Steve Daly
Analyst · Needham & Company. Your line is open
Thank you and good morning. I will begin today’s call with a general company update. After that, Jack Kober, our Chief Financial Officer, will review our Q3 results. When Jack is finished, I will provide revenue and earnings guidance for fiscal Q4 and then we will be happy to take some questions. Revenue for the third quarter of fiscal 2024 was $190.5 million and adjusted EPS was $0.66 per diluted share. During the quarter, we generated over $40 million of free cash flow, and we ended the quarter with approximately $521 million in cash and short-term investments on our balance sheet. Our business remains healthy and profitable, and we continue to generate strong cash flow while investing in future growth opportunities. In Q3, our book-to-bill ratio was 1.1:1. In our turns business, where orders booked and shipped within the quarter was 21% of our total revenue. Booking trends are one of the most important metrics we track as they are a leading indicator of future revenue. We recognize bookings can be volatile. However, we are pleased that this is the third quarter in a row that our bookings improved. It’s also the second time in 12 months that we achieved a quarterly book-to-bill ratio of 1.1. New order demand was strongest in our I&D and Data Center end markets. Q3 revenue performance by end market was as expected, with Industrial and Defense at $90.9 million, Telecom at $50.6 million and Data Center at $49 million. For the quarter, Data Center was up 13.6% sequentially, Telecom was up 7.1% sequentially and I&D was flat sequentially. I’ll note that our I&D business had record revenues in the prior quarter. Industrial and Defense is our largest market, and our I&D revenues have been steadily growing over the past few years. We believe the secular trends for the I&D market are favorable and our growth strategies are working. Our focus over the last few years has been strengthening our engineering capabilities to better serve these customers. For example, we approach our Defense customers as merchant suppliers of high-performance IC components. In doing so, we offer standard and custom IC and packaged solutions to support their needs. We embraced custom design projects, which we view as a great way to build strong relationships with our customers’ engineering teams. We also offer our Defense customers access to our wafer foundries in approximately 20 proprietary process technologies. In some instances, our Defense customers have their own wafer fabs and IC designers, but they are inclined to use DoD trusted foundries like MACOM to access differentiated process technologies. And we offer to design and manufacture custom component module and subsystem solutions, but only in areas where we have high MACOM IC content and true subsystem expertise, which typically revolves around millimeter wave, very high RF or microwave power, filtering and switching and specialized fiber optic subsystems. On last quarter’s call, I highlighted electronic warfare radar anti-drone and integrated battlefield systems as 4 examples of defense applications, which can utilize MACOM’s technology. We see a number of large opportunities across these and other application areas at our major Defense customers. As a reminder, our focus has been and will continue to be developing products and technology for the highest frequency, highest power and highest data rate applications. We are pleased that our newest technology and latest products are being evaluated and adopted by leading defense OEMs and government customers. And finally, I’m pleased to announce that during the quarter, we were awarded a special development contract from the U.S. Air Force. Under the contract, we will conduct research and development on microwave filter technologies using novel epitaxial and semiconductor processing. We are excited to begin the work, and we believe our efforts will help improve the performance of next-generation defense systems, which require more precise filtering. We are pleased to see that our Telecom end market revenues have stabilized, albeit in a generally weak environment for a few of our core submarkets. I’ll note, we are not seeing signs of a broad telecom recovery. However, as noted last quarter, we are seeing platform shifts at our lead 5G customer, which may result in revenue growth opportunities for MACOM over the next 12 months. In addition, we believe we are gaining market share at certain key 5G accounts. While global 5G network CapEx spending may have peaked, we are still excited about the growth opportunities in 5G networks. Our existing customers are providing MACOM more opportunities on the transmit and receive side of 5G radios as well as the high-speed digital and optical portions of the network. A bright spot in the telecom market is Satellite Communications, or SATCOM. We see opportunities to sell our products into a growing number of satellite constellations, which are delivering broadband Internet and direct to sell services to global customers. These systems typically operate at microwave or millimeter wave frequencies which plays to MACOM’s strengths. The Data Center end market continues to be a dynamic market with significant growth opportunities. The industry’s movement to higher data rates, combined with increasing number of interconnects that are required for next-generation networking and high-performance computing applications, are creating meaningful opportunities for MACOM. For example, a single compute cluster could use hundreds of thousands of cores or GPUs across hundreds of equipment racks. Connecting everything together requires large volumes of fiber optic and/or copper interconnects, creating a potential opportunity for MACOM. Within these complex compute architectures, there are typically a wide range of connectivity requirements, including GPU to GPO, switch to switch, network interface card or NIC to switch and DCI links. Connectivity requirements can vary by customer, including linked distance, protocol and physical medium. As a result, our strategy is to bring to market a product portfolio that offers solutions for short- and long-distance connections, utilizing NRZ, PAM4, coherent modulations carrying Ethernet, PCIe or other customer proprietary protocols. We designed high-speed analog chips to support both single mode and multimode fiber optic deployments, using DML, VCSEL or EML lasers as well as silicon photonic modulators with CW lasers. And of course, we offer analog products that support both retimed and linear architectures, or said differently, we can sell our ICs to work in conjunction with DSPs or to replace DSPs. We believe there is a fast pace of innovation within the data center industry. For example, today, 400G and 800G data center systems operating at up to 100 gigabits per lane are being deployed utilizing our products. At the same time, these systems are being designed, production ramped and deployed, we are also seeing new and increasing demand for our 200 gig per lane chipsets for both 800G and 1.6T applications. As part of the deployment of 200G per lane network architectures, we see our customers designing and adopting 200G per lane linear pluggable optics, or LPO, and active copper cables, or ACCs, in their networks to improve latency, thermals and power consumption. Our products can be very helpful in these applications, and they have been well received by leading customers in this space. As we look ahead, we see growth in our Data Center business being driven primarily by our 100G and 200G per lane solutions across optical and copper. Demand for our legacy Ethernet data center products at 25G and 50G per lane, which has become a smaller part of our Data Center revenue, has recently shown modest improvements, and we are pleased to see these positive trends. And finally, as 100G per lane and 200G per lane products become a reality, our engineering teams have already started designing the next-generation products to support 3.2T applications. And now I’d like to discuss a few recent highlights. In June, we attended the 2024 International Microwave Symposium, which was one of the most important trade shows of the year for MACOM. We use this venue to showcase our latest diode, RF power and MMIC product lines. This year, we organized 14 product demonstrations at our booth with products from across our core business units as well as from our recent acquisitions. Some of these demos illustrate how our recent acquisitions and their associated technologies integrate seamlessly into our core portfolio and business. For example, we demonstrated a 100-watt C-band GaN-on-silicon carbide power amplifier MMIC with 57% power-added efficiency in an over-molded package in conjunction with the silicon PMIC, or power management IC. We believe this is one of the highest efficiency power amplifiers in its class, and our team was able to combine the GaN-on-silicon carbide technology from the recent RF business acquisition, together with our silicon power management IC technology designed by our analog designers. We demonstrated GaN-on-silicon low noise amplifier, or LNA, with one of the fastest recovery times in the industry, processed at our new French wafer fab. The combination of low noise figure, superfast recovery time and ruggedness make our LNAs attractive for use in radar and electronic warfare. We are pleased that our North American applications and sales teams have successfully introduced the product line to new customers that can exploit the key features of this existing product. And finally, we demonstrated our Linearizer technology together with our GaN amplifier pallet technology to highlight how it’s possible to simultaneously optimize linearity, power-added efficiency and output power in SATCOM applications. These are just 3 examples of where our M&A strategy has created a 1 plus 1 equals 3 results. I’ll note, we are very pleased with the progress we are making with our recent acquisitions, and I especially want to acknowledge the strong support from Wolfspeed over the past quarter. I would like to take a moment to update investors on our pursuit activities for CHIPS Act Funding. As reported previously, MACOM completed the full application process for our Lowell, Massachusetts wafer fab. Today, I can report we also completed the full application process for the RTP, North Carolina wafer fab. Congratulations to our capture team for developing these plans, completing the documentation and putting forward compelling applications. In addition to pursuing domestic government funding, we seek French state and European Union funding to support capital investments and technology development projects at our MACOM European Semiconductor Center, or MESC, near Paris, France. Our small but strategic semiconductor center is located in the heart of Europe and is ideally situated to support European telecom, industrial, automotive and defense customers. I’ll note, since the acquisition in the spring of 2023, our teams have been actively working to bring online and qualify MESC’s existing 6-inch wafer production line. We expect this activity to increase our manufacturing capacity while lowering manufacturing costs. As a reminder, our goal of modernization and expansion of our facilities is driven by our long-term strategy to make MACOM stronger and more competitive, and it is not dependent on external funding. Before turning the discussion over to Jack, I am pleased to report that in July, we completed an update to our 5-year strategic plan. We believe that detailed long-term planning is essential to be successful in the semiconductor industry. And while our plan is confidential, I can share that it revolves around a few central themes, which are: one, to focus on market positioning to capitalize on trends; two, execute advanced technology development; three, strengthen our franchise; and four, always look for ways to differentiate ourselves from the competition in order to win market share. Our long-term goal is to build a unique, best-in-class and diversified semiconductor portfolio, which enables MACOM to capture a larger share of the market. We are excited about the future and confident we can continue to gain market share. Jack will now provide a more detailed review of our financial results.