Russell Ellwanger
Analyst · Loop Capital
Thank you, Noit. Welcome to our second quarter of 2019 financial results conference call. Revenue for the second quarter of 2019 was at our guidance of $306 million, with EBITDA of $70 million and free cash flow of $28 million. Oren will provide full financial details later in the call. The second quarter was our first quarter within the new 3-year contract extension with Panasonic. We're able to offset, to a great extent, the $22 million Panasonic revenue reduction, having achieved good quarter-over-quarter organic growth of 11%. We guide further organic and total revenues growth for the third quarter.We're executing on exciting opportunities within all of our business units, many of which segue into new and large served markets. A particular interest, our 300-millimeter activities have resulted in very strong demand and forecasted excess demand, which we are now investing to meet. This investment has additional benefits that tie to substantial 200-millimeter partnership projects. I'll now review our business for the different business unit activities. In the first half of 2019, our RF mobile business experienced strong growth versus 2018, primarily as a result of strong design wins, one, during 2017 and 2018 in RF SOI for our advanced platforms, both in 200 millimeter and in 300 millimeter. 300-millimeter RF SOI has now ramped to high levels. They've executed on initial small CapEx and other projects to relieve some flow-related bottlenecks to meet present demand. Customer forecasts have grown well beyond our current 300-millimeter capacity. I will address this in a few minutes with our CapEx expansion plans.Of interest to note, our third quarter forecast presents the highest revenue quarter for RF SOI that the company has seen to date. In addition to our successful ramp of 300-millimeter RF SOI, we have introduced an industry-leading 200-millimeter platform, QT9, to address high-power switch and tuner applications. This new technology complements our digitally intensive 300-millimeter process and positions us for further growth in the strong 200-millimeter RF SOI market. We have one initial design slots in this process and anticipate ramping this new technology in late 2020 and into 2021. We expect overall growth in mobile to result from a combination of market share gains, a significant portion of 300-millimeter volume that has ramped recently, for example, are design slots we did not previously hold as well as general RF content growth in handsets due to increased adoption of sub-6 gigahertz 5G standards. And longer term, we view millimeter wave 5G to provide additional drivers for growth as this standard will enable integration of power amplifiers of our technology, first, today where most power amplifiers are built in 3 5 technologies, which do we do not serve.In the first half of 2019, our infrastructure optical silicon germanium business suffered from an industry-wide pullback, which is expected to run its course through 2019. Third quarter shipments will be lower than the second quarter, and we have not yet seen signs of rebound. In addition to inventory correction, the most recent U.S. government ban on Huawei may be further softening the short-term demand in this space. However, data traffic rates only continue to increase for all analyst reports. There's no question that data center growth will return, and hence, we look forward to enjoying and sharing with you the fruits of our high market share due to our differentiated high-end optical device performance in 2020 and beyond.Looking beyond current production, which is dominated by the 100-gigabit optical standard, we have strong design wins in 400 gigabit with new products in our highest performance silicon germanium H5 platform as well as our new silicon photonics platforms. To speed up the 400-gig design cycles for our customers, we announced this past quarter our further enhancement of our design kits to enable the co-optimization of silicon germanium and silicon photonic components in a single design environment. We anticipate that the new 400-gigabit silicon germanium and SiPho product lines, in addition to the recovery in the 100-g market, will provide strong potential growth in an area where we provide high value, and hence, are able to maintain significant ASPs. 400-gigabit products are just beginning to hit the market now and will ramp to significant portion of the market over the next few years.Our power business continues to see a good revenue stream, but, more importantly, an accelerated pipeline of design activity and more highly differentiated areas of high voltage and in 65-nanometer, 300-millimeter BCD. Our 300-millimeter 65-nanometer technology has best-in-class figures of merit for low-voltage power. During the first half of 2019, we delivered initial production volumes as well as continued to attract a large amount of prototyping activity. Decision to providing the ability to integrate large digital content, the platform provides a very low ohm resistance of low voltages, which has allowed some customers to remove their external discrete power fabs and integrate them directly on-chip, saving build-up material costs and board area, while improving our overall efficiency. The strong prototyping activity from Tier 1 customers in this technology has also contributed to our decision to expand capacity in our 300-millimeter factory, which I'll further elaborate on shortly.For higher voltage application requirements, we have won initial Tier 1 designs in our 200-millimeter, 140-volt technology we announced this past quarter. This technology targets the high volumes of automotive, data centers and industrial markets, which demand 48-volt to 125-volt operation, and is unique in that it provides a high level of integration, smaller footprint, using bulk silicon, hence, eliminating the need for expensive SOI starting material and providing an efficient, low-layer comp process flow. Also within automotive, we continue to see strong demand for a family of power management within lithium-ion battery stacks. To note, electric vehicle sales worldwide continued strong growth, driven primarily in China. We serve this exciting EV market and expect to see continual strong tailwinds with our advanced power management platforms within battery management systems. At even higher voltages, we received a Tier 1 design win for our new 200- to 300-volt power management within SOI technology.Looking into our CMOS image sensor business, our largest application and market is the industrial market. As previously discussed, we have seen a pullback, which our customers attribute to the trade war. It is starting to pick up now with new projects, many of which are targeted towards large screen display inspection using very high resolution global shutter sensors. All of our new projects are based on our state-of-the-art global shutter pixels in our 65-nanometer, 12-inch line in Uozu. We expect these projects to ramp towards the end of next year. Orders for present products are forecast by customers to recover with wafer starts beginning during the fourth quarter of this year.We have won a large face recognition sensor project for smartphones. It will be based on indirect time-of-flight technology and we'll use state-of-the-art stacking technology, utilizing our 300-millimeter, 65-nanometer platform. In parallel, for mobile applications, we are working with 3 leading fingerprint companies for under OLED and under LCD optical sensors, based upon our unique pixel technology. These projects are expected to begin to ramp in 2020, utilizing our well-established 0.18 micron, 200-millimeter CIS technology.In the high-end photography area, we're moving along with the next-generation stacking sensor project, partnering with an undisputed leader in the market, targeted to ramp in 2021. Medical and dental x-ray demand has remained stable with strong margins. We see an increased demand for large CMOS-based panels. We're now in the final qualification stages of new products with one of the leading providers. Additionally, we are fully qualified and started to ship single-die wafer-scale medical x-ray sensors on 300-millimeter with 2 additional customers planning final product tapeout in the fourth quarter of this year.Looking to the 300-millimeter capacity expansion. As a result of present capacity and forecasted demand growth of our highly differentiated 300-millimeter RF SOI, 65-nanometer BCD power management and imagers, both smallest pixel global shutter industrial imagers as well as high quantum efficiency stack imagers for facial recognition and high-end photography, we have decided to accelerate our planned expansion and to allocate $100 million to increase the capacity of our 300-millimeter Uozu fab in Japan. Equipment should begin to arrive in this center, with most to all tools expected to be qualified during the first half of 2020. This investment not only increases our 300-millimeter wafer capacity but will drive additional benefits that tie to new and large 200-millimeter partnership activities.In our TOPS business, although seeing an inventory correction pressure, mainly stated by our customers at their distribution channels, our TOPS business revenue comprised predominantly of power discretes, is stable after 2018 growth year, with continual refreshing of new developments with our largest partner and otherwise multiple new activities, which should turn into revenue in 2020.Specific to automotive, during the second quarter, we announced partnership with Lumotive, a Bill Gates-funded LIDAR startup, with successful demonstration of the first beam steering IC for automotive true solid-state LIDAR systems based on Lumotive's unique liquid crystal metasurface technology. Lumotive's complete LIDAR system will also utilize a custom silicon photomultiplier sensor using TowerJazz's cutting-edge single-photon avalanche diode technology.In addition, and very importantly, we announced an expansion of our manufacturing collaboration with our long-term successful partnership with Vishay-Siliconix for next-generation automotive platforms.In terms of utilization, Fab 1 was at 76% during the second quarter; Fab 2 utilization was 80%; Fab 3 utilization for the quarter was about 70% due to the stated decrease in silicon germanium demand for data centers; Fab 9, San Antonio facility, was at about 50% utilization, impacted by discretes. TPSCo blended utilization remained at an average of about 50%, with foundry utilization having gone up substantially, and specifically, Uozu 300-millimeter foundry up 33 points.In summary, we started the second half of the year having shown good organic growth and guiding a 6% organic growth for the third quarter, resulting in a $312 million midrange guidance. We are seeing very strong demand in 300-millimeter, the fruits of past year's developments of advanced 65-nanometer platforms in RF, power and imaging, and as stated, our investment to grow the capacity to support the increased demand with customer forecast showing continued growth throughout all 2020, and then as well for 2021 and 2022. This CapEx expansion should begin ramping into increased revenues at the end of the first half of 2020.At this time, I'll turn the call to our CFO, Mr. Oren Shirazi. Oren?