David Wang
Analyst · Roth Capital
Thanks, Gary, and thanks, everyone, for joining us on the call today. We came into 2018 with a significant business momentum, and that momentum carried through the first quarter. We executed against key initiatives across our business, delivering solid results. The revenue of $9.7 million was in line with our internal forecast, and we remain confident that we will achieve our revenue target this year. Visibility remained quite high based on the volume of the equipment orders received. Lisa will go over the details of our financial results shortly.
Let's now turn our attention to potential highlights, operational highlights. Our [indiscernible] this quarter is R&D because our success is really driven by innovation. We're still a small company, so we can only win by having the most technologically advanced tools at a reasonable cost. We want to offer the best performance, best value proposition, and best service level to our customers.
We do this through technical leadership, a function of our investment in R&D. The latest product our innovation pipeline is SAPS III wafer cleaning tool. SAPS III is a natural expansion of the SAPS-based product line. Each model is a single-wide wafer, a [ serious ] processing cleaning tool that can be configured to customer specs.
We offer SAPS II with 8 chamber and launched SAPS V with 12 chamber. The SAPS III is also a 8-chamber tool, with higher throughput but 40% footprint reduction. SAPS III is aimed to [indiscernible] existing [indiscernible] that want to upgrade to more of advanced [indiscernible], and need more cleaning process steps but have limited cleaning room space.
The exciting news is that a total of 4 SAPS tools are now being used in mass production at one of our key customers [indiscernible] business with a [indiscernible] referenced site operating with no problem. We expect SAPS III to help drive growth in our SAPS product line.
Another development that assures our commitment to innovation is R&D center we just opened in [indiscernible] and a serviceable center in Icheon, Korea. Korea is a major market for us, with both key customers and good prospects. Additionally, Korea has a abundance of [indiscernible] engineers, with strong technical skills and meaningful industrial experience. This new R&D facility enables us to strengthen our R&D capability and build our engineering [indiscernible] in the region. We can better recruit local talent, support our customers, and performing new and R&D programs. Equally important is that new service support center positions us near potential customer in Korea, strengthening all our ability to win new customers in the region.
In general, I want to emphasize that our success is highly dependent on our ability to develop and deliver innovative technology and meet our customers' challenging technical requirement. For this reason, we devote a great deal of financial and personal resource to R&D. Our R&D team is comprised of highly skilled engineers and technologists with expansive [indiscernible] experience in megasonic cleaning technology, cleaning process, and chemistry.
Innovation through R&D is our strength. We will continue invest heavily in R&D in order to strengthen our compatible positions. We will provide the most efficient cleaning solutions for flat wafers and [indiscernible] cleaning solution for advanced 3D patent wafers.
In addition to R&D, manufacturer is our strength and we are growing our commitment to being [indiscernible] manufacturers. Earlier this year, we announced that we're expanding our Shanghai manufacture facility. The expansion will include additional [indiscernible] space for product assemble and final testing. We are pleased with the progress. We are on schedule with the expansion, which is expected to be completed by the end of Q2 this year. Because we are optimistic about our opportunity in China, we believe expanding China makes strategic sense. Our decision to put production in close proximity to [indiscernible] a new Asia [indiscernible] should yield new customer and exciting growth for years to come.
With new passing quarter, we are advancing toward our goal of becoming a global leader in advanced wafer-cleaning equipment. Let me spend a couple minutes reviewing some of the key strategics we are pursuing in order to achieve this goal. First, we intend building upon our leadership [indiscernible] leadership in [indiscernible] wafer cleaning. We continue to refine our [indiscernible] SAPS and TEBO technologies. Our focus is to address the multitude of cleaning challenges, and [ in counting ] during the chip fabrication process.
SAPS stand for Space Alternated Phase Shift. TEBO stands for Timely Energized Bubble Oscillation. SAPS technology provides uniform megasonic energy distribution across the entire wafer, giving the best particle removing efficiency. TEBO controls how energy is applied to the bubbles in the megasonic cleaning process by better controlling energy input into the bubble or gas temperature. TEBO reduce the chance that a cavitation would damage the 3D structure on their patent wafer. With better control comes greater cleaning efficiency, which improves yield.
As I discussed earlier, we will continue to invest in product development and to strengthening our global patent portfolio in strategic jurisdictions, including U.S., China, Japan, Korea, Singapore, and Taiwan. Second, we are establishing a referenceable customer base, historically in commercializing our SAPS tool. We have placed evaluating equipment with select customer. They would then purchasing additional tools, enabling them to add more cleaning steps to the manufacturing process.
Similarly, we are using what we call [indiscernible] process for our TEBO product line. We have placed TEBO evaluation equipment with leading foundry and memory customers. We have recognized revenue from the initial sale of TEBO [indiscernible] equipment. The development of our staff and TEBO equipment has selected leading manufacturer industrial services to key [ propose ]. First, it validates our technology and equipment, and 2, it represents solid references and facilitate a short evaluation process for other manufacturers.
Third, we continue to leverage our local presence to capture China opportunity. China is both the largest and a fast-growing market for semiconductors in next 3 years. 42% new SAPS were built in China. The market for semiconductor manufacturing equipment in China is expected growing hopefully in the next few years. Chief manufacturing in China require equipment that meets their specific technical requirements and prefer building relationship with local suppliers.
We established our operation in Shanghai in 2006 and will continue to work closely with the chief manufacturer in China and throughout Asia to understand that their specific requirements [indiscernible] them to adapt our technologists and enable us to design high-quality products and the solutions to address their needs. We're committed to invest in sales, marketing and service support to expanding our customer base, both in Asia and the U.S., which will sustain our growing momentum for years to come.
Finally, we actively manage our business throughout operational [ excellencies ]. We want to ensure continuous improvement of our key operational and financial matrix. We remain committed to our key initiatives in order to improving operational efficiency, meet our customer needs, and attain our financial goals.
Before I turn the call over to Lisa I would like to once again thank the entire ACM team for their hard work, passion and dedication. We intend to be global leader in our targeted segment of semiconductor manufacturing equipment space. We are optimistic about the outlook, and looking forward to further building upon our success in the quarter and the years ahead.
With that, I will now turn the call over to Lisa to discuss our 2018 financial results. Lisa, please.