put us in a great position to anticipate the newest technical manufacturing and even environmental requirements at some of the most advanced fabs on the planet. We estimate that our SAPS and TEBO platform address approximately 1/3 of the $3 billion to $4 billion semiconductor wafer cleaning market. At the request of our customer, we have began additional R&D projects, a new cleaning product to expand our market beyond 1/3 already served. We believe this new product will contribute to our revenue as early as 2019 and we’re looking forward to providing update on our progress. Before I turn it over to Lisa, I want to provide some detail on our production capacity. I am happy to report we have completed the first phase of our capacity expansion project in a new leased building about 20 minutes driving from our Shanghai, China headquarter. We have invested US$1.5 million over the past two quarter for [indiscernible] the new space, which now has a total of 50,000 square feet of available floor space. This represent capacity to supporting incremental 250 millions of annual production when fully loaded. We expect to begin initial production in the current quarter with a steady ramping the quarter ahead. In addition to our original factory in Zhangjiang Hi-Tech Park, we now have a total of 86,00 square feet of floor space, which could support more than 350 million of annual production. I will now turn the call over to Lisa to discuss our financial results.