Gaby Waisman
Analyst · Bank of America Securities. Please go ahead
Thank you, operator. Another growth driver is our innovative and unique technologies and portfolio. Let's take, for example, the proliferation of our ELIPSON materials metrology platform. We already have multiple systems at customer sites, we have received several repeat orders and the system has been selected by customers as the tool of record for advanced nodes due to its ability to provide device performance indicators previously available only via electric testing. This selection as tool of record reflects the potential for additional orders as production transitions to high-volume manufacturing. We are seeing more process steps diverted to the system, displacing other metrology techniques and solving applications on the device measuring unique material characteristics that in the past were limited to test structures and blanket wafers. Furthermore, as in the case of VERAFLEX, initial demand stemmed from advanced R&D gate-all-around applications, but now we see new in-line metrology applications in memory devices that were simply not performed before ELIPSON became available. And if we look at METRION, here too, we have a growing customer base, and we expect to add some of the world's leading global logic and memory manufacturers to the list by the end of 2024. Another growth stimulus came in the form of a recent sale of our Nova FIT machine learning software solution to a leading global manufacturer, driven by a new capability called MAPRO [ph]. MAPRO [ph] provides high-resolution, full wafer sampling for early detection of process excursions, avoiding increased physical wafer measurements and leading to a faster yield learning curve and improved process control. The third engine to propel our business in 2024 is advanced packaging, an area where we see multiple achievements and opportunities for Nova. The Nova PRISM 2 was recently selected by a leading foundry as part of its most advanced node tool set to address hybrid bonding process applications and additional advanced packaging metrology challenges. We have initial orders for multiple systems with more expected due to PRISM's unique ability to make robust measurements in the presence of underlay variations, a capability critical to effective production. Following a highly successful demo, another leading logic manufacturer is also evaluating PRISM 2 for advanced packaging applications, such as through-silicon via, as a better and more effective alternative to its current vendor. In addition, we recently received orders for integrated metrology and for Nova direct metal replenishment solution targeted for advanced packaging from leading memory customers. Elsewhere, we are working closely with our customers to bring vital capabilities to bear on problems they encounter as they reach inflection points in CMP and plating processes of advanced packaging and face unprecedented challenges. Finally, I want to highlight our service business, which secured record high revenues this quarter. While current utilization levels may impact short-term growth rates, we offset this effect by increasing the contract portion of our total service revenue by approximately 20% year-over-year. With that, I would like to recap our third quarter results. Nova had a strong quarter against the backdrop of market softness and an increasingly complex environment. As we look ahead into the next quarter and the coming year, we expect to continue our strong execution. We trust that the fundamentals of both our company and the semiconductor industry will steer us into a trajectory of growth and outperformance. Before I turn it over to Dror, I'd like to thank our global and Israeli team for their support, commitment, resilience and dedication. We are fortunate to have an incredible team that is committed to our success. Now for some more details on the financials, let me hand over the call to Dror.