Yes. Clark, it's a great point. It was an interesting SEMICON, I think, because it's the first time SEMICON West was not in San Francisco, people couldn't go in and out. You're kind of stranded in Phoenix. So there was a lot more informal conversations. And we did meet with also a lot of our -- not just our equipment customers, but I would say our fabless customers and a lot of our fab customers. And what we heard were a few things. Yes, the build-out on AI is continuing to go on. All the equipment customers participating in advanced packaging, everything around advanced nodes, on logic side do see and on the DRAM side, do see a pretty rosy outlook for 2026. I do think they're in a pretty strong position. Our customers selling into automotive, industrials and communications, the ones with very differentiated products do seem to be talking about a robust 2026, I think that's still a mixed bag. There are customers in that sector that have some challenges to work through, but I would say for the first time, the kind of ones that have very differentiated products that are much more bullish. So I would say you start seeing kind of a more broad base of enthusiasm within the customer base, than, I would say, 3 months ago or 6 months ago, where it was really limited to just the people on the very advanced nodes and advanced packaging. So I do think it was more broad, not fully, I would say, not fully broad to everybody, but definitely more broad than where it was in terms of positiveness than where it was 3 or 6 months ago. And then lastly, I would say, our fabless customers as they are becoming more and more embracing advanced packaging are recognizing they're becoming a manufacturer. And that means ability to communicate with the OSAT, more complex test data feed forward and other test flows. We had a lot of dialogues with customers on that topic and how can they effectively become more aware of what's going on in manufacturing. In the past, they would order a wafer from the foundry. And once they hit wafer sort, there wasn't a lot to worry about. But now they've got everything from operationally make sure they have organic substrates available and manage the supply chain of that -- of the production post the wafer sort as well as having many more test insertion points and needing to be efficient in how they leverage. And we've heard a lot of dialogue from customers in that regard. And I think that will be a growing area, as we move from just the very few high-valued, not terribly high-volume chips driving advanced packaging today to a much broader set of customers trying to leverage these advanced packaging test flows.