Tom Lacey
Analyst · Craig-Hallum
Don, thank you very much. Whether live or via the webcast recording, thank you for joining us on the call today. Robert and I are very pleased to provide an update on our third quarter 2015 results, as we head into the home stretch and the final corner of the year. We will provide an update on our key growth initiatives, our Q4 guidance and 2016 recurring revenue base line as its stands today. During our next earnings call we look forward to providing you more details on 2016 as we are currently preparing for our annual planning session with our Board of Directors schedule later this quarter. As you will again here today we remain very positive on the developments of the company and we are optimistic about our future. Due to the continued excellent contributions of many of our employees and contributions of our customers Q3 is another excellent quarter on multiple fronts, as there were several important developments during the quarter, including -- we again exceeded expectations on virtually all financial metrics and delivered our seventh consecutive profitable quarter on both a GAAP and non-GAAP basis. Our financial management continues to be strong. As Robert will detail we significantly exceeded earnings per share forecast in part due to higher revenue, lower litigation expense and because of the reduced share count as a result of our buyback activities during the quarter. Our operating margin on a non-GAAP basis was an outstanding 71% for the quarter. The company is operating well. Our recurring revenue grew 40% in Q3 ’15 versus Q3 ’14. Our capital allocation program continues as announced. During the quarter, we paid our new quarterly dividends of $0.20 per share for the third time. Recall the previous dividend was $0.10 a share. Also, during the quarter, we bought back almost 1.2 million shares of our stock at an average cost of $33.62 per share for a total cost of approximately $40 million. The $40 million represent a record amount spend in any quarter in the company's history for buybacks. Our investments in R&D and technical collaborations with our customers progressed well throughout the quarter and continue to bode well for our future growth. During the quarter there was a positive development and our outstanding UTAC contract legal matter which I'll describe momentarily. Lastly, during the quarter we formally welcome the Ziptronix team to Tessera. Given we have place to great deal of focus on ensuring a smooth and rock solid integration of the Ziptronix employees, products, customers and capabilities I'm very pleased with the progress thus far on the internal integration and with the interest level from current and perspective customers. We are off to an excellent start and continue to have high expectations from this foundation or important 3D IC di-stacking [ph] technology. Moving to the business details let me provide an update on our primary organic or home grown growth initiatives. Which include our semiconductor packaging technology FotoNation emerging products and DRAM and non-DRAM new customer pattern licensing opportunities which we've virtue as our green field initiative. I will discuss each growth area. Let me begin with semiconductor packaging with a special call out to our newest edition, the Ziptronix team and technology. On the Invensas semiconductor packaging front we are making good progress on our commercialization efforts with leading customers on both our xFD and BVA platforms. We are also very excited about our latest edition of Ziptronix foundational inventions in the 3D IC di-stacking area. As previously mentioned we see such technical engagements as a priority for the organization and an important element of our strategy to successfully developed and commercialize our expanding portfolio of semiconductor packaging and interconnect technologies. Again regarding our newest edition the integration of Ziptronix has gone very smoothly to date. As we mentioned after the acquisition was announced we see ZiBond and DBI low temperature bonding as enabling technologies for 3D stacking. The technology has already been licensed to Sony in the image center space but it also has significant benefits for stack memory, MEMS, RF and logic applications. We've successfully transitioned the Ziptronix and technology teams in the Tessera and they are now actively working as one team to drive the technology development programs and key customer engagements that will allow us to demonstrate this capability and value to our customers so that they can integrate ZiBond and DBI technologies into their factories. We recently announced the collaboration with the Fraunhofer institute that will allow us to demonstrate DBI capability on their 300 millimeter line and we are engaged in early stage discussions with several key customers. As we mentioned after the acquisition we see Ziptronix technology as a multi $100 million revenue pathway over the next decade. We're very pleased with the integration, the way the integration has progressed, the talent of the team the positive customer feedback we have received and we are just thrilled to have Ziptronix as part of the Tessera family. Regarding BVA, we have been developing these technology as a versatile vertical interconnect platform with our first targeted application being a high density package-on-package or PoP solution primarily for smartphones and tablets. This technology enables higher bandwidth between processor and memory and smaller physical size by utilizing existing and readily available wire bonding manufacturing equipment. Our BVA technology qualification efforts with one of the four leading OSATs is progressing well. Their qualification lot builds look very good and initial reliability results are on track for Q4 of this year. We believe that successful qualification will provide a springboard for customer engagement and evaluations in 2016. In addition efforts to apply BVA to new applications such as MEMS and system-in-package continue to make headway and resulted in the signing of our first commercial BVA license agreement with [indiscernible], a mid-sized Taiwanese provider of microelectronics packaging and substrate manufacturing services for applications including wireless communication, MEMS and image sensors. We built the strong collaborative relationship with [indiscernible] and are excited about the prospects of continuing to work together to apply our BVA vertical interconnect technology to a wide array of new applications. Switching to xFD, after completing our internal build of functional DDR4 SRAM test units last quarter we've not built functional modules, verified basic functionality and performance at the module level and have subsequently delivered them to our customer for system level tests. Results are expected in the coming weeks and if they meet or exceed our customers' requirements we expect to see first commercial products with xFD technology available in the market in 2016. Although this is later than we had hoped for the beginning of the year we believe this will represent a significant inflection point for the xFD platform. On to our Greenfield engagements, I mentioned in our last call that the process to license a new customer it could take 12 months to 24 months to complete and the process involved is complex on both the Tessera and customer side. We continue to make good progress in moving these discussions forward. In our Q2 conference call I mentioned that two of our Greenfield customers were in the process of performing their own analysis of the portfolio. We currently expect that at least of these customers will complete their analysis this quarter and we’ll move to the next phase of our discussion. We also recently closed the new portfolio license agreement with Socionext in Japan. Socionext is a joint venture established in March 2015 between Fuzitsu, Panasonic and the Development Bank of Japan and integrate Fuzitsu and Panasonic's LSI businesses. The agreement will allow Socionext to manufacture the products and grow their business under a TCC license agreement and their decision to sign a license with Tessera reflects the continuing strength of our portfolio and the value it brings to our customers. We look forward to a long and productive relationship. As I mentioned earlier Socionext is already a FotoNation customer. Speaking of FotoNation let me provide an update on related activities during the quarter. FotoNation delivered another solid quarter just shy of a record. Gauging by current and potential customer interest from a variety of vertical markets such as sports cameras, drones, automobile, surveillance products, smartphones, citizen identification and the like we continue to believe we’re well positioned with the employee’s products intellectual property, that remains bullish on our growth prospects. Providing a bit more detail our leadership with FacePower continues and this is now growing into a more general purpose object detection stage with human body being the first objective interest for the computer vision used cases. Our ability to produce a market leading solution for video stabilization has also gain traction riding on our low power low latency and high performance mantra in video application markets for real-time videography and decision making as require. The mobile business continues to be the main study for FotoNation and where we expect the most opportunities for now. We continue to have substantial efforts towards continuing to grow our business by expanding the number of customers with whom we partner. During the quarter we announced an important design win with Huawei, where product shipments and associated royalties have commenced. Similarly, we won an important design win for life, focused fast focused technology for a flagship phone for one of the top smartphone providers based in Asia. We continue to pursue SoC design wins where by our RTO code is embedded on leading SoC chips. During the quarter we made solid progress on one such import silicon provider where we recently announced the design win in partnership with Socionext. Via continued customer and ecosystem interactions we continue to believe that biometric technology will continue to be an important capability for computer and handheld wireless devices. Authentication technologies will be an important part of overall identity theft reduction on computers and wireless devices. As such our face authentication developed from our leading face detection technology and IP and a recently Iris biometric authentication technologies continues to be a strategic growth opportunity area for FotoNation. Just last week we produced our first form factor demo that incorporate face and Iris authentication into a smartphone. We believe this proof of concept demonstration is an important and significant step in ultimately securing subsinet [ph] of design wins. Overall authentication market is huge and growing and competitive and the fact we have a lengthy heritage strong IP and now have form factor demonstration capability in this space gives us reason to be optimistic about our ultimate success. Our automotive efforts although longer from the time to market perspective than smartphones continues to make solid progress as we work to secure commitments from leading Tier 1 systems providers. These Tier 1 customers would be our go-to-market partners. Lastly, under the direction of our new CTO, Steve Teig, we have substantially increased our focus on machine learning and neural network technology. We expect this technology to ultimately make substantial additions to our capabilities that currently part of our FotoNation technology in addition to other significant market opportunities. Next I would like to talk briefly about our inorganic growth opportunities specifically M&A. given the strength of our management team which exuding very well, our balance sheet continued strong profitability, we continue to explore M&A opportunities. These opportunities include a wide variety range of options, including smaller tuck-in acquisitions, like we did in the fourth quarter of 2014, with smart sensors and iris biometrics company to moderate size transactions like we just did with Ziptronix to larger transformative opportunities and sizes in between. We continue to look at options versus overall strategic vision for the company, Robert, the Board and I all share exactly the same philosophy regarding M&A. We have a very discerning approach to acquisitions with an eye towards shareholder value creation. We are very through and the vast majority of opportunities, we look at don’t pass our criteria. This is an area where patience is simply a virtue. And I am pleased with both the overall activity and the quality of opportunities we are exploring. In summary, although my staff can attest although I want things faster and cheaper and better, given the complexity of a number of our initiatives, I am pleased with the overall progress on our growth initiatives. Our internal R&D efforts, our Invensas semiconductor packaging, our new Ziptronix initiatives and our FotoNation imaging technologies continue to make solid progress as we work together with our customers and partners. Similarly, I am pleased with the volume and quality of M&A options. Before turning the call over to Robert I’ll provide brief update on our outstanding litigation matters. As those of you who have followed Tessera know, we have successfully settled almost all of our outstanding litigation over the past two plus years. As I have said before we continue to view litigation as a last resort, but sometimes litigation is necessary to protect our rights and ensure that our stockholders receive a fair return on our valuable inventions and intellectual property. In the UTAC Taiwan, breach of contract case, the court has scheduled the trial to begin in February 2016. In October, just last month the court denied UTAC’s motion for partial summary judgment which sought to limit the geographic scope of a licenses agreement. The court ruled that agreement in fact covers both U.S. and foreign patterns and that any royalty should be calculated on a worldwide basis. We view this ruling as very positive development in the case; obviously there remain variety of factors that could change in the case including a number of matters that are currently under consideration by the court. We remain confident, our position in this case. With respect to the Toshiba breach of contract case, the case is still in the early stages. The first case management conference with the court was held in October. The court set a trail day for June 2017, with an initial summary judgment hearing in September 2016. The remainder of the case schedule be determine by stipulation of the parties, we will now proceed to the discovery phase of the case. One last matter, in connection with our acquisition of the Ziptronix, we inherited a litigation matter that was already pending at the time of the acquisition between Ziptronix on the one hand and TSMC and Omnivision technologies or OVT on the other. Ziptronix filed this case in December 2010 in federal court in the urban district of California, alleging at TSMC and OVT infringed nine of Ziptronix zibond patterns. TSMC also asserted counterclaims alleging that Ziptronix in fringes certain TSMC patterns. There is no trial date set in the case, the party have been engaging in mediation discussion before the acquisition and after and are planning to continue do engage in such discussions. As we have demonstrated numerous time over the past two years, our intent is to reach a settlement that enable a closer technical working relationship and collaboration between the companies. I’ll now -- turn the call over to Robert who will address our excellent Q3 financials and financial matters. Robert?