Gideon Ben-Zvi
Analyst · ROTH Capital
Hello, everyone, and thank you for joining Valens Semiconductor's first quarter 2024 earnings call. On our last call, we discussed the macroeconomic headwinds that would impact our business in 2024 and the first quarter operating environment was in line with our expectations. While we were pleased to report some upside relative to our previously reported guidance, we continued to be impacted by ongoing slow inventory digestion in the audio-video market and in the Automotive segment. Additionally, persistently high interest rates fueled by creeping inflation continued to impact our business landscape. Despite this environment, Valens Semiconductor remains determined to expanding our collaborations and partnerships across the diverse verticals we serve, and we made good progress in this regard during this quarter. Later in the call, Guy will dive into the details. But for now, I want to cover Valens first quarter's performance at a high level. We are pleased to report that our revenue exceeded the top end of our guidance at $11.6 million. GAAP gross margin for the first quarter came in at 59% and adjusted EBITDA loss was $7.1 million, better than our guided range. Valens Semiconductor's robust balance sheet with $139.8 million of cash and cash equivalents allows us to continue investing in innovations and pursue long-term growth opportunities we are looking to weather these headwinds. Now let me turn to our performance and the trends we are seeing in the markets we serve. Starting with audio-video; as we discussed last quarter, our ongoing investment in expanding our presence within multiple verticals of our audio-video market enables us to capitalize on positive long-term trends, thanks to the opportunities presented by the latest product additions to our portfolio, in particular, the VS6320 and the VA7000 chipsets. We estimate that these verticals, which include videoconferencing, industrial and machine vision could represent a total addressable market of approximately $1 billion per annum. We are currently in the process of outlining this opportunity in a modified strategic multiyear plan, which we expect to communicate to the market in the coming months. Within the videoconferencing vertical, a recent Frost & Sullivan report states that over $3 billion global videoconferencing device market targeted by our customer is undergoing fundamental shifts. Despite current market conditions, video communication is becoming essential to the new office and conference room settings, creating greater market adoption. To this point, the CEO of Logitech, one of Valens customers recently stated that the [indiscernible] in videoconferencing is enormous. He also said, if you look out 10 years, it makes perfect sense that all conference rooms will be video-enabled. We obviously agree with this market leader assessment. This is consistent with what we have heard from additional customers who say the key growth drivers of this market are hybrid work and modernization of meeting rooms. There is growing demand for multi-camera rooms with higher attach rates of accessories and rapid innovation of AI in camera technology that enhances the meeting experience. Of course, many of these Pro-AV devices require high-performance extension, Valens Solution are ideal for delivering a seamless plug-and-play user experience for hybrid environment and multi-camera rooms. As the global videoconferencing device market continues to grow, so will the need for our robust connectivity solutions. An example of how we plan on capturing the value of the increasing global videoconferencing market is our VS6320, a first of its kind, USB 3.2 high-performance extension solution. The VS6320 is a game changer in the market, solving connectivity problems that exist for current technologies with a combination of multi-gig bandwidth and lower USB extension, enabling new use cases. We are very proud and have great expectations from this new welcomed member to our chief family. We introduced VS6320 in Q4 2023. And since then, it was already designed into over 30 products and the interest from additional customers continues to build for this chipset. We anticipate multiple announcement and product launches as early as the InfoComm International Trade Show this June. We are excited to see the initial backlog and expect sales to further ramp up during the second half of 2024. The VS6320 also has applications above and beyond videoconferencing, and we expect to see the chipset to begin powering innovation in multiple markets. Moving on; as you are all no doubt aware, there is a rise in the use of AI across industries. For many applications, especially those requiring high-resolution, real-time video and data aggregated for multiple cameras, a high-performance connectivity solution is often required. Valens Connectivity solutions have the potential to play a pivotal role in facilitating the adoption of artificial intelligence across multiple industries. An example of this is our collaboration with Taiwan-based AI image processing company, iCatch technology, which aims to introduce a multi-camera solution based on their SoC and Valens VA7000 chipset for the videoconferencing and machine vision markets. With our VA7000 chipsets, we enable a robust, high bandwidth, zero latency connectivity infrastructure enabling real-time video processing and decision-making that is required for enhanced AI applications to-date. ICatch also plans to launch an AI-enhanced multichannel surround view monitoring system for the Automotive industry using our A-PHY based VA7000 which further underscores the versatility and impact of our high-performing technology across different sectors. Moving to Automotive; overall, our automotive business is stable. As you know, our first-generation VA6000 chipsets are using Mercedes-Benz Infotainment and telematics systems. 2023 was our first full year of selling into a broad range of Mercedes-Benz model, including their EV models. Between the fourth quarter of 2023 and the first quarter of 2024, we saw a reduction in revenues in our automotive business due to inventory digestions. With our asymmetric VA7000 MIPI A-PHY based chipsets, we continue to make encouraging progress in various evaluation processes. Last month, we announced a significant milestone in our collaboration with Sony Semiconductor Solution Corporation, as we jointly completed EMC and interoperability testing of a multi-vendor A-PHY link. Ideally, this will lead to a mature Sony A-PHY integrated image sensor that is compatible with our VA7000 deserializer chip. In addition to deepening the collaboration between Valens and Sony, one of the top three automotive sensor supplier in the world [indiscernible] announced that we are developing an 8-megapixel A-PHY camera module of ADAS system that will prepare in the coming months. [indiscernible] earlier this year, we continue to see the strong interest in our innovative technology from the automotive market. During the quarter, we invested in following up on new and interesting opportunities, which resulted from our demonstrations at the show. Nowhere was this more apparent than in our EMC shootout where our VA7000 A-PHY chipsets outperformed competing proprietary extension solutions. Our chipset was able to withstand around 20x more noise than competition. As the industry is evolving and the OEMs are pushing to integrate more sensors at higher resolutions with increased bandwidth requirements, the fragility of the links require high-performance connectivity. Keeping a resilient link between a camera and an SoC is crucial for guaranteeing ADAS performance and passenger safety. This MIPI A-PHY ecosystem was further strengthened this quarter by our partnership with Black Sesame Technologies to enable the integration of A-PHY connectivity into their autonomous driving platform and later into the cross-domain computing platform, leveraging the VA7000 chipset. Black Sesame Technologies will offer and support the A-PHY connectivity standard for its automotive OEM and Tier 1 customers. Black Sesame Technologies is the leading automotive grade computing SoC and SoC-based intelligent vehicle solution provider. According to the Co-Founder and President, Black Sesame decided to move forward with these implementations because of the significant interest they see for MIPI A-PHY connectivity, both within China and around the globe. Of course, we also continue to work closely with Intel Foundry Services on developing the next generation of our A-PHY compliant chipset for the Automotive sector. We announced our strategic collaboration with IFS earlier in the first quarter and are proud to be partnering with one of the most important innovators in the industry. During the first quarter, we also announced our latest chipset innovation, the VA700R engineered to address critical visibility challenges faced by truckers on highways. This groundbreaking solution offers a combination of bandwidth and lane distances, enhancing both surround view and rearview visibility. Our VA700R chipsets can serve as the fundamental connectivity infrastructure empowering automotive OEMs and Tier 1 suppliers to forge future innovations. The VA700R tests the stage for a new era of advancements in the trucking industry to assist drivers in navigating challenging conditions, including significantly compromised visibility. With the robust capabilities of our chipsets, tracking safety and operational efficiency stands to be significantly enhanced. We believe that our technological innovation, combined with our ability to identify opportunities within the industry could position us to take advantage of a total addressable market in this particular automotive segment, it could reach about $4.5 billion per annum by 2029. While the automotive market continues to suffer from slower decision-making process, in light of the macroeconomic environment, we remain confident in the ability of our technology to play a leading role in the in-vehicle connectivity solution market. With that, I will turn the call to Guy to discuss our financial performance in more detail.