Fusen Chen
Analyst · Craig-Hallum
Thanks, Lester. While we continue to operate in a very dynamic macro environment that is difficult to predict, we remain cautiously optimistic considering recent demand improvement at our global OSAT. Additionally, we are also uniquely positioned to create a meaningful value through our market expansion effort in advanced packaging and the next generation LED opportunities.
As mentioned in today's press release, we believe the soft demand environment is gradually improving, and we expect revenue to be approximately $130 million to $150 million, representing a 10% sequential improvement. We remain extremely focused on several of our development initiative and our ongoing effort to drive market and the consumer adoption of our newly introduced advanced packaging, mini and the microLED systems. This ongoing development effort provide an opportunity to emerge this period of softness a much stronger and higher growth organization.
A few weeks ago, we participate in a SEMICON West tradeshow where advanced packaging technique and approaches was highlighted by several leading logic and foundry companies. This focus on advanced packaging highlights our long-term view that new packaging approach provide alternative to node shrink [ by delivering ] power efficiency, performance and a form Factor benefit for next-generation devices.
We are well positioned to directly participate in this transition through our competitive and the comprehensive advanced packaging offering. Over the coming years, we anticipate meaningful leverage in our operating model as our soft market expense through share gain in this new businesses. During SEMICON, we exhibit our Katalyst High Accuracy Flip Chip to the broader market. Due to unique architectures, throughput and accuracy, we are pleased with the competitiveness of this tool. Our rapid development approach is facilitated by our R&D organization has allowed us to develop and introduce this tool in just over one year.
The Katalyst system provide the increase placement accuracy and up to a medically enhanced throughput for next-generation high-density free chip devices. Today, free chip equipment is the second largest in the coming market behind wire bonding, with a total available market size of approximately $250 million. Over the coming years, we anticipate new forms of advanced packaging such as high accuracy free chip, thermal compression and the fan-out wafer level packaging to depress traditional free chip tool, a market we do not participate significantly in. For K&S, this anticipate transition will enhance our share of leading-edge logic and memory applications.
Also, as mentioned last quarters, APAMA, our Thermo-Compression system, continued to perform well and they remain very competitive both as alternative system and a leading OSAT for a high-volume logic application. Temporarily, we ship our first evaluation of Liteq 500 lithography system during the June quarter. This system has been installed successfully and on schedules. We have received positive feedback on the system ease of use and are targeting to ship a second evaluation system to a separate customers early in calendar year 2020.
Finally, in just over a year, we engaged with a technology partner and subsequently developed, shipped and recognized the revenue for our mini and the microLED tool, PIXALUX. This, too, has set a new benchmark for high-speed placement and operate up to 5x faster length competing pick and place solutions. Considering this capability, our recent sales and the end customer interest, we expect this tool will enable cost effective and the higher volume production of mini and the microLED devices in the near futures. Over the coming years, we anticipate new forms of backlighting to drive initial adoption of PIXALUX tool. In the longer term, direct-view LED display are also a high potential end applications for this tool. While we are focused on mini and the microLED usage for high resolution display, there's also meaningful potential for lighting and the general informational display within automotive and the consumer electronics.
As of today, we have shipped a total of 7 system, several of which we have already recognized revenue. We continue to operationally prepare for an initial production ramp.
We are confident that our current and the new technology solution are extremely aligned with significant long-term trend in advanced packaging, automotive, IoT and the display market. In addition to our new system revenue contributions, which are anticipated to deliver meaningful operating leverage benefit over longer term, we also continue to anticipate more near-term major demand recovery in our core business as a seasonal dynamic, including smartphone cycle, followed by U.S. and Asia holiday season, drive capacity decisions and the incremental capacity demand into fiscal 2020.
Our strong balance sheet, expanding portfolio, dominant market position, ongoing repurchase activity and the high potential customer engagements provide us with increasing confidence that we will exit this soft demand environment with enhanced fundamental strengths in the growth prospects.
This conclude our prepared remark. Operator, we will now be happy to take questions.