Thomas J. Sonderman
Analyst · Craig-Hallum.
Yes. So on the advanced packaging front, clearly, a lot of the focus over the last year has been preparing for the wave of tools that are now coming into Florida. That is underway as we speak. Our goal is to be able to have prototype availability a year from now that would allow customers to start creating packaging solutions based on our technology. The focus, obviously, coming out of the box is with the defense industrial base. That's why the DoD funded the standup of this platform. So there's interactions that are ongoing with that community. Many of those customers are the same ones we deal with for our ThermaView platform as well as our Rad-Hard platform. I also -- and we've talked about this before, but we also expect the commercial segment to be very interested in this technology, and we continue to engage with them. And then the last thing I'll remind everyone is we did have a technology, an interposer technology that we stood up that was in flight when we took over back in 2021. That capability is now also being marketed to the defense industrial base. So overall, I would say the traction is there, and we continue to build momentum with that community in the AP space, where we believe we have the only true foundry solution that is available with capabilities that not only exist today with our bonding and interposer, but in the future with our fan-out technology. And then in quantum, obviously, our focus is around superconducting base film technology. But we've also, as we've alluded to before, been engaged with SiQuantum, and that's a combination of superconducting technology and waveguide technology via photonics. And so, we see those 2 vectors continuing. Obviously, there's technologies like ion trap that also get discussed a lot in the quantum space. That is an area that we continue to look at in terms of viability. I think capability-wise, we certainly have that as an option. It's just a question of what the right combination of our capabilities coupled with customer need. One thing that we are very proud of is that we not only have our front-end capabilities with superconducting films, but we also have some very strong capabilities now with our interposers and chiplet strategies. And these are foundational, as I alluded to in my remarks, to building out quantum computing capabilities. And so all these will come into play, and we expect to not only discuss later this year our new platform for supercomputing, quantum computing, but also talk about some new customers. Does that answer your question, Richard?