Aart de Geus
Analyst · Mitch Steves with RBC Capital Markets. Please go ahead. Your line is open
Good afternoon. Q1 was a very good start to the year as we met or exceeded all of our guidance targets. Revenue was $970 million, with GAAP earnings per share of $1.03 and non-GAAP earnings above our target range at $1.52. The business was strong across all geographies and product groups. And for the year, we are reaffirming our guidance with low to mid-teens non-GAAP EPS growth, revenues surpassing the $4 billion milestone, non-GAAP operating margin of 29% to 30% and more than $1 billion in operating cash flow. Meanwhile, our markets are strong. Wherever one looks, be it at AI and machine learning, hyperscale-enabled cloud computing, 5G, next-generation automotive, massively connected IoT or software enhanced medical devices all require more chips and software. Chips to store and move huge amounts of IoT data through the cloud, chips for massive general compute and AI-driven smarts in every vertical end market, still more chips to tie these huge hardware-software systems seamlessly together and make them both secure and save and the escalating need for ever more secure software with embedded on an electronic system or in the enterprise software space. This is the center of gravity for Synopsys With our product portfolio that not only excel in advanced system-on-chip design, but reaches down into the critical foundation of silicon manufacturing and up to the intensifying needs of smart software, we are uniquely positioned at the heart of this opportunity space. It's quite rewarding to see the adoption and business momentum of the innovations we've introduced over the past several years and the enthusiasm around our further expansions into brand-new domains through our next wave of technology disruptions. Let me share some highlights, beginning with EDA. Our groundbreaking Fusion Design Platform continues to drive proliferation and competitive displacements, supporting strong revenue growth. This includes major expansions and evaluations at historical competitor strongholds. Customers clearly recognize our leadership at the most advanced nodes now down to 5- and 3-nanometer. Our Fusion Compiler product, specifically deliver superior performance, power and area results with numerous competitive wins and wide deployments with influential, high-impact semi and systems companies around the world, we see growing business momentum. Integral to our sustainable differentiation is native integration of our golden signoff product, which guarantees the most accurate and timely results. Our deep collaboration with foundries ensures that our mutual customers can access the most advanced technologies with well honed design flows. This quarter, for example, we announced the collaboration with Samsung Foundry to deliver the fastest design closure and signoff for five and three nanometers. We continue to also see good growth and momentum in custom. We again added several new Custom Compiler customers, including two in the wireless communications segment, also further inroads with memory companies who are adopting our complete end-to-end custom solution. A never-ending challenge in today's complex designs is verification not only of the chips, but also the intersection of the chips with the software that runs on top of them. Our verification continuing platform is uniquely powerful in this sweet spot of modern design and is driving strong growth. Adoptions are expanding rapidly at influential customers, ranging from leading hyperscalers to automotive to the most sophisticated global semis and systems companies. For example, AWS which utilizes our verification software to accelerate the development of data center chips and automotive supplier automotive for its autonomous driving applications. Strong demand continues for our market-leading hardware solutions. Just this quarter, we added 10 new customers and had 45 repeat orders. The power of our comprehensive design plus verification solution is evident in full portfolio adoption. This quarter, it included a global design services leader who adopted both Fusion and Verification platforms for highly complex designs, replacing their legacy tools. Now to IP, where we again delivered strong double-digit revenue growth. Outsourcing of sophisticated IP blocks continues unabated. Our track record of innovation, reliability and advanced node leadership have led to our number one position in interface, embedded memory and foundry-specific IP. We provide the broadest portfolio by far, accelerating time-to-market and reducing risk for our customers. This quarter, we continued to show strong momentum across multiple applications and products. In high-performance compute, which is one of the most dynamic segments today, our comprehensive IP portfolio has driven more than 450 wins in 7-nanometer and over 100 in 5-nanometer. We achieved silicon proof of our 112-gigabit Ethernet PHY on 5-nanometer, driving the leading-edge in this key product area. With the tremendous growth in Internet traffic, security is a big concern in protecting the data transfer in hyperscale cloud centers. This quarter, we launched the industry's first security IP modules for PCI Express 5.0 and CXL communication interfaces. We have already secured the first design win with a growing pipeline. Building on our lead and advanced technology, we released the first phases of our 3-nanometer foundation IP offerings. Building on our innovation and momentum in EDA and IP, we have invested in unique and breakthrough solutions to next-generation challenges that our customers face. We do this in close collaboration with ecosystem partners through a combination of R&D and technology acquisitions. While we have a number of these in our innovation pipeline, let me highlight three that we recently announced: one, 3D multi-die design; two, AI-driven design flows; and three, silicon life cycle management. Starting with 3D multi-die design. Think of it as combining and stacking multiple die together not on the board, but on a specialized large chip. This leads to extremely tight configuration with much higher data speed and bandwidth than with a traditional board and packages approach. Our new 3DIC Compiler product enables the design and analysis of these complex 3D systems, taking full advantage of our technical breadth by leveraging both Fusion Compiler and our signoff tools. Early momentum is building rapidly with expanding evaluations and adoptions. Designers are seeing the performance and capacity benefits of a single environment and are beginning to move away from older mix-and-match solutions. For example, 3DIC Compiler helped a large Asian semiconductor company complete a highly advanced test chip in record time, saving weeks of design time. With this, we also combined our high-bandwidth memory and die-to-die IP that enables interconnecting these complex systems. Moving next to AI-driven design. We have a breakthrough and already award-winning new solution, DSO.ai. DSO stands for Design Space Optimization. While maximizing the contribution of engineering teams, DSO.ai leverages machine learning techniques and computation to explore the design space for still better solutions in terms of chip performance, power and area. This autonomous search substantially accelerates the work of the human design team. Indeed, in Q1, customers using DSO.ai reported remarkable productivity improvements, consistently realizing better results in a fraction of the time and effort typically required. On top of that, multiple production tape-outs have recently been completed. Our customers are already holding DSO.ai as an anchor product and are beginning to deploy across their organizations. Finally, Silicon Lifecycle Management, a new platform to monitor, analyze and optimize chips as they are designed, manufactured, tested and deployed in the field. Synopsys is uniquely well equipped to provide a comprehensive solution through our long-standing expertise in design, manufacturing and IP. We add sensors, monitors and data analytics on chip to provide insight to test yield and reliability management tools. This gives smart visibility into critical performance, reliability, safety and security issues for chip's entire lifespan. In Q1, we expanded our capabilities with the acquisition of Moortec which provides leading-edge process, voltage and temperature sensors. Initial interest and activity are strong and expanding. We're in talks with a number of leading IDM and fabless customers. We're also engaged with major cloud service providers to deploy aspects of our solution into their platforms. These new innovation areas create not only new business growth opportunities they also leverage strong cross disciplinary expertise in Synopsys from design to manufacturing to IP. Now to Software Integrity, testing software code for security vulnerabilities and quality issues. We delivered a solid beginning to the year and are on track towards meeting our fiscal '21 goals to reaccelerate growth. As I mentioned in December, we have implemented several important enhancements, all showing encouraging progress. First, evolving our go-to-market strategy and customer success organization including tuning our sales coverage and building an indirect channel program; second, bolstering our strategic consulting capabilities to better serve growing market needs; and third, evolving our product road map to capitalize on the latest security trend. These improvements are beginning to show in our results. All geographies delivered at or above plan. We have numerous multimillion-dollar new agreements and sizable expansions with customers ranging from industrials and aerospace to electronics and financial services. The trend towards adoption of multiple products continues. Customer interest in a consulting-led approach to software security is growing. Recent publicized security breaches only underscore that need. Our expanded team is ramping up, and we see very good long-term opportunity. In addition, industry analysts continue to recognize the quality and breadth of our portfolio. Synopsys was again named a leader in the Forrester Wave for static application security testing. To summarize, Q1 was a very good start to the year. We delivered strong financial results and are reaffirming our outlook for fiscal Our markets are healthy as customer investment in critical chip and system designs as well as immense amounts of software remains very strong. Our differentiated portfolio of solutions including exciting innovations in brand-new areas of technology disruption is generating high demand and strong growth. Lastly, keep an eye out for our second annual corporate social responsibility report to be published in the next few weeks. We're proud of the progress we've made in the areas of environmental stewardship, social solidarity and corporate governance. We look forward to sharing with you our metrics and future objectives. With that, I'll turn it over to Trac.