Fusen Chen
Analyst · Craig-Hallum Capital Group
Thanks Lester. While the near-term environment continues to be challenging, we remain optimistic when we look further out given the macro and micro trends such as strong global employment, ongoing stimulus programs in major consumer markets, improving utilization rates for our equipment and key trends directly impacting demand for our core products such as 5G, IoT, automotive and solid state memory. Unique to our business, we are also very excited with our new business prospects and customer traction within our growing advanced packaging portfolio, Our MiniLED solution, in addition to our fundamental optimization plan. As mentioned in today’s press release, we believe the soft demand environment has stabilized and expect revenue to be approximately $120 million to $140 million, representing a 12% sequential improvement. (We continue to expect demand to improve, more meaningfully, through the September quarter.) [Later inserted by the Company] Looking further out, our core and new products are aligned with several significant transitions in our space. First, our core ball and wedge bonding offerings, where we have a leadership position, are well-positioned to benefit from the industry recovery and also long-term fundamental semiconductor unit demand driven by electric and autonomous vehicles, the 5G transition, Internet of Things and solid state memory. We continue to anticipate these significant trends will support a higher-than average semiconductor unit growth rate over the coming years. Second, our multi-pronged efforts surrounding advanced packaging are also gaining traction. There continues to be increasing interest and adoption of new packaging techniques in both high-end memory and logic applications – supporting cloud, artificial intelligence and also consumer electronics. In the March quarter we recognized revenue on several APAMA Thermo-Compression tools supporting advanced and high-volume logic production at a major OSAT. We also continued customer evaluations of our Katalyst, high-accuracy-flip-chip tool, with a major customer. We are pleased with the performance of Katalyst, which is extremely competitive, in both accuracy and throughput, among all leading flip-chip solutions in the market. Separately, I’m very happy to report, we have shipped the LITEQ 500 lithography tool to a high-potential, high-volume, commercial customer for evaluation. Finally, we continue to make meaningful progress on our MiniLED business and plan on shipping multiple tools over the coming months. Considering the extreme speed of this tool, which is up to 5x faster than typical pick-and-place tools, it has significant -potential to enable high-volume adoption of this emerging MiniLED packaging technology. We look forward to updating you on the progress and customer acceptance of this tool. Again, the entire organization remains extremely focused and continues to make progress toward this multi-faceted business strategy. We intend to create significant investor value by executing on these business initiatives and continuing to take a long-term and prudent approach to capital allocation. Our strong balance sheet, expanding portfolio, dominant share positions, and high -potential customer engagements provide us with increasing confidence that we will exit this soft -demand environment with enhanced fundamental strength and growth prospects. This concludes our prepared remarks. Operator, we will now be happy to take questions.