Russell Ellwanger
Analyst · Drexel Hamilton. Please go ahead
Thank you, Noit, and thank you all for joining us today. 2017 was another rather significant year for the company with palpable high-performance across all industries further cementing our position as the global specialty foundry leader for providing us with the strongest financial position in the history of the company. We presented another year of record revenues at $1.39 billion representing year-over-year growth of 11% excluding the Panasonic and Maxim's contracts which are committed and stable, 2017 annual revenues represent year-over-year business unit based organic growth of 23% We also recorded our highest ever EBITDA of over $425 million and a record net profit of $298 million. Our operating margins continue to increase in 2017, reported 15.8% operating margin and 30.0% margin a 130 basis point increase over that of 2016 respectively. This was the result of utilization and optimization of product portfolio mix for which we expect further improvements in 2018. Our balance sheet is strong approaching $0.6 billion in deposits and short-term cash investments having been built throughout 2017 by a company record free cash flow. Oren will cover our financials for the year and for the quarter in great detail in a few minutes. Our 2017 performance is evidence of the strength of TowerJazz's business model in growing both organically as well as our ability to identify and pursue opportunities on an ongoing basis for company expansion and growth. Our success is based upon providing our customers best-in-class specialty technology offerings providing the right platform to support them within the trends that are now driving the world namely energy efficiency and seamless connectivity and sensors as the foundation of smart systems. We continue to increase our competitive advantage both existing and new markets by being responsive to the present and future need for diversified customer base. In 2008, our focus will remain on our high-end businesses and hence to enhance value across all of our manufacturing facilities. We begin the year with typical first quarter seasonality, our mid-range guidance being $325 million plus or minus 5% with customer forecast showing growth throughout the year with a very strong second half. In particular, this year we look forward to wrapping our 300 millimeter factory and in Uozu, Japan; please allow me to explain it in some more detail. Our business model, when we acquired majority ownership of the Panasonic semiconductor fabs and later full ownership of Maxim's, San Antonio fab provided us with a long lead runway during which fixed costs were being covered enabling us time to both transfer and in some cases with some further developments on our flows and for our customers to qualify there end customers on these flows. This process is a 2.5 to 3 year period to reach volume production as was evidenced in our large capacity fab five in Tonami, Japan which ramped almost full utilization in 2017. At the time of the Panasonic conductor fab acquisition we identified value in having a 300 millimeter factory with 65 nanometer capabilities in order to further enhance certain of our analog offerings. Hence, we are excited to acquire the 300 millimeter Uozu factory as part of this transaction, but these 300 millimeter platforms needed a full development from scratch, in all cases creating new product applications and in most cases attracting new customers who were not previously part of our customer base. These 300 millimeter activities are ramping now in 2018. The three main areas where we have used 65 nanometer capabilities to further add to our state-of-the-art platform, our CMOS image sensors, RF and power management mixed-signal. For CMOS image sensor we use the 300 millimeter 65 nanometer capability to develop unique high dynamic range and extremely high sensitivity pixels with very low dark current for the high-end digital SLR and cinematography and broadcasting markets. In these developments, we've included are fab 2 stitching technology to enable large full frame sensors. In addition, we developed a unique family of global shutter state-of-the-art pixels ranging from 3.6 micron down to 2.5 micron to note the smallest in the world with extremely high-shutter efficiency using the unique dual light pipe technology already developed at TPS Go for high quantum efficiency and high image uniformity. And lastly within the CIS regime, we've pushed the limits of our x-ray dye size developing a one dye per wafer x-ray stitch sensor to produce a 300 millimeter a 21 cm x 21 cm imager. All of the above technologies have been or are being implemented in our CAS customers next generation products and are ramping or are plan to begin ramping this year with some additional next year. Looking at RF, we are offering RF SOI technology in our 300 millimeter factory. The technology makes use of unique capability of the 65 nanometer to deliver one of the industry best or on CAS figures of merit for RF switches to be below 100 femto second together with high performance low-noise amplifiers, the combination of switch in L&A at our performance levels, we believe to be otherwise unmatched by any other provider in the industry combining high-performance L&A switch is becoming increasingly important in new smartphone architectures. For mixed-signal and power management, during 2017, we announced the availability of the five-fold CMOS and low-voltage power 65 nanometer 300 millimeter process providing customers with multiple advantage over present industry five volt offerings including lower RDS on tighter analog design rules as well as very dense digital capabilities combining about a 30% aerial reduction for customer benefit while as well lowering the manufacturing mass count. This is an important segment and to have a competitive advantage here is significant. According to market reports such as Your Development, the low-voltage power IC market is estimated to be almost 50% of the overall power management market. The five volt 65 nanometer technology addresses multiple applications such as LED lighting analog switch DC/DC converter and load switch across consumer industrial and automotive market and is presently being used by our customers to give them strong competitive advantage in large market such as LED drivers and fingerprint ICs. We are also expanding our 300 millimeter power management offering to include up to 16 volt operation with best-in-class RDS on and other combined parameters with also the very high logic density of 65 nanometer at a low mass count. This platform will enable our customers reduce the dye size by 20% to 50% versus 0.18 micron platforms and will best match the needs of a wide variety of applications across many market segments. We have strong customer pool for this offering presently for applications such as MEMS, battery protection, Class D amplifier and load switches and we see it as a high-growth driver beginning the second half of this year 2018. I would like to spend a few minutes talking about our current utilization as well as plans for expanding our capacity which will enable us to continue to deliver growth for the coming years. In terms of the utilization rates Fab 1 our 6-inch factory Migdal Haemek, was at 93% utilization above our 85% design utilization model, again a statement about the longevity of our analog asset re-use business model. Fab 2 our 8-inch factory which is also Migdal Haemek, Israel was at its target 85% utilization. At Migdal Haemek, we are increasing our monthly capacity by 6,000 wafers per month for certain IBM customers; these are specific customers with long-term contracts with us. These customer flows are mainly discrete that require more and longer firm cycles and different CMP steps in the imaging RF and power flows. Fab 3 at Newport Beach California, our 8-inch factory was operating at 76% utilization during the quarter, refreshing the line to enable the transition and capacity increases to substantially higher volumes of high-end Silicon Germanium flows. We invested in 2017 for tooling that is coming online now; we expect to nearly double the advanced SiGe capacity by the second half of this year. And as I mentioned in the minute, we are also adding silicon germanium capacity to our San Antonio facility .Our SiGe flows are highly differentiated adding substantial value to our customers and as such are among our higher margin offering. Thus, as we increase our capacity in this realm, we will lead to increases in overall margins. The 3 TPS factories in Japan had a weighted average of approximately 60% utilization with the 15 point increase in our 8 inch third party foundry business. I do note that the 12 inch factory is still at low utilization level which allows us substantial open capacity to be targeted as I explained throughout this year and through 2019 and continue into the 2020s. And finally fab 9, our San Antonio factory was at about 55% utilization. We've recently installed several new tools to start providing some SIGI capabilities in San Antonio which in addition to the current flows will bring the SIGI capacity from 0 to 2,000 wafers per month in San Antonio by the end of this year. Furthermore, in San Antonio we are in the very good position of being able to trigger organic capacity expansion whenever we wish with the potential of adding a further 12,000 to 14,000 wafers per month. We are currently working on a large two deal to substantially decrease the cost per thousand wafers per month capacity increase, and we will update when we have further detail. Looking at China, for our standard foundry business, China is a highest growth region having grown by about 86% versus last year with continued strong growth forecast. We have over 20 active customers being served with activities from all of our business units, as well as many more Chinese customers in the funnel. Growth in China has both tactical and strategic importance to us. Considering the government backs semiconductor initiatives, and the Chinese stated goal to develop a complete a semiconductor infrastructure to serve the growing need of IC manufacturing and IC integration, we view it as strategically important to take part in this build out. Therefore, we have been and continue to be active in exploring multiple opportunities to expand our presence there. With respect to Takoma, another avenue for capacity growth in the company, the partnership in China that we announced in Q3, 2017 to the establishment of 8 inch facility Nanjing, I intended a roof ceiling ceremony to celebrate building completion, co-hosted by [Takoma] and Nanjing economic technology development zone this past month. The project is progressing well. We've agreed on terms for licensing and technologies, subject to payment milestones and deliverable and are working to finalize the terms of support services and structure. The full funding of this project is also in progress supported by the local government. We look forward to utilizing the capacity of the Nanjing fab to meet our customer demand and winning opportunities to fulfill our allocation of 50% of the fab capacity and as well for the strengthening our geographic presences in the China region. Moving onto our business units. I'd like now to discuss end markets that are served within each of main business unit, provide color to the 2017 annual revenue and year-over-year growth for each of the major groups. We divide our revenues in to four groupings. RF, Power management, CMOS image sensors and lastly a grouping of mix signal and others. In 2017, as we had forecasted we experienced organic revenue growth in all business units of over 25% except for RF which grew approximately 10% yielding for the company a 23% year-over-year organic growth. I'll now provide a summary of main activities per business group. In 2017, our RF group including mobile and infrastructure represented 29% of corporate revenues, approximately $400 million. Mobile represents about 21% of the revenues while infrastructure was at about 8%. Of this silicon germanium offerings for infrastructure and some high end mobile applications grew 22% year-over-year. We continue to invest in technology to address the next generation of connected and smart devices. During 2017, we launched H5, a leading silicon germanium technology that is now part of TowerJazz's silicon germanium terabyte platform enabling next generation data communication and networks and data centers, supporting the dramatic increase of wire line data traffic. We announced key design wins with Broadcom, a leading designer developer and global supplier of a broad range of digital and analog semiconductor connectivity solutions. We qualified our RF SOI platform at multiple manufacturing sites, offering increased capacity to meet growing customer demand. We also began offering our enhanced and advanced automotive offering with leading technology for the complex requirements of ADAS and autonomous driving and the wireless connectivity in automotive radar markets. We announced strong partnership with Denso entering production on RF radar sensors for the Toyota Camry cars released in North America. We launched a new foundry silicon photonic process. This new SiPho offering adds new serviceable content to the optical fiber market already served by high performance silicon germanium technology and data and cloud computing centers. Looking ahead, the RF and HPA business unit is investing heavily to capture several emerging opportunities, the most significant being the advent of 5G for higher wireless data rates. 5G will increase Europe content in smartphones and improve performance benefiting from the company's most advanced RFSOI and silicon germanium technologies. The higher data rates will also provide an infrastructure growth business which TowerJazz will serve with its high performance silicon germanium and new SiPho platforms. In addition to our 5G activities, automotive sensors will continue to provide new business opportunities as advance safety systems enable autonomous vehicles in the future. TowerJazz's RF group will continue to expand its strong offering and presence within this fast growing market. In 2017, our power management group including Tower ICs and Tower Discrete represented about 30% of our corporate revenues or approximately $420 million. The power management business unit continues to see high demand, driven primarily from automotive industrial markets with additional consumer needs. During 2017, we significantly expanded our offerings by providing a broader voltage coverage and new capabilities providing increased efficiency and additional features to our customers while enabling better cost structure from which both we and our customers benefits. Several of the highlights of the year, we released our 200 volt SOI technology which is now in mass production. We released the 5 volt only and 3.3 volt only 65 nanometer process platforms in Uozu, Japan, which started mass production and is ramping now. We ramped the production multiple Gen4 and low RDS on products. We are qualifying our tower management platform over San Antonio facility to enable additional capacity and flexibility for our customers and we are releasing 5 volt high density best in the world 91K gig per square millimeter digital library to enable high density digital designs on the analog platform. We see a number of interesting opportunities ahead of us. In the short term, we expect to increase our footprint in low voltage market using our previously described 300 millimeter 65 nanometer platform, providing customers with substantial cost advantage as we take part and sharing higher margin. And as mentioned we had strong customer draw for a unique 65 nanometer BCD platform which will give us leadership at the 16 volt level offering the leading edge platform with best-in-class RDS on while again providing lower cost to our customers and higher corporate margin. Our Image sensor end markets including medical, machine vision, digital SLR camera, cinematography and security among others represented about 15% of our corporate revenues or $210 million and provided the highest margins in the company. We are offering the most advanced global shutter pixel for industrial sensor market with a 2.8 micron global shutter pixel on 110 nanometer platform. The smallest global shutter pixel in the world already in manufacturing. Additionally, as mentioned we have a 2.5 micron state of the art global shutter pixel in development at 65 nanometer, 300 platforms with several leading customers allowing high sensor resolution for any given sensor size enabling TowerJazz to further grow its market leadership. We also offer single photon avalanche diode which is state of the art technology and ultra fact global shutter pixel for automotive radars based on time of flight principle, answering automotive market needs. We have engaged with several customers in the development of their automotive radar and expect to be a major player in this market in the coming future. During 2017, we announced a partnership with Yuanchen Microelectronics for backside illumination manufacturing in Changchun China that provide us the BSI process segment for CIS 8 inch wafer manufactured by TowerJazz to increase our service to our worldwide customer base in mass production. So I will be ready for this mass production early second half of this year with multiple customers already having started their product designs. In addition, we developed backside illumination and stack way for technology on 12 inch wafers in the Uozu factory serving as a next generation platform for high end photography and high end security market. We now offer both BSI and column level stack wafer PDKs to our customers. We are investing today in three main directions. Next generation global shutter technology for industrial sensor market. Backside illumination stack wafers for the high end photography market and special pixel technology for the automotive market. About 26% of corporate business served various mix signal applications. The products within this group included MCUA6, RFID TAG, logic standard cells; certain special CMOS embedded memory and advanced sensors including MEMS. These products serve computing, industrial, consumer and automotive end markets. And we service both the aerospace and defense business in the US providing --access to our commercial technologies for military and space applications at our New Port Beach California facility. So to summarize, we see strong demand across all of our business units with additional specific demand for high end high margin silicon germanium platform based product. As such, we are doubling our sizing capacity. We anticipate significant ramp in 300 millimeter 65 nanometer flows starting production this year. We are increasing capacity organically as outlined in this call and as well through initiations in China such as Takoma which is progressing nicely. As stated, we anticipate growth throughout the year in a particular very strong second half. As we continue to our lead in the analog, semiconductor space, we are taking significant strides to increase our activities and capabilities and look to further our market potential and competitive advantages by investing and focusing on additional high margin market. Two of the newest focus in activities of the company is analog and real networks fitting within the AI space and environmental sensor modules. We look forward to giving further updates as these activities progress. I appreciate and gratefully acknowledge the combination of a dedicated role of our employee base, outstanding managers and leadership team for the achievement I presented as well as and of great importance our customer partners who have and continue to trust us with their business. With that I'd like to turn the call to our CFO, Mr. Oren Shirazi. Oren?