Brian Faith
Analyst · Benchmark. Your line is now open
Thank you, Moriah, and thank you all for joining our Q3 2018 conference call. I have quite a bit of exciting news to share with you today that bolsters our outlook for 2019 and beyond. Since our last conference call, we have expanded the scope and value of our MOU with a leading Japanese smartphone company. We’ve broadened our involvement with the leading consumer electronics company we mentioned on our last conference call that is designed in our EOS S3 and AC powered always on, always listing application. We have initiated a new EOS S3 engagement with the leading consumer goods company for a high-volume AC powered always on, always listening application in yet another new market sector for QuickLogic. And I’m very proud to announce we are forecasting material QuickAI revenue for Q4 2018. An important point for QuickLogic that I want to highlight is the fact we are seeing mounting evidence of a broad industry shift from push to talk to always on, always listening voice interfaces. Our recent design wins and engagement activity suggest this trend is in the process of expanding into a very wide range of end markets many of which are totally new markets for QuickLogic. This just to always on, always listening is important for QuickLogic because there is a focus on minimizing the power consumption of the interface and that is where our multicore EOS S3 has a clear competitive advantage. We are even seeing a focus to minimize power consumption in AC powered products that are obviously not worried about battery life that need to comply with new energy standards that limit standby or vampire power consumption. This was the driver for the leading consumer electronics company that selected our EOS S3 for new products that will be shown in a couple months at CES and it is also the driver for our engagement with the leading consumer goods company. The shift to always on, always listening is also punctuated by the release of Amazon's new close talk certification specification for always listening products. Prior to the release of the specification all the Alexa compliant hearable and wearable devices in the market were push to talk. There are a variety of good reasons why Amazon took time and care and drafting its new close talk certification, that they can be boiled down to ensuring the quality of the Alexa experience across a vast number of third-party devices is consistent with the consumer expectations that Amazon has carefully fostered with its smart speakers. After implementing a software revision to accommodate a new requirement we tested our EOS S3 against the close talk certification test with one mic and two mic configurations. Both configurations pass the test. With the specification released and the assurance of our internal test results our hearable customers are implementing our latest software, and modifying their designs as necessary to ensure compliance. One of our larger customers is close to completing the cycle and will submit its hearable device Amazon this month for certification. Our other customers are in various stages of internal testing and design modification, based on what we know today we expect the first of these products to move into production late this quarter and the balance during Q1 2019. While these delays impact our Q4 revenue outlook by more than $0.5 million. We now have a much clearer roadmap to revenues then we did three months ago. We have made solid progress on all fronts of our ArcticPro embedded FPGA IP initiative on the salary side of the equation, we completed our qualification for global founders 22 nanometer FDSOI fabrication process that is marketed as 22 FDX. This means we have three process and qualify the global founders and that QuickLogic is the only source for embedded FPGA IP that is qualified on an FDSOI process. This is important because the goal of foundry's 22 FDX process is optimized for lower power and low cost and is been targeted by numerous semiconductor and systems companies for new SOC and ASIC designs. These include several of our ongoing ArcticPro eFPGA engagements and the risk parallel ultralow power or PULP IC from ETH Zürich, which some of our customer engagement intend to use as a platform to evaluate our ArcticPro embedded FPGA IP. In addition to global foundry, we also have a fabrication process qualified at SMIC and PSNC and have completed according to support a second, and more advanced fabrication node at TSMC. On the customer side of the equation the new go to market strategy we introduced earlier this year continues to break the Catch-22 loops that were stalling our engagements. The short story is semiconductor companies wanted to run test chip experiments with our embedded FPGA technology before committing a significant amount of money to acquire an IP license for new SOC design. To accommodate this and move the engagements forward, we created a master technology license agreement or MTLA. This solved two problems. First, it enables semiconductor companies and OEMs to build test chips using our ArcticPro embedded FPGA IP for only a modest cash investment. This provides them an opportunity to evaluate and quantify the benefits of our embedded FPGA IP ahead of making a commitment to new SOC design. Second, the MTLA defines the terms and conditions of follow-on IP licenses. This means the vast majority of negotiations and legal work is accomplished within the MTLA and the follow-on license agreements for targeted SOCs amount to only a couple pages that can be executed quickly without disrupting the design flow. This is often critical since an SOC design group that wants to use eFPGA otherwise decide it does not have the time to go through tedious corporate level approvals and license negotiations. The strategy also enhances our position with large semiconductor companies with an MTLA in place and test chip in place, SOC design groups throughout large semiconductor companies are exposed to the availability of our solution and can realistically consider it just as they would other IP blocks that are typically included in SOC designs. We signed our find our first two MTLA with ETH Zürich and C-Sky, which was subsequently acquired by Alibaba. In line with the outlook we shared last quarter, we are on pace to sign additional MTLA with semiconductor companies this quarter. C-Sky and the IT R&D team and Alibaba's Discovery, Adventure, Momentum, and Outlook economy or DEMO are the corner stone of Alibaba's new semiconductor initiative called Pingtouge Semiconductor. We believe our MTLA with C-Sky will drive multiple SOC licenses beginning in 2019. ETH Zürich selected our ArcticPro embedded FPGA for use in its risk five pulp platform that will be fabricated using global foundry's 22 FDX fabrication process. ETH is currently targeting the tape out for its pulp platform later this quarter and stated it will develop a number of compelling use cases that highlight the benefits of our embedded FPGA IP. The pulp platform will give our potential IP customers the ability to evaluate the power savings and performance improvements that ArcticPro embedded FPGA hardware implementations deliver relative to software solutions running on an integrated risk five processor. This is critical for many use cases where designs must maintain the flexibility needed to adapt to new algorithms yet still be optimized for performance and ultralow power consumption. This is a very common use case for discrete FPGAs today. As we moved out of ESO S3. I'm proud to announce we shipped record ESO S3 revenue in Q3 and continue to win some very impressive high line designs. However, we also continue to deal with one frustration. There was a shift in priorities that the tier 1 smartphone customer that we've been working with for quite some time on three product designs. As I reported in our last conference call our EOS S3 was one of two competing ICs for the high-volume consumer wearable device that customer is targeting to have production ready by the end of 2018. However, due to a new wearable product that was recently introduced by our customers competition the consumer wearable design was pulled back for review and the customer is dedicated 100% of its resources to reevaluating the design. As it stands today our EOS S3 remains one of two solutions in the running for this design. Working in our favor is the fact EOS S3 has lower power consumption, a smaller package size and lower costs than our competition, while battery life PCBs facing costs are clearly important the customer is considering adding features that would require to use the competitive solution that has more on-chip memory. Due to customers all hands on deck focus on the consumer wearable final qualification and testing for our design win in the other wearable device and EOS S3 evaluation for hearable device have not moved forward since our last conference call. Last May, Naver Labs released its first consumer product, the Aki smartwatch which uses our EOS S3 to enable its always on, always listening voice interface. Naver Labs recently received notice from a supplier that a key component used in Aki will be discontinued. As a result Naver Labs is faced with the choice of redesigning Aki, making a lifetime by the component or combination of both options. We have not received notification from the Naver Labs yet as to what it will do. Due to this we are modeling only modest shipments to Naver this quarter for Aki. While this is clearly an unexpected setback we developed a close working relationship with Naver Labs during the Aki development cycle that extends to its senior executives. Through this and the design experience and IP that Naver Labs have developed while working on Aki our EOS S3 has been selected for a new wearable design that is targeted for release in 2019. EEBDK had a very successful launch of its two new educational tablets that use our EOS S3 to enable easy and intuitive voice communications. As is the case for US suppliers Q3 is seasonally strong quarter for educational products in China due to this, we are anticipating a seasonal decline in Q4 followed by a seasonally stronger demand in Q1. We have ongoing engagements with the EEBDK for a new high-volume product that is scheduled for release in 2019. Last quarter I announced that we signed an MOU with a large Japanese smartphone company. Since then we've expanded the scope and value of the agreement significantly. With this expansion, the OEM has agreed to standardize on our EOS S3 for all of the MCU applications in smartphones, future phones and IOT products. The selection of EOS S3 as the standard to be used across a broad scope of products by a major OEM is a big and unprecedented deal for QuickLogic. Last quarter I mentioned a very significant design win with a leading consumer electronics company. While we continue to operate and restrict under a NDA with this company I can provide the additional color I committed to have this quarter. The design is in a new consumer electronics product class for QuickLogic. The core platform, the core design is a platform that will be used by multiple OEMs. In total there could be 10 or more models from various OEMs that use this platform design for an integrated version of the platform. The lead OEM is integrating the design into four initial models that we believe will be shown at CES. Higher volume models are expected to have values that range from low to mid seven figures. We expect to initiate production shipments with the first models introduced at CES in late Q1 2019 with volume ramping in subsequent quarters. And we are in the early stages of the new design opportunity with this OEM that originated from the platform design. In addition to our recent success in consumer electronics we are in the early stages of an EOS S3 engagement with a leading consumer goods OEM. This application represents yet another totally new product category for QuickLogic and has low to mid seven figure annual potential. If we are successful in winning the design, we expect it will move into production during the first half of 2019. We are also working closely with this company as it evaluates EOS S3 for a new platform design that targets the variety of high volume consumer products all of which would represent new product categories for QuickLogic. Before I turn the call over to Sue, I have some very exciting QuickAI news to share. I'm proud to announce that we anticipate reporting material QuickAI revenue in the fourth quarter. And looking towards the future we believe this first QuickAI design win will drive low seven figure revenue in 2019. In addition to this we already have several other QuickAI engagements that have the aggregate potential to drive low to mid seven figure revenue in 2019 and have product life cycles that extend for years beyond that. We have opened a new engineering office in San Diego to support these engagements and other QuickAI development activities. I realize that given their very rapid move from introduction to material revenue leaves you with many questions and I'm as anxious to provide those answers as you are to hear them. However we are not quite ready to tip our hand to the competition, our plan is to provide more color about QuickAI later this quarter and with that illustrate how our EOS S3 SoC played a very important role in the high value integrated solution. I would now like to turn the call over to Sue for discussion of the financials. Sue?