John Kibarian
Analyst · CJS Securities
Thank you, and welcome, everyone. If you have not already seen our earnings press release or written management report, please go to the Investors section of our website where both are posted. Today, we will discuss our business progress during the second quarter of 2018 as well as our view of the general semiconductor environment. I will also describe the business environment we anticipate for the remainder of the year and our plans to address it. Selling activity in the second quarter was consistent with our view of the general business environment, evidenced by the significant contracts closed in the second quarter. These include a 7-nanometer DFM contract with a large system company, a contract with an Asian foundry to use Exensio-Control and our CV infrastructure for 28-nanometer production control; a services contract for custom Exensio modules for an enterprise customer; a multiyear contract for Exensio-Test and Exensio-Yield for an RF fabless semiconductor company; and multiple other contracts on the Exensio platform in various modules, including Exensio-Test and related services. The logic semiconductor industry is going through a very big transition. The driver for this industry has been transitions to leading-edge processes. It was evident years ago that the transition to new nodes was slowing and investments were shifting to derivative nodes where electric scaling dominates over geometric scaling, NAND advances and multichip packaging. In the past, majority of our revenue came from Integrated Yield Ramps or IYR solutions delivered to second-tier foundries investing in leading-edge processes. Our anticipation was that our business for bringing up new nodes would slow, while our business in controlling product manufacturing across the manufacturing supply chain would grow. A number of years ago, we invested to move PDF's business from a dependency on the introduction of new process nodes to value across the manufacturing lifetime. Moreover, we invested in technologies internally and through acquisition that made our solution more valuable to fabless and system companies. These investments include Exensio and related software acquisitions, DFI and our next-generation test platform. This past quarter demonstrates that if anything, the transition is happening faster than expected. We saw a continued decline in our yield ramp business with second-tier foundries. We also saw increased business with system companies and fabless companies as well as deployment of our vehicles, software and systems to control existing manufacturing lines rather than bringing up new technologies. Turning to gainshare. As we saw in Q1 of this year, 14-nanometer revenue in Q2 was more than 70% of the total gainshare revenue. We expect this trend to continue through the remainder of the year. Despite this decline in IYR activity and soft gainshare, the new investments we've been talking to you about for a few - the last few years, including new applications of our CV infrastructure targeted at More-than-Moore technologies, our Exensio big data platform and our Design for Inspection or DFI solution, are beginning to reap benefits. These products and services receive a strong level of interest in the marketplace, and business activity related to them is good. Exensio demand, while strong overall, is focused on applications that leverage our customers' ability to manage quality and yield from design and manufacture through multichip assembly and packaging. Total revenue in the quarter from these newer products and services contributed more than 50% of our design-to-silicon solutions revenue. Turning to DFI. While the listed contracts posted in Q2 mentioned previously did not include the - an extension or new contract with the lead customer, discussions continue, and we remain optimistic that one will close in the near future. In addition, we have a number of ongoing demonstrations, including our newest eProbe 250 system that is testing customers' product wafers in our Milpitas facility. In the second quarter, the system identified leakage defects in product chips. These were verified by customers. This is an important customer - this is important for customers building chips for AI and high-performance computing applications. For these customers, with their stringent requirements, the eProbe 250's ability to find leakage paths in line is particularly valuable. This demo activity, along with expansion in the number of products and test chip designs that include DFI, will drive demand for future DFI system sales. For the remainder of the year, we believe the majority of our business activity will continue to be focused on our solution for fabless system companies and More-than-Moore fabs. We anticipate the spending in logic foundries, particularly the second-tier foundries, to remain soft, which means a key part of our overall revenue will be - continue to be impacted. As a result, we expect 2018 to continue to be a challenging year from a revenue perspective. As we look to the third quarter, we have a number of new customer selling activities ongoing, but the timing of closing these activities is not yet clear. Further, revenue from DFI, Exensio and contracts covering CV infrastructure plus Exensio for legacy fabs are primarily recognized on a ratable basis. This means these new contracts, when signed, will not significantly impact revenue in the quarter. Hence, at this point, as you'll see in our outlook in the management report, we are cautious in our expectations for Q3 revenue. As a result of a volatile market environment that we are experiencing and the slower revenue recognition related to usage-based models, we began taking some actions in Q1 to reduce our spending. These actions were primarily focused on our yield ramp business in the U.S. and Europe. As we move through the remainder of this year, we will continue to look for opportunities to further reduce spending associated with our yield ramp business. While experiencing some savings due to the completion of the eProbe 250 hardware development, the savings will be offset by further investments in Exensio and field applications for DFI. However, we expect our overall spending rates to continue to decline. In summary, we continue to transition PDF's business from dependency on the introduction of new processes to value across the manufacturing lifetime. Moreover, we are adapting our technology, which was primarily used in leading-edge fabs, to increase relevance to fabless and system companies. These changes are aimed at diversifying our revenue sources, returning the company to growth and providing a more predictability to our financial performance. With this, I'll turn the call over to Greg.