Jordan Wu
Analyst · Northland Capital Markets. Your line is now open
Thank you, Jackie. We delivered much improved results in the second half versus the first half last year. Looking into 2018, our major growth engines will be, for large panel segment, China panel makers’ increase in capacity, for small panel segment, in-cell TDDI for smartphone and driver ICs for automotive applications, and last but not the least for non-driver areas, increasing WLO revenue, and commencement of 3D sensing total solution shipment. 3D sensing will be our biggest long-term growth engine and, for this year, a major contributor to both revenues and profit, consequently creating a more favorable product mix for Himax starting the second half of the year. With that now let me give you some insights behind our guidance and trends that we see developing in our business. Our large display driver IC business experienced a strong growth momentum in the second half of 2017 as 4K TV penetration was still on the rise globally and China continued to ramp brand new advanced generation LCD fabs. In fact, BOE has just launched the world’s first Gen 10.5 fab a few weeks ago, while CEC-CHOT’s Gen 8.6 fab and CECPanda’s Gen 8.6+ fab will also go into operation this year. Being a market leader in large display driver IC business, we will benefit from such capacity expansion. However, the whole market is currently facing a capacity shortage of 8” foundry where vast majority of large panel driver ICs are fabricated. While the growth of our large panel driver business may be limited by the tight 8” foundry capacity during this year, we are starting the early ramp of a newly built 12” fab in China. Adding the 12” fab into the pool of our foundry capacity will greatly alleviate the shortage issue of our customers. However, the ultimate ramping schedule will depend on how fast our customers can go through their customer qualification, something all its major customers are working very hard on. For the first quarter, we expect a low-single-digit sequential revenue growth for large display driver ICs. With the 2020 Tokyo Olympics approaching, the ecosystem for super-high-resolution TV is being established, hoping to catch the business opportunity arising from the 8K program broadcast at the event. At this year’s CES, major TV manufacturers have unveiled their 8K TV with Himax solutions inside. We will continue working with major panel makers for the development of next generation 8K TVs. Turning to the small and medium display driver business. Our first quarter sales for smartphone are likely to decline by approximately 30% sequentially on product transition, weak market demand and seasonality. We have numerous TDDI design-wins for HD+ and FHD+ projects with top tier names, yet shipment has been hindered by the weak overall smartphone market sentiment. In spite of the short-term headwinds, the Company we are confident that our TDDI solutions and display driver IC business will accelerate starting the second quarter as smartphone makers begin to replenish inventory for their new product launches in the second half. On the high side, its new generation FHD+ TDDI with COF or chip on film package is in design-in stage with a number of leading Chinese smartphone brands and panel makers. TDDI with COF package can enable super slim bezel design for premium smartphone models. We expect small volume shipment in the first half with accelerating volume in the second half. Our driver IC business is also expanding into new areas such as smart home assistant segment. Such activities will help future rebound in sales momentum. On AMOLED product line, the Company we have been collaborating closely with leading panel makers across China for product development. We believe AMOLED driver ICs will be one of the long-term growth engines for its small panel driver IC business. As to automotive application, we continue to have further design-wins from prior years going into mass production this year. We expect Q1 revenue to grow around 10% sequentially and more than 50% year-over-year. We have engaged all of the major automotive panel manufacturers worldwide for long-term partnerships and secured many of their key projects pipelined for the next few years. Going into the first quarter, due to seasonality and overall weak smartphone market, we expect small and medium-sized driver IC revenue to be down around 10% sequentially. Now let me share some of the business progress on our non-driver IC businesses. First, I will touch on our 3D sensing total solution. At present, our total market is primarily the Android based smartphone. SLiM, our total – our structure light-based 3D sensing total solutions which we announced jointly with Qualcomm last August, brings together Qualcomm’s industry leading 3D algorithm with Himax’s cutting-edge design and manufacturing capabilities in optics and NIR sensors as well as our unique know-how in 3D sensing system integration. The majority of the key technologies inside the SLiM total solution is developed and supplied by Himax ourselves. These critical technologies include, on the projector end, DOE and collimator utilizing our world leading WLO technology, a tailor-made laser driver IC, and high precision active alignment for the projector assembly; and on the receiver end, a high efficiency near-infrared CMOS image sensor. Last but not least, Himax also developed an ASIC by incorporating Qualcomm’s algorithm for 3D depth map generation. The fact that all of these critical components are developed in-house puts us in a unique leading position. It represents a very high barrier of entry for any potential competition and a much higher ASP and profit margin for us. The Qualcomm/Himax solution is by far the highest quality 3D sensing total solution available for the Android market right now. It has the industry’s best performance in all of the dimension, 3D depth accuracy, indoor/outdoor sensitivity and power consumption. It passes the toughest eye safety standards with a proprietary glass broken detection mechanism to safeguard the user from any potential harm. Furthermore, we have the only solution to offer face recognition for secure online payment, a must-have feature for high end smartphones of the future. We are working with multiple tier-1 smartphone makers, aiming to launch 3D sensing on their premium smartphones starting the first half of 2018. Our SLiM solution will be ready for mass production and shipment by the end of the first quarter, 2018 with an initial capacity of 2 million units per month, following some waiting period. The initial capacity is part of our Phase I expansion of $80 million. We have already achieved pretty satisfactory production yields in our internal pilot production. Given that SLiM is a highly integrated solution with ASPs much higher than those of individual components, by the time we started making shipment, it will be a major growth contributor to our top and bottom lines. In an attempt to accelerate the adoption of 3D sensing for Android phones, in addition to SLiM, we’re also working on stereoscopic type 3D sensing as a lower costs alternative. Unlike SLiM which utilizes structure light to generate 3D, stereoscopic type uses two cameras to replicate 3D vision in nature, augmented by coded light for image depth enhancement. Both types of solutions offered by Himax operate on active NIR light source with high sensitivity NIR sensors, thus working very well even under extreme brightness or total darkness. For 3D sensing purposes, structure light approach offers better depth precision than stereoscopic type but the cost is also higher. By introducing stereoscopic 3D sensing, we aim to bring down the cost of 3D sensing so that it can be afforded by mass market smartphone models. We are pleased to report that development of stereoscopic 3D sensing total solution for face recognition and 3D features has been under way. We are aiming to be mass production and shipment ready by [indiscernible] of this year. Similar to our experience in SLiM, we are working with some of the most prominent ecosystem partners in developing our stereoscopic 3D total solution. We are very update progress in due course or low costs compared to structure light their stereoscopic 3D was still represent a much higher ASP and better gross margin potential for us. Last but not least and this year CES many of our customers and partners demonstrated 3D sensing applications in IoT or promoted AR/VR and robotic related products with Himax SLiM inside and received very positive feedback. As I mentioned before, 3D sensing can have a broad range of applications that go beyond smartphone. We are very excited about the growth prospects it represents and believes 3D sensing will be our biggest long-term growth engine. In the last earnings call, we reported that it we have started mass shipment of a highly customized WLO product to an anchor customer during the third quarter. The production has been going well as we deliver consistent product quality, production ramp and high yields. Shipment volume to the customer for the fourth quarter accelerated sequentially. However, lower volume in the first quarter of 2018 is expected as per the customer’s demand forecast. The much-reduced shipment were negatively the impact our Q1 gross margin as lower utilization will lead to much higher equipment depreciation and factory overhead on a per unit basis. Despite the short-term order adjustment, we expect strong rebound in the second half and are more optimistic than ever about the partnership and growth opportunities we had with the customer. The R&D projects with the said customer for their future generation products centers around our exceptional design know-how and mass production expertise in WLO technology for optical devices. Now another major update for WLO business, we recently announced the acquisition of certain advanced nano 3D masters manufacturing assets and related intellectual property and business. The advanced nano 3D manufacturing masters are primarily used in imprinting or stamping replication process to fabricate devices such as DOE, diffuser, collimator lens and micro lens array. This acquisition demonstrates our commitment and confidence in the long-term growth prospects for WLO and 3D sensing businesses. Now let me give you an update on the construction of the new building, one of the major CapEx projects for 2017. I’m pleased to report that the construction has been completed on schedule. The new building, located near our current headquarters, will house additional 8-inch glass WLO capacity and the new active alignment equipment needed for our SLiM 3D sensing solutions. It will also provide extra office space. We’ve started moving in equipment in the past few weeks. Next, our CapEx – capital expenditure. Let me start with a recap of our current CapEx plan. We announced a CapEx plan of $80 million during 2017, which is on top of our regular CapEx, an unprecedented move in our history, given our fabless nature. We call this the Phase I capital expenditure, which includes the construction of a new building, an increase of our WLO capacity for the anchor customer I just mentioned and an initial monthly capacity of 2 million units for our SLiM solution. We are now increasing the Phase I budget from $80 million to $105 million. The addition of $25 million is primarily for enhanced manufacturing automation and CIM infrastructure to achieve higher product yields and better production efficiency, an extra land of 1 hectare and more clean room and office space for future expansion. Some of these items are not necessarily required immediately, but we decided it is far more economical ----now the future. The Phase I is being executed as scheduled. Of the $105 million budget, $33 million has been paid out in 2017 with the remaining $72 million to be paid in 2018. We believe a Phase II CapEx will soon be required for additional capacity. The Phase II capacity will still be located in the same new building, using some of the clean rooms and office spaces built during the Phase I. In fact, the new building has sufficient room to house capacity much in excess of the Phase I and Phase II combined. We’re still gathering customers’ input and finalizing technical details and will formally announce the Phase II expansion as soon as the plan is finalized. As we mentioned in the previous earnings calls, the CapEx budget for both phases of expansion will be funded through our internal resources and banking facilities, if so needed. Now onto our CMOS Image Sensor business update. We continue to make great progress with our two-machine vision sensor product lines, namely, near infrared or NIR sensor and Always-on-Sensor or something we call AoS. Our NIR sensor is a critical part in our SLiM total solution. Our NIR sensors’ overall performance, measured primarily by way of quantum efficiency, is far ahead of those of our peers for 3D sensing. We currently offer low noise HD, or 1 megapixel, and 5.5-megapixel NIR sensors and are planning to add more to further enrich our product portfolio. We’re developing the next generation NIR sensors with quantum efficiency further elevated to the next level. On the AoS product line, we announced the launch of the WiseEye IoT sensors together with Emza and DSP Group, both Isreal-based, in early January. It is the industry’s first ultra-low power, always-on, fully trainable, AI based machine-vision intelligent visual sensor, adding human presence awareness for consumer appliances and industrial IoT applications. Emza demonstrated the WiseEye IoT sensors at this year's CES and successfully generated high interest from key market players, including smart buildings and security OEMs and makers of home assistants and home appliances. We expect to kick off some joint product development projects with heavy weight industry leaders in the second half of the year. Himax now owns 45.1% equity in Emza with an option to acquire the remaining 54.9% and all outstanding options. For the traditional human vision segments, we see strong demands in laptops and increasing shipments for multimedia applications such as car recorders, surveillance, drones, home appliances, and consumer electronics, among others. I will now give you an update on the LCOS business, one of our main focus areas are AR goggle devices and head-up-displays for automotive and motorcycles. While AR will take a few years to fully realize its market potential, the wealth of announcements at CES 2018 say a lot about the industry's current momentum. Many companies, be the top name multinationals or new start-ups, are investing heavily to develop the ecosystem applications, software, operating system, system electronics, and optics. With all these investments, we believe the AR goggle market will be back in an accelerating mode again. In addition to AR goggle applications, we are pleased to report that we continue to make great progress in developing high-end head-up display for automotives. We and our partners together have secured a few design wins with certain big names. Timing and major revenue contribution would be 2019 the earliest. Our technology leadership in this space has little competition. LCOS represents a significant long-term growth opportunity for us. For non-driver business, we expect sequential revenue decline of around 20% in the first quarter. However, it will still be an increase of close to mid-teens from the same period last year. In summary, we have seen seasonality and soft smartphone market demand, which will lead to sequential revenue decline in the first quarter. However, the revenue of all three major product categories were increased from the same period last year. We also expect our gross margin to be under pressure in the first quarter cost by anticipating WLO shipment reduction as per the customers demand forecast. Nevertheless, we believe shipments of TDIC and WOs were favorite in the second half of 2018. We also expect significant business growth in our 3D sensing business to contribute to post at our bottom-line as early as the second half of this year. That concludes my report for this quarter. Thank you for your interest in Himax, we appreciate you joining today’s call and now we’re ready to take question.