Tom Lacey
Analyst · Gary Mobley from Benchmark
Hey, Don. Thank you. Whether live or via the webcast recording, thank you for joining us on the call today. Robert and I are very pleased to provide an update on our second quarter 2015 results, a midyear update on our key growth initiatives as well as our guidance for the third quarter of 2015. As you will hear today, we remain very positive on the developments at the company and we are optimistic about our future. Q2 is another excellent quarter on multiple fronts, as there were several important developments during the quarter, including, we again exceeded expectations on virtually all financial metrics and delivered our sixth consecutive profitable quarter on both a GAAP and non-GAAP basis. Our financial management continues to be strong. A mantra inside the company if it’s truly becoming part of our culture is spend every dollar as if it’s your own and it’s working. All facets of the company are focused on ROI consideration. Our operating margin on a non-GAAP basis was a healthy 64% for the quarter. Our recurring revenue grew 77% in Q2 2015 versus Q2 2014. Our capital allocation program continues as announced. During the quarter, we paid our new quarterly dividends of $0.20 a share for the second time. Recall the previous dividend was $0.10 a share. Also, during the quarter, we bought back 645,000 shares of our stock at an average cost of $38.73 per share and total cost of approximately $25 million. Our investments in R&D and technical collaboration with our customers progressed well throughout the quarter and continue to bode well for our future growth. Worth noting, during the quarter, we formed the Tessera Advisory Board and recruited our first two members, one with deep knowledge of the imaging markets and one with extensive experience in the semiconductor packaging technologies. In fact, our first TAB, Tessera Advisory Board member is Tom DiStefano. Those of you who are knowledgeable of Tessera’s long history will recall Tom was one of the founders of Tessera. We are thrilled to again have Tom as part of team Tessera. We plan to add additional TAB members in the coming quarters that will provide further industry, commercial and technical experience. Let me provide a Q2 and mid-year progress report on our primary internal, organic or homegrown growth initiatives, which are FotoNation imaging products, semiconductor packaging conventions, including BBA and xFD and DRAM and non-DRAM new customer patent licensing opportunities, which we refer to as Greenfield opportunities. I will discuss each starting with FotoNation in the specific areas of mobile, biometrics and automotive. Our FotoNation initiatives continue to progress. FotoNation followed its best quarter ever in Q1 with another strong quarter in Q2 ending at almost the same revenue level. This trend should continue in the rest of the year as FotoNation remains well poised to achieve $100 million in annual revenue in the next several years. The mobile business continues to be the main state of activity where we expect the most opportunities for now. China continues to play an important role in the strategy, with continued design wins, with existing product portfolio, which we see continuing. We are strategically working with some key accounts we work on roadmap and flagship products. Over the past several months, we have signed agreements with TCL ALCATEL, ZTV and a few others we cannot name. In some cases, shipments commenced during the current quarter, others expected to commence shipments during the second half of this year. Product shipments will be in China, Europe, Africa and the Americas. Via continued an ecosystem interactions, we continue to believe that biometric technology will continue to be an important capability for computer and handheld wireless devices. Authentication technologies will be an important part of overall identity theft reduction on computers and wireless devices. As such, our face authentication developed from our leading face detection technology and property and our recently acquired Iris biometric authentication technology continues to be a strategic growth opportunity area for FotoNation. Specifically, with respect to our Iris authentication technology, we continue to invest in this technology and the team has made progress since the acquisition of SSL 7 months ago. We have integrated the technology and working towards our proof-of-concept demo in a form foreign factor, and the roadshow was getting planned for the second half of the year, leading to targeted designs with OEMs. Overall, authentication market is huge and growing. Our competitive in the fact that we have a lengthy heritage and IT in this space gives us reason to be optimistic of our ultimate success. Our automotive effort continues to make solid progress. During the quarter, we completed putting efforts into the industry leading SoCs and have completed two road shows in Asia and Europe, with key target OEMs with ecosystem partners from sensor companies, SoC companies and selected Tier 1 vendors. Lastly, the underlying architecture is being well received. Our new architecture IPU, which stands for Image Processing Unit, which was introduced to customers in a roadshow in Q1, has seen excellent traction. We have already signed up for two future SoCs, that will carry IPU from [Technical Difficulty] and in 2017 flagship products with computer vision and computational photography as key differentiators in both cases. Our leadership with FacePower continues and this is now growing into a more general purpose object detection stage with human body being the first object of interest for the computer vision used cases. Our ability to produce some market leading solution for video stabilization has also gained traction, riding on our low power, low latency performance mantra in video applications like mobile sports cameras, drones, home robots, wearables and other markets, where real-time videography decision-making is required. Now, for a brief update on our semiconductor packaging growth initiatives, customer collaboration continues to bear fruit. At Tessera, we are focused on understanding the key technical issues and challenges facing the electronics industry and subsequently developing production solutions and increasingly collaboratively with our customers. Establishing such tactical engagements is the priority for us and we made significant progress this year. Today, our investors’ team is actively engaged with multiple leading memory manufacturers on our xFD technology and one of the four leading OSATs in the high-volume qualification of our BVA technology for package-on-package application processors. We also have qualified our BVA platform at multiple midsized OEMs, one of which is qualifying BVA interconnect for MEMS applications, another that is evaluating BVA technology for system-in-package applications, a very exciting time for us. Given the size of the opportunity, I would like to spend a few minutes expanding on the status of our BVA technology platform. As we have communicated previously, we have been developing this technology as a vertical interconnect platform with our first targeted application being a high density package [Technical Difficulty] pump solution, primarily for smartphones and tablets. This technology enables higher bandwidth between processor and memory and smaller physical size, while utilizing existing and readily available wire bonding manufacturing equipment. Over just the last quarter, we have made significant progress working with our key partner, including completing a technology transfer and supporting an initial production evaluation. Assuming success of this collaboration, reliability results [Technical Difficulty] towards the end of this year and present an opportunity to shortly thereafter engage in end customers for functional product evaluations and qualifications. Once BBA technology is available in the market from a high volume manufacturer, we are confident that this platform provides us significant opportunity to bring value to our customers and our customers’ customers improving the performance of their ultimate products. That is, of course, in addition to growing the company’s revenue base. And many adopters of PoP solutions today, our application processor and baseband processor manufacturers, companies like Qualcomm, MediaTek, Apple, Samsung, HiSilicon, etcetera, whose processors are used in smartphones, tablets and a plethora of other end products. According to Prismark, the PoP market is forecasted to grow from around 720 million units in 2013 to over 1.2 billion units in 2018. Should the BVA platform secured 80% of the PoP market it could provide an annual revenue stream in the low double-digit millions of dollars for the company. In parallel and with certain other manufacturing partners, we are investigating additional opportunities for the BVA platform growth segments, growth markets, such as system-in-package and MEMS, which could increase the magnitude of the revenue potential for this platform even further. Our xFD technology continues to progress as well. During the quarter, first functional test units using a customers’ advanced DDR, SDRAM die – DDR4, sorry, SDRAM die, we view this as an important step towards the ultimate goal of achieving volume product shipments by late this year or in Q1 of 2016. In addition, we continue to have good dialogue on potential technical collaboration and license discussions with remaining approximately 8% of the DRAM industry. Turning to our Greenfield opportunities, which we define as customers that we have not historically licensed, I remain pleased with the progress we are making and are engaged with industry leaders in the semiconductor and mobile segments to introduce our new packaging and imaging technologies. In addition to Greenfield opportunities that we are discussing potential technology engagements with, we have also been working with several customers to close new [Technical Difficulty] licenses. As we have explained in the past, Tessera has been an innovation leader for over 25 years and we have a broad patent portfolio in multiple technology areas, including semiconductor packaging memory, semiconductor circuitry and process, and imaging. I thought it would be helpful to provide an overview of our process generally. Our process to close a new license agreement can often take 12 to 24 months to complete. This process involves closing initial engagement agreements, presenting relevant assets to customers’ licensing groups allowing our customers to carry out their own analysis and ask questions, agreeing to business terms and then moving to close the final licensing agreement. While I am not able to provide you details of our discussions with specific customers due to the confidentiality restrictions, we have been making steady progress with several customers and are now at a point with two potential licensees where we have completed presenting the portfolio and they are in the middle of their own analysis. We are working with them to help this process and are looking forward to moving to contract discussions in the latter part of the year. Next, I would like to talk briefly about our inorganic growth opportunities, specifically, M&A. Given the strength of our management team, which is executing very well, our balance sheet continued strong profitability. We continue to explore M&A opportunities. These opportunities include a wide variety range of options, including smaller tuck-in acquisitions, like we did in the fourth quarter with smart sensors [Technical Difficulty] biometrics company to larger transformational opportunities and sizes in between. We continue to look at options versus overall strategic vision for the company. Robert, Board and I all share the same philosophy regarding M&A. We have a very discerning approach to acquisitions. We are very thrilled and the vast majority of opportunities, we look at don’t pass our criteria. This is an area where patience is simply a virtue. I am pleased to report the overall activity and quality of the opportunities we are exploring. In summary, I am pleased with our overall progress on our growth initiatives. Our internal R&D efforts, both on our Invensas semiconductor packaging and circuitry initiatives and our FotoNation Imaging Technologies continue to progress well against our internal targets, developed in conjunction with our customer. Similarly and I am pleased with the volume and quality of M&A options. We have a very thorough and disciplined approach to M&A as I mentioned before. Next, I want to provide a brief update on our outstanding litigation matters. As those of you who have followed Tessera know, we have successfully settled almost all of our outstanding litigation over the past two plus years. We currently have no outstanding patent litigation and we have only two active litigation matters, both of which are breach of contract cases. As I have stated before, we continue to do litigation as a last resort, but sometimes litigation is necessary to protect our rights and ensure that our stockholders receive a fair return on our valuable inventions in intellectual property. Turning to our open matters, in the UTAC Taiwan case, we are starting to see the light at the end of the tunnel. Summary judgment notions are scheduled to be heard in September and after that we will start getting ready for trial. The court has scheduled the trial to begin in February 2016. We remain confident in our position in this case. Obviously, there are a variety of factors that could change in the case including the number of matters that are currently under consideration by the court. Due to confidentially obligations, we can’t disclose, at this time, the specific amount of damages that we will be seeking at the trial. Assuming the case is ultimately resolved in our favor, however, I can’t give you a rough sense of magnitude by telling you that UTAC Taiwan was not a significant customer of ours and this case is not of the same order of magnitude as our Amkor settlement, for example. Our only other active litigation matter is with Toshiba. As you know, we filed a breach of contract case against Toshiba in the state court in May of this year. The case is just getting started and there is no case scheduled yet. The first case management – the first case management conference with the court is not scheduled until October. Toshiba has been in the news due to financial matters and executive and board resignations and we are examining what this might mean to us with respect to our matter. As a reminder, Tessera Inc. entered into a license agreement with Toshiba in 1999. Our lawsuit alleges that Toshiba has failed to pay royalties both under the party’s license agreement, including unpaid amounts that have been outstanding for years. We also believe that Toshiba failed to cooperate with audits that were authorized by the agreement. As we have previously indicated, we take the decision to initiate our lawsuit very seriously and generally try to exhaust other avenues to resolve a dispute before initiating a lawsuit. Given our longstanding relationship with Toshiba, we attempted to resolve this dispute for several years in a way that would be mutually acceptable to both parties. Unfortunately, we were not able to reach a settlement and had to file this case. In terms of the potential magnitude of the case, confidentiality obligations, restrict us from disclosing the exact amount that Toshiba was paying with the amounts that we found to owe in the audit. However, what I can’t tell you is that until we stop paying in 2013, Toshiba was a more significant customer of ours in UTAC, Taiwan. With that said, Toshiba’s payments never amounted to more than 10% of our annual revenue in any given year, so that should give you a rough sense of the magnitude. As always, we remain open to having discussions with Toshiba and UTAC Taiwan about resolving these matters on fair terms and we will continue to explore avenues to settle with both of them as these cases move forward. I will now turn the call over to Robert who will address our excellent Q2 financials and Q3 guidance. Robert?