Martin B. Anstice
Analyst · Stifel, Nicolas
Thanks, Doug, and good afternoon, everyone. We appreciate all of you joining today's earnings call. As the initial headline, we're really pleased with our performance for the June quarter and the solid financial and operational results we delivered for the fiscal year. For the quarter, we reported 48% non-GAAP operating income flow-through on incremental revenue growth sequentially and 18% cash from operations. Achievements both have formed the substance and value in our vision. Reflecting back on these past 12 months, I am inspired by this organization's execution to our integration plans and the progress we've made towards delivering on our growth strategies. Stated simply, our recent performance is generally consistent with our expectations, our stated market share ambition and the financial model reiterated earlier this month. During our Investor Analyst Meeting a few weeks ago, I remarked that Lam has transitioned from a mode of integrating 2 companies to competing successfully as one. As we embark on this next fiscal year, defense of past successes remains our foundation, but we are optimistic of our growth prospects and competitive strength long term. There is no doubt in my mind, we are stronger together than we were separately. Our ability to mitigate risks and exploit opportunities is greater today than our premerger operating state. Now let me offer a few perspectives on the industry relative to our forecasted wafer fab equipment spending range of $30 billion, plus or minus $2 billion for calendar year 2013. Proportionately, we still expect more than 50% of WFE spending to occur in the second half of this year. As is more customary than not, we've seen slight changes in the composition of those investments over the past several weeks, as customers adjust their individual investment plans to align more closely with their demand profile. But the basic headline of $30 billion, plus or minus $2 billion range, still seems a reasonable outlook for calendar year 2013. And although it is way too early to quantify 2014, we do consider our market opportunity increasing next year. Changes have been most prevalent in the Foundry space, where certain leading-edge capacity investments, predominately for the 20-nanometer node, are now expected in 2014 rather than second half of 2013 as originally expected. We still anticipate at least one Foundry customer to add 20-nanometer capacity this year and shipments starting to ramp this quarter. However, accounting for these adjustments, we now forecast Foundry WFE spend at slightly over $12 billion, approximately 5% to 10% lower than our view last quarter. We anticipate these changes will be partially offset by increased investments in the memory space, where supply conditions have remained very tight amidst strong demand for mobile products and connectivity generally. We currently estimate memory WFE in 2013 at the $11 billion level. As was apparent from our June quarter results, DRAM shipments increased sharply as manufacturers accelerated the pace of their capacity conversions to support strong demand for mobile DRAM. Based on our understanding of customers' plans today, we expect additional investments to occur later in the year. However, given the timing of these tools to come online, our projection for supply bit growth is still approximately 30%. For NAND, our customer spending forecast has not substantively changed with estimates for supply bit growth in the mid-40% range. We still project spending weighted to the second half of calendar 2013, with a split of roughly 40% and 60% first half versus second half. Although planar investments represent the majority of NAND spend in 2013, initial shipments for 3D device capacity is still expected to begin in the December quarter with Phase 1 equipment selections at the bearing stages of conclusion at this time. We have consistently forecasted a decline in microprocessor logic spend this year compared to 2012 which, we believe, aligns reasonably well with our customers' capital plans and expectations for investments to pick up in the second half of this year, predominantly for 14-nanometer capacity expansion. Given the influences over the second half noted here today, we would expect the December 2013 quarter to have stronger shipments than September. Against this reasonably stable and positive industry backdrop, all of our efforts are focused on continuing to execute on our strategic growth objectives, which collectively are designed to enable us to outperform the industry over the next several years. First, we are driving growth across our product portfolio by capitalizing on market expansion and technical inflection opportunities and innovating of the leading edge to deliver market share gains. For multiple years now, Lam has been steadfast in its commitment to sustain our levels of investments in new technology capabilities and to partner closely with our customers' development teams to address next-generation device requirements. Earlier this year, we began shipping our fifth-generation Kiyo conductor etch system, which further extends our leadership in CD and depth uniformity. Lam is the industry benchmark in this area, which has enabled us to maintain critical transistor-level applications and extend multiple patterning process steps, including 20-nanometer PTOR positions. For several quarters now, we've talked about gaining momentum in dielectric etch high-aspect ratio process steps for DRAM devices. Last year, we introduced the capability, enabling differentiated profile control of these deep structures, which enabled us to win PTOR selections for the majority of 2x DRAM device flows. These same capabilities have enabled us to capture a broad range of 3D NAND development positions and give us confidence in our ability to capture production tool decisions in the coming year. Given our strong etch market share today in NAND, the market expansion in the 3D transition creates accelerated growth opportunity, as we maintain our overall share position while at the same time focusing on capturing upside. Our latest VECTOR Strata PECVD platform enables significantly higher wafer output processing density than any other system on the market today. Lam's complete portfolio of high-productivity, 3D NAND, multilayer film stacks positions us well for the anticipated production tool selections. For Lam, this represents one of the single largest application and product-specific growth opportunities, defined by a very logic -- large market expansion, accompanied by our high-confidence market share plans. As market share leader for both of the metal deposition segments in which we compete, we focused on widening our competitive gap. In tungsten deposition, we are poised to benefit from the transition to 3D devices. Our ALTUS products provide low-resistivity films, which offer performance advantages for logic devices, and our ExtremeFill capabilities support some of the complex re-entrant profiles used in 3D NAND devices. In copper Electrofill, we're expanding into the advanced packaging space, having won a few applications already this year with our SABRE 3D products. Lam's long-held strategy has focused on the most technical and productivity-critical applications, and the sample of successes I've just described are the result of addressing our customers' needs on time, not early or late, and in a manner they can trust for the long term. As stated many times, we don't win or defend everything all of the time, but we have and plan to continue winning more than we do not. That history and belief in the substance of the competitiveness of our product roadmap today provides us the confidence in our ability to capture 1 to 2 points of shipped market share gain in both etch and deposition this calendar year, also to achieve our long-term growth targets. In single-wafer clean, we remain the market share leader for back-end processes and now have commitments from 2 of the top 3 capital spenders to shift our next-generation, single-wafer clean system, the first of which will ship in the coming weeks. Minimally, these customer decisions are recognitions that we have eliminated our productivity disadvantage and have the vision to optimize their running costs. It is also our belief that they represent a critical building block to extend our successes in back-end-of-line clean processing to front-end-of-line applications. These new applications are more technically challenging, where the value of Lam as a provider of etch, deposition and clean solutions combined, can present differentiated value to our customers. As a complement to growing our systems business, we are also strengthening our competitiveness through our customer support and service offerings. As previously stated, this component of our business can represent 1/4 of our total revenues across the cycle and provides a solid base for building competitive differentiation over the lifetime of our customers' investments, not just at the point of equipment selection. In addition, it creates an income stream that is as close to an annuity as possible in this business. And with an increased level of focus and innovation at Lam, we believe it represents an exciting opportunity for growth. We are targeting to create value for our customers and, in turn, deliver compound annual revenue growth in excess of 5% over the next 5 years in our installed base business. Our customer services and installed base business have served to strengthen our competitive profile through technical differentiation, productivity and capital efficiency solutions. As an example, we recently developed a proprietary path cleaning process for some etch components that are critical and used in leading-edge logic manufacturing. These efforts improve the mean time between chamber cleans by more than a factor of 3, which translates to a significant improvement in availability for our customer. Lam has an installed base business of more than 30,000 semiconductor equipment process modules globally. Our supports and improvements of this installed base, not only provides us with rapid cycles of learning, but also a source of revenue commensurate to the value of solutions provided to our customers. Moreover, we offer an upgrade path for our family of etch, deposition and clean products, which provides capital-efficient means for our customers to extend the life of their installed base of Lam equipment, a capability never worth more to our future differentiation. Combined, we believe these actions can provide in excess of $1 billion of incremental revenue for Lam in the 2016 time frame, assuming a WFE spend environment of approximately $35 billion. As we look ahead, we continue to invest in new technology and productivity capabilities in order to keep pace with our customers' evolving needs and remain focused on achieving the growth potential associated with the Novellus merger. We are already realizing synergies from some major projects. We've previously talked about our 450-millimeter development program and the significant savings we have been able to recognize in terms of resources, development time and driving commonality across products. We were also able to leverage design elements from our copper electroplating products, including the robotics to reduce development cycle time for our next-generation clean products by an estimated 30%. Today, our etch products utilize pulsing technology for processes requiring very high selectivity to underlying materials. We are benefiting from Novellus' knowledge and experience with atomic layer deposition to further enhance our etch capabilities and extend our differentiation to meet future technology needs. I would like to take the opportunity to thank each of our employees for their dedication and tireless efforts over this past year to integrate both companies. I would also like to thank our customers and suppliers for their continued partnership and trust through a significant period of change at Lam. Our opportunity for growth is significant and I believe, more than ever, that the substance of our vision, the quality and innovation of the Lam team and the operational execution of our companies together will prevail competitively. Turning now to our outlook. Non-GAAP guidance for the September 2013 quarter is as follows: shipments and revenues both of $1 billion, plus or minus $30 million; gross margin at 44%, plus or minus 1%; operating profit at 14%, plus or minus 1.5%; and earnings per share of $0.68, plus or minus $0.07, based on a share count of approximately 170 million shares. With that, Doug and I would be happy to take your questions.