Lip-Bu Tan
Analyst · JPMorgan
Good afternoon, everyone, and thank you for joining us. Our record of strong execution continue as Cadence delivered solid Q3 financial results. Total revenue was $367 million, non-GAAP operating margin was 24% and operating cash flow was $98 million. First, let me comment on the environment. While demands for EDA products has been good this year, the environment remains challenging, with macro uncertainty and softness in semiconductors. As we mentioned, last quarter, most customers continue to innovate and invest in new design activities, but some are facing more challenges. Now let us review some of our Q3 highlights. Q3 was a strong quarter for Palladium. Palladium has a strong position in over 70% of the top semiconductor companies, and this year, we grew our leading position with 25 major expansions and 9 new customers. More than 40% of our Palladium business is now with system companies and this figure is growing. This quarter, we announced the new Palladium XP II system, which delivers 2x the verification productivity, higher gate density, low power consumption and represented 1/3 of Q3 Palladium emulation orders, including a transaction with Japan's National Institute of Information and Communications Technology. System development suite centered on Palladium was also enhanced with Broadcom and NVIDIA reporting orders of magnitude hardware/software verification speed-up. Q3 Palladium revenue was strong, and is now running ahead of our year-to-date estimates. But it's still expected to be down overall for the year. Our investments in expanding our IP business is producing results. We are winning new Tier 1 customers at the most advanced nodes, growing the business and gaining market segment share. Over 200 customers use our Tensilica course in associates, such as baseband IP for 4G LTE modems and audio and imaging IP for mobile, home and automotive application processors. Cadence has built a strong internal IP development team, focused on providing complete IP solutions for digital, analog and mixed-signal IP. We just released a new lineup of high-speed analog and digital data-converter IP, and we have already a design win with a key consumer electronic company. Cadence received a TSMC Partner of the Year Award for our analog and mixed-signal IP based on the quality of results we deliver. FinFET technology use breakthrough 3D transistor to reduce power and increase performance, and has a potential to significantly extend Moore's Law. Our early and deep investment in FinFET technology and design flow development are beginning to pay off. We have previously announced FinFET test chips with ARM, IBM, Samsung and TSMC, and we are working with many Tier 1 customers as they progress toward production designs at the 14- and 16-nanometer nodes. Virtuoso is the leading tool for developing FinFET cell libraries and foundation IP, and is used on nearly every design at 14 and 16 nanometers. The Cadence digital and custom/analog platforms have both received TSMC certification for the 16-nanometer tool [ph] flow, and TSMC recognized Cadence with a Partner of the Year Award for the 16-nanometer FinFET infrastructure. We recently introduced Spectre XPS, our next-generation FastSPICE simulator, which can deliver up to 10x faster throughput than computing simulators using 2 to 3x less system memory. Spectre XPS delivers orders of magnitude improvement in simulation performance for designs that continue to grow in size and complexity. We already have about 1,000 customers deploying Spectre XPS in active design, including Texas Instruments. We're extremely proud of our ability to continue to deliver innovative internally-developed technologies, including Tempus and Virtuoso EAD last quarter, and Spectre XPS and Palladium XP II this quarter. These products deliver order of magnitude improvement in performance and productivity over computing solutions. In summary, we continue to drive consistent operational and financial execution as today's results demonstrate. The introduction of Palladium XP II boosted emulation sales. We are rapidly integrating our IP acquisitions, releasing new internally developed IP and winning new business across the customer spectrum. We are actively working with many customers and partners on production FinFET designs, and our talented development teams continue to introduce innovative new products like Spectre XPS. Now I will turn the call to Geoff to review the financial results and provide our outlook.