Russell Ellwanger
Analyst · StoneX Financial
Thank you, Levy. Hello, everyone. Thank you for joining our call. We have much to discuss. We will speak not only to the strength of our current performance, but very importantly, on what comes next, namely the great business and financial strength with which we will be opening 2027, the visibility we have into the future demand, the realization of investments to fully capture that demand, 2028, 2029 further customer commitments, and our significant growth in customer-aligned value creation activities for 2029 and beyond. Indeed, a long-term value creation campaign with boots on the ground, providing real-time measurable financial and strategic achievements. During the third quarter, we continued to deliver record results while building upon our technology leadership and expanding capacity with increasing customer commitments to support a significantly higher level of revenue and earnings in the quarters and years ahead. At the center of this growth are our silicon photonics platforms, where accelerating AI infrastructure demand, expanding customer programs and long-term capacity commitments continue to increase Tower's scale and strategic position. This momentum is complemented by strong execution across our broader portfolio of differentiated analog semiconductor technologies. We are entering the strongest growth phase in our history. Our third quarter performance demonstrates that the strategic decisions we have made are translating into record revenue, expanding earnings power and significant visibility into the years ahead. Third quarter revenue was $526 million as compared to $396 million in the third quarter of 2025, a 33% year-over-year growth, resulting in a net profit of $120 million or 23% net margin, up from 14% net margin a year ago. Our fourth quarter 2026 mid-range revenue guidance is $600 million, which achievement would result in a 2026 full year revenue of $2 billion against a full year 2025 revenue of $1.57 billion. Achieving a $2.4 billion revenue run rate is most significant as our demand and start plans do not indicate the typical industry first quarter seasonality. To the contrary, we expect to see continued growth. Hence, the starting point of 2027 is targeted to be higher than the $2.4 billion annual begin run rate and greater than 45% increase as compared to the first quarter of 2026 revenue starting point. Later in the call, we will share details that underscore the strong quarter-over-quarter growth we are driving in 2027. Moving into our businesses. Please refer to Slide 4 as reference for the Q3 revenue breakdown by technology. The third quarter was another quarter of strong operational execution by our teams, both in the expansion and repurposing of 4 of our 5 factories towards substantially higher infrastructure mix with a background of growth activities in all of our core businesses. Our silicon photonics business is experiencing exceptional growth. To support accelerating customer demand, we are expanding capacity across 4 manufacturing sites, a business that contributed approximately $240 million of silicon photonics revenue in Q3 2026 alone. With substantial capacity coming online this quarter, we expect year-end capacity to be approximately double the level that supported the Q3 2026 silicon photonics revenue. This positions us for significant revenue ramp in the first and second quarters of 2027 as the new start rates move through the fab and ship, establishing a new substantially higher sustainable baseline for the quarters ahead. and thereby also achieving a full ROI within 1 year for the previously announced $920 million CapEx investments. Additionally, the execution of our released Track-1 300-millimeter expansion is progressing ahead of schedule with all tools ordered and slotted with full production starts targeted for Q3 2027. Including the Track-1 300-millimeter expansion, our silicon photonics start capacity is targeted to increase by 3x versus the level that supported the Q3 2026 $250 million SiPho -- $240 million SiPho shipments. Importantly, this capacity is spoken for. Through a combination of signed agreements and contracts in advanced stages of negotiation, we have secured customer demand commitments for both 200-millimeter and 300-millimeter production and now having extended it to include 2029, at which time our incremental Track-2 plant capacity ramp is well underway, ultimately quadrupling our 300-millimeter Japan capacity. Of note, all expansion is planned to continue to be self-funded. In addition to serving the rapidly growing market, largely of pluggable scale-out transceivers, we continue many activities with Tier 1 customers that take advantage of new opportunities expanding our served market. The most significant of these is the change in form factor towards near package optics or NPO that promises to add scale-up opportunities to our clearly established leading position in the scale-out market. In the view of most analysts, NPO scale-out can double the optical transceiver market. To this end, we are prototyping NPO products with more than 10 of our top customers. NPO can more often integrate transmit and receive functions in our SiPho die, expanding our silicon SAM versus the traditional pluggable market, where normally only transmit function is built into the SiPho die. NPO can also improve our position in the electrical IC SiGe market as most implementations of NPO will replace the DSP to improve cost, power and latency with SiGe TIAs and drivers and at that with greater footprint due to the increased incorporation of equalizer functionality, expanding our SiGe market opportunity. To this end, we have announced this quarter a substantial capacity agreement with Semtech and are seeing further unprecedented growth opportunities for our SiGe business. Longer term, we are building the capability to integrate new material into our SiPho platform to further expand our served available market. In one such example, we announced initial production for new photonics with a new technology where we integrated indium phosphide lasers within our silicon photonics die. This is done through a die-to-wafer attach of indium phosphide InP chiplets further processed in our factory to create a final die that incorporates indium phosphide lasers within our silicon photonics. As this technology ramps, we gain access to the laser market and additional multiples of increase in serviceable market. This die-to-wafer technology is now being deployed with other materials such as thin-film lithium niobate to provide 400 gigabit per lane next-generation differentiated products to our Tier 1 lead customers. Beyond the optical transceiver market, our SiPho platform, combined with heterogeneous integration capability has emerged as a go-to solution for silicon photonics-based optical circuit switches. Silicon photonics-based solid-state OCS are emerging as a strong contender against MEMS or other niche solutions because of fast nanosecond level switching speeds, the CMOS manufacturing scale and compatibility with the CPO/NPO ecosystem for tighter system integration. Finally, we have been a significant player in coherent SiPho products for Marvell used in data center connect applications, as we have discussed in the past. This technology is now being evaluated for inside data center scale across applications, which could as well significantly expand the sector of the SiPho market, we already have strong position and differentiated technology. Longer term, we are also investing in several scale-up and scale-in wide and slow technologies, which promise high total bandwidth by creating large parallel links at lower speed through the use of micro LEDs and/or VCSELs. We have several active engagements ongoing with Tier 1 customers with the potential of high volume in a new facet of the optical communication market. As stated earlier, NPO is providing an expanding market for silicon germanium TIA and drivers, resulting in unprecedented customer demand being served now from 3 200-millimeter factories and 1 300-millimeter factory. In tandem with our capacity expansion, we continue to advance our technology road map and are happy to report that our H6 next-generation silicon germanium technology is seeing strong design-in momentum already in production for the most demanding products. The strength of our technology was also reflected recently when Semtech, a strategic silicon germanium partner of more than 2 decades, received an innovation award at ECOC '26 for its Optical Interconnect Solutions. Our 300-millimeter capacity corridor in Agrate, Italy delivered its highest RFSOI revenue quarter-to-date. We also set new records for the number of product tape-outs for Fab 10, demonstrating the strength of our long-standing customer relationships and the exceptional execution by our Fab 10 team to deliver the technology road map, extending the design win momentum on our industry-leading 300-millimeter RFSOI platforms. We expect this trajectory to continue over the coming quarters. Demand for Tower's BCD technologies continues to strengthen across both 200-millimeter and 300-millimeter platforms with about 10% year-over-year growth. This growth is driven not only by the rapid expansion of AI and cloud data centers, but also by growing customer success in mobile and automotive applications. This momentum is reflected in increasing customer commitments with several strategic accounts entering into long-term agreements at higher ASPs, resulting in forecasted 20% higher blended prices for 2027 versus 2026. In CIS and displays, we have started production of a new high-speed global shutter sensor for high-end video cameras with one of the DSLR MILC industry leaders. Together with our lead customers, we are driving next phase of business growth, building demand toward the significant additional capacity that will come online with the Uozu expansion. We're also working closely with our OLED on silicon display customers to provide capacity for their expected steep ramp in 2027. Looking at utilization. During the third quarter, all of our 200-millimeter fabs operated at utilization levels of 85% to 90%. Our 300-millimeter 12-inch fab continues to be fully utilized, well above our 85% utilization model. And as stated, substantial capacity is being added to all sites in accordance with extreme growing demand. To summarize, we entered the second half of 2026 with strong business momentum, supported by broad customer demand across our differentiated technology platforms and continued high utilization across our entire manufacturing footprint. Importantly, the strength we see extends beyond the current quarter, well beyond. Customer engagements, design activity and demand visibility continue to reinforce our confidence in growth opportunities ahead, enabled by the unique significant value, which each of our specialized analog technologies provide. Our prospects are very good and even getting better with all of our key business units experiencing increased demand with expected revenue growth throughout 2027. SiPho and silicon germanium are experiencing unprecedented growth, having achieved majority share of pluggable scale-out market. We're not only enjoying the substantial market growth of this segment, but by having close partnerships and cooperations with the market leaders, we are enjoying rich developments, increasing our served market, targeting to continue proliferation of our differentiated technologies into multifaceted applications. The number of advanced NPO engagements is just one of the many indicators of rich partnerships capturing the future. As a summary point, our Q4 '26 SiPho annualized run rate is expected to exceed $1.1 billion with significant target further increases in Q1 '27. We will end this year in an extremely exciting position. With that, I'd like to turn the call to our CFO, Mr. Oren Shirazi. Oren, please?