Russell Ellwanger
Analyst · Drexel Hamilton. Please go ahead
Thank you, Noit. Welcome to our second quarter 2018 results conference call, thank you for your interest. Our second quarter results were in line with the expectations, with revenues of $335 million, a 7% increase over the prior quarter. EBITDA for the quarter was $96 million, representing a 55% contribution from incremental growth for our model. Net profit for the quarter was $38 million. We generated free cash flow of $37 million. Our first half represented a 4% decrease as compared with the same period of 2017, following regular industry seasonality with also the industry noted specific mobile market weakness, with some customer inventory corrections due to over ordering at the end of a very strong 2017. Where it was possible to transfer for the benefit of higher margin, silicon germanium capacity in Fab 3, we transferred several non-silicon germanium aura flows [ph] to San Antonio for qualification, but not everything could transfer leaving some gap. Lastly, having expected the recovery, which did not occur from recent reports it is apparent that one of our major power management customer’s end customer has lost substantial market share. This revenue will be restored through our 300 millimeter activity, which we will talk about. Entering the third quarter, we have the proper wafer start plan and product mix to transition us to a fourth quarter targeted record revenue. For the silicon germanium infrastructure technology, given its strong and higher than originally expected customer demand. And hence the high number of customers in flow variant that needed to be qualified, the shipment profile from recently added capacity is pushed up slightly. Customers were notified of increased silicon germanium capacity and starts have now been maximized expecting full revenue realization in the fourth quarter. As our customers, mid to long-term demand for silicon germanium exceeds our newly acquired capacity we are investing in additional CapEx for our Newport Beach facility, targeted to begin qualification in the first quarter of 2019. Additionally demand remained strong for discrete power and all of our 300 millimeter offering. Our major focuses for this year are, firstly, various organic activity focused on increasing our served market, targeting additional mid to long-term organic growth. These include among other analog, artificial intelligent, virtual reality, silicon photonic, sensors and automotive sensor fusions. And for the short-term the two major focuses have been, Newport Beach mix shift to high end silicon germanium infrastructure market and ensuring high yielding flow capabilities for the Q3, Q4 400 -- 300 millimeter ramp. In line with this, we continue to see growth second half versus first half of this year, forecasting the third quarter mid-range guidance flat of $355 million and transitioning to a targeted record fourth quarter revenue of about $360 million to $380 million, representing above 25% organic Q4 growth over Q1. The growth drivers remain as stated, the 300 millimeter production ramp and the increased capacity and customer demand for silicon germanium. First in reference to 300 millimeter, over the past years TowerJazz and our TPSCo 300 millimeter factory has developed and refined process flows and PDK offerings in three strategic segments. Namely, radio frequency, power management, and CMOS image sensor. The specific end markets we are serving in these segments are RF low noise amplifier and switch for mobile application, low voltage power management ICs less than 30 volt, with an industry lowest RDS (on) on figure of merit and associated 65 nanometer logic circuitry benefit and image sensors for multiple end market applications to include machine vision, DSLR, medical X-ray and surveillance. We continue to engage with multiple industry leading customers in an effort to meet or exceed their stringent state-of-the-art figures of merit. The fruits of our labors can be observed in the high number of new products introduced into our 300 millimeter factory being well distributed over the three general market segments. I’ll provide additional information for each of our business unit activities later in the call. Secondly with silicon germanium, we continue to focus on qualifying and increasing our silicon germanium manufacturing capacity in both our Newport Beach and San Antonio manufacturing facilities. We just recently reached the full wafer start capacity in Newport Beach, which is a 75% ramp in Silicon germanium against the 217 Newport Beach run rate. And while the ramp and start is only a small impact to wafer output in the third quarter, we will see full revenue impact in the fourth quarter of this year. We are progressing well with the San Antonio silicon germanium qualification adding an additional 25% capacity against our 2017 run rate with production starting in Q1, 2019 and ramping through the third quarter of 2019. Strong customer demand in silicon germanium not only continue, but is increasing, resulting in additional tool buys for Newport Beach, which will enable our further increase of over 15% silicon germanium output, which should be running and in qualification at the end of the first quarter of 2019. We plan significant revenue production ramp in the fourth quarter, positioning ourselves with accelerate our organic growth, carrying forward into 2019. In terms of utilization rates in the quarter, Migdal Haemek Fab 1, our six-inch factory was at 95% utilization, Fab 2 our eight-inch factory was at about 85%. Both have increased compared with 90% and 80% respectively in the previous quarter. The Newport Beach California Fab 3 our eight-inch factory we are at about 85% utilization versus 80% in the prior quarter. The 3 TPSCo factories had an average of about 50% utilization, similar to that of past quarter with third quarter start ramp in 300 millimeter planned to triple the present run rate. Our San Antonio factory Fab 9 was about 60% utilization compared with 55% last quarter, with an expected 20% increase in the third quarter for third party wafer starts. Additionally, with regards to our operations, we have recently notified our customer base of a price increase as a result of continued silicon price increases to us. Our industry is experiencing shortages of silicon wafers along with significant price increases. With the strong business continuity plan in place, our global sourcing organization has ensured sufficient silicon supply thus mitigating any and all shortage impact to our customers. As part of this BCP, we have qualified multiple suppliers and or entered long-term supply agreements for each of the more than 50 silicon substrate types that are required for our customer products. We have been successful at minimizing substrate cost increases through these multi-sourcing activities. To-date we have absorbed this increase through other general ledger accounts with the hope that the substrate market would normalize. But with the continuation of this trend, we have notified our customers of silicon wafer price attars to new orders, which should positively impact 2019 revenue and margins. I would now like to spend some time discussing performance specific to our various business units. Starting with the RF high performance analog business unit. We have strong and continued growing demand for silicon germanium. This is driven by the 100 gigabit per second data center and cloud computing segments for which we manufactured fiber optic components. As stated, we have begun wafer starts to full capacity of this silicon germanium ramp and expect to see the full revenue impact of the increased SiGe capacity in the fourth quarter and are adding even additional capacity in Newport Beach targeted to be in qualification by the end of first quarter 2019. We also expect to be in revenue SiGe shipments from our San Antonio factory in the first quarter of 2019. As part of the plan to move to a higher silicon germanium rich mix in Newport Beach, we executed a successful qualification and have begun a substantial ramp for RF SOI and other wafers in San Antonio that were displaced from Fab 3. To further increase our silicon germanium served markets, which is our most highly differentiated RF technology. We have added more content to the site for applications. And we are happy to report that we are beginning production of our first silicon photonics project and have launched multiple others, including a project that will ultimately integrate indium falsified lasers and modulators into the silicon photonics platform, process in our Newport Beach eight-inch facility. For silicon photonics, our lead customer recently gave us their technology partner of the year award. We announced the initial ramp of 300-millimeter RF SOI in our Uozu facility in Japan. This is a significant milestone for our RF business units and for TowerJazz. As we take advantage of added capabilities and capacity at 300-millimeter. 300-millimeter provides our RF SOI customers, not only a very high performance switch, but also the ability to integrate state of the art, low noise amplifiers and large amounts of digital content on the same die. While relevant for products today, this added capability can address a segment of the front end module market that we expect will grow significantly in the next years with the advent of 5G and MIMO technology that multiplies the numbers of antennas, low noise amplifiers and complexity required in a handset. We also announced signing of substantial contract with SOI Tech to supply 300-millimeter RF SOI wafers, ensuring customer supply for years to come. This contract adds to our already strong 200-millimeter business with SOI Tech. For continued leadership in mobile platforms over the next years, we continue our RF SOI roadmap, but also are working on advanced technologies that can leap frog present RF SOI performance. This includes RF MEMS we have customer programs and are delivering today volume production on initial generation products, as well as working on next generation projects that will address a much larger portion of the total RF switch market, as well as a new proprietary technology that relies on different material to provide breakthrough switch performance for which we are now engaging lead customers. Moving on to the CMOS image sensor business unit. We had announced the new 25 megapixel sensor using our state-of-the-art and record smallest 2.5 micron global shutter pixels with Gpixel, a leading industrial sensor provider in China. The product is achieving very high traction in the market with samples having been delivered to major and to customers. Another leading provider in this market, who has worked with us for many years will soon release a new global shutter sensor based on the same platform. Both of the above mentioned sensors are the first for families of sensors with different pixel count resolutions for each of those customers next generation industrial sensor offering ranging from 1 megapixel to above 100-megapixel. We expect this global shutter with this outstanding performance based on our 65-nanometer 300- millimeter wafers to drive high volumes in 2019 and the years following. We see this as a key revenue driver from our industrial sensor customers. In parallel, e2v is ramping to production with its very successful Emerald sensor family on our 110-nanometer global shutter platform using state-of-the-art 2.8 micron pixel with best in class shutter efficiency and noise level performance. We recently released our 200-millimeter backside illumination for selected customers. We are working with them on new products based on this technology, as well as on upgrading existing products from our front side illumination version to a BSI version, increase in the quantum efficiency of the pixels by using BSI, especially for the near IR regime within the industrial and surveillance markets, enabling our customers improve performance of their existing products. As a bridge to the next generation family of sensors in our advanced 300-millimeter platform. The medical X-ray market, we are continually gaining momentum and are working with several market leaders on large panel dental and medical CMOS detectors based on our one dye per wafer sensor technology using our well established and high margin stitching with best in class high dynamic range pixels providing customers with extreme value creation and high yield both in 200-millimeter and 300-millimeter wafer technology. We presently have a strong business with market leadership in this segment and expect substantial growth in 2019 on 200-millimeter with 300 millimeter initial qualifications that will drive an incremental growth over the next multiple years. For mid to long-term accretive market growth, we are progressing well with a leading DSLR camera supplier and have as well begun a second project with this customer, using state-of-the-art stacked wafer technology on 300-millimeter wafers. For this DSLR supplier, the first front side elimination project is progressing according to plan, expecting to ramp the volume production in 2020, while the second stacked wafer based project with industry leading alignment accuracy and associated performance benefits is expected to ramp to volume production a year after. In the narrow network field, we made substantial progress and expect that we will start to ramp multiple mobile platforms towards the end of 2019. In addition, we are progressing on two very exciting programs in the augmented and virtual reality markets, one for 3D time of flight-based sensors and one for silicon-based screens for a virtual reality, head-mount displays. We are addressing the power management IC market with four major activities. First, best in the world up to 16 volt 300-millimeter, 65 nanometer BCD platform. Secondly incorporating 1.2 volt to enable high-gig count logic to this previously mentioned best-in-world flow, adding advanced reprogrammation NVM to our 0.18 micron BCD platform. And fourthly, adding high-voltage offering of up to 140 volt breakdown to the 0.18 micron BCD platform. I'll spend a little bit more time on the first two activities. Our 65 nanometer platform provides a unique combination of advantages over the competition. With an ultralow RDS on, less than 1 milliohm square meter to the 5 volt LED mass versus the otherwise industry best of 1.1 milliohm square millimeter for IDM and 1.2 milliohm to 1.3 milliohm square millimeter for foundries. For projects which operate at the megahertz switching frequencies, the 65 nanometer BCD powered transistor benefits from a very low Aura on QTD down to 2.6 milliohm nanocoulomb and low mass counts for the 65 nanometer BCD platform. This positions us as the technology leader in this multi-billion dollar market of up to 16 volt operational power management. And we continue to receive very high interest from multiple customers, including leading power management companies targeting a very wide range of products across various market segments. This includes, mobile Pemics load switches, battery management ICs for PCs and servers and DC-to-DC converters. So far in the short time since we released the PDK, more than 20 customers has downloaded the design kit that are in various stages of evaluation and design. Multiple customers boarded our June wafer shuttle with products and test chips. The platform initial ramp to productions plan for the fourth quarter of 2018. And we expect this platform would one of our main power management growth drivers in 2019 and beyond. Secondly, we are increasing our market coverage by expanding this platform to support 1.2 volt transistors targeting to release this quarter. These advantages will provide our customers with performance superiority, as well as with new opportunities for integrated high-gig count logic with power managed devices all on the same dye. The integration of logic and power management will enable new types of devices and will significantly reduce the overall system level costs as well as minimize the PCB footprint. This for the reason that two different ICs will be integrated into one. To discuss the TOPS business unit, the focus of our TOPS business unit is working with our customers to co-develop and or transfer unique process growth, for which we provide capacity under a long-term supply agreement. Throughout the first half of 2018, we successfully ramped our TOPS capacity in multiple of our manufacturing facilities. The greatest revenue portion of it is based upon IDM partnerships, specifically driven through co-development of discrete power device next generation platforms, built upon customers transfer technology. Significant dimension, these activities are now loading our first facility our six-inch facility even presently to record breaking high utilization rates. The second focus in this business unit, our partnerships for co-development for unique market application or very unique process features or implementation of unique technologies for highly differentiated end products and product applications. Example for the latter are biosensors differentiated magnetic sensors, digital MEM speakers and specialized high-end accelerators. Among this grouping, we have recently started engagement with a lead Tier 1 customer at our 300-millimeter facility. In summary, we have solid expectations for the latter half of 2018, especially with regard to organic growth in the fourth quarter, as a result of continued investment in our capabilities. We remain profitable and a strong cash generating business, serving various high growth markets and technology. The second quarter showed our expectations are on track to achieve our financial model targets with incremental growth operating and EBITDA margins of between 50% to 60% on incremental revenue growth. With that, I would like to turn the call over to our CFO, Oren Shirazi, Oren please.