Fusen Chen
Analyst · Needham & Company. Your line is now live
Thank you, Joe. It’s continued to be a very exciting and transformative time for the company. Our core business is being fundamentally enhanced as the importance of semiconductor assembly increased in most high-volume and the leading-edge semiconductors. Additionally, we continue to make significant progress expanding our market reach as the interest and adoption of our advanced packaging, automotive and advanced display offering are accelerating. Our confidence in these high potential new initiatives is improving as our market engagement are tracking better than expected during our Investor Day in September. I will spend a few minutes to cover each. Within our dedicated advanced packaging business, we continue to gain access into the logic networking and the mobility market. This portfolio, including our lithography, thermo-compression, high-accuracy flip chip and system in packaged flip chip solution are extremely competitive and address the broad and the growing semiconductor assembly market. We continue to drive adoption across this growing portfolio and APAMA, our thermo-compression platform is making significant progress. Heterogeneous integration or Chiplet integration is one of the long-term opportunities that we are pursuing aggressively, although this is not the only market. In addition to Heterogeneous integration, we are also extending access within mobility for both high-volume logic and the next-generation 3D sensing applications and also for co-package optics necessary for ultra-high-speed network communications, such as high bandwidth transceivers. The key benefit for the Thermo-Compression, our TCB process include an efficient solution for higher bandwidth interconnect assembly down to 10-micron pitches, which is well beyond the current interconnect pitch for most leading logic application. Additionally, TCB enable us taking for emerging 2.5 and the 3D architectures. This shifts to emerging multi-chip structures is increasing the value add of packaging technology and is increasingly necessarily to support year at the leading edge. In addition to this fundamental benefit within leading edge logic, TCB also enabled assembly for components, which are heat sensitive including in substrate and optical components used for communication and the sensing. We recently received acceptance and recognized revenue for a high potential silicon photonics application, supporting the optical transceiver market with increasing cellular bandwidth need, network-to-network communication is expected to grow dramatically with high bandwidth optical transceiver expected to grow at a 50% CAGR through calendar 2025. We are very early in this transition and we’re positioned to help enable this growth. The next update is related to our automotive opportunities. The transition to electrification and autonomous are accelerating semiconductor growth in the automotive market at a overprice the industry average. Over the coming year, our high-performance, high-reliability system matched well with this end market. In addition to our historic leadership position, within the automotive semiconductor applications, we have also been developing new battery assembly systems. Over the past several years, we had one core battery solution that was adopted and globally deployed by one customer. While this is a solution was very successful, the market was limited. Today, many more customers are entering this space, and we are working to bring new innovative solution, supporting both cylindrical and prismatic battery opportunities to market. Recently, our engagement and the market interest with our current and new battery offering have expanded dramatically. At this pace, we are tracking better than expectations set during the recent Investor Day. We are currently engaged with over five high potential customers eager to run battery production for the commercial and the consumer vehicle market. We are also experiencing growing interest within emerging industrial applications, such as a battery backup and agriculture. Finally, the third key growth focus area is advanced display. We continue to deliver our market-leading PIXALUX system and our ramping production of several LUMINEX quantification tools. Over the coming quarters, we anticipate within several new LUMINEX qualifications and to gain more visibility on a broader industry ramp. Turning to our results this quarter, we achieved $460.9 million of revenue and a non-GAAP EPS of $2.19. We generated $408.6 million within capital equipment, and the demand remains strong across all end markets. General semiconductor remained very strong, softening by 16% sequentially as anticipated. We in general semiconductor, the more capacity-driven more bonding business declined by 8%. The larger sequential reduction stemmed from very strong September quarter’s demand for our wafer label, logic and the power assembly solution. Utilization rate remains strong across this broad installed base. As a reminder, general semiconductor revenue in the recent December quarter is currently over 50% higher than the same period last year. Within the LED market, we continue to support rapid growth leading advanced display. Advanced display increased by 28% in the December quarter, representing 56% of our total LED revenue, up from 40% in the September quarter. We continue to aggressively work toward expanding our presence in this new exciting area and anticipate advanced display will grow dramatically over the long-term. Next, automotive and industrial remain a long-term growth opportunity for us. In September, automotive demand increased by 92% sequentially and was driven by improvement in our battery assembly, power distribution and sensing solutions. We are very eager to continue participating in the long-term transformation of the automotive space. Finally, demand for our memory solution increased by 17% sequentially from the very strong September quarter. Overall, current market conditions and our long-term outlook are tracking better than expected, and we remain very positive over the coming years. Near-term we are very focused to drive new customer engagements and win new qualifications across advanced packaging, automotive and advanced display portfolio. Over the prior year our focused development efforts have been aligned our business with long-term, technology-driven market opportunities, which we are executing on. While broader industry supply chain and global logistics challenges are part of the current operating environment, we believe they are very short-term and anticipate greater improvement through fiscal 2022. Over the coming years, the future is very bright, and we look forward to sharing our progress over the coming quarters. With that said, I will now turn the call to Lester, who will discuss our financial performance. Lester?