Fusen Chen
Analyst · B. Riley. Please proceed with your question
Thank you, Joe. We continue to be amid a period of dramatic capacity expansion throughout the semiconductor industry which is supported by durable and structurally sustainable end market trends. While supply chain challenges are broad and expected to continue, our global operational and engineering teams have done an outstanding job to mitigate challenges within our control while supporting our customers’ aggressive growth plans. Ongoing demand for our capital equipment and APS solutions remains very strong and is supported with multiple long-term drivers, which further enhance our visibility and outlook. Structurally, we are aligned with three prominent and fundamental technology transitions. These include the increasing capital intensity occurring throughout the semiconductor assembly space, the very significant and the long-term transition within the automotive market, and our direct involvement in accelerating industry adoption of new display technologies. In addition to these fundamental and structural growth drivers, we are also extending market reach through aggressive R&D investments. These opportunities, supported with ongoing development investments and new product introductions, target new opportunities within the Automotive, Electronics Assembly and the Display markets. We will provide further updates to these specific opportunities over the coming quarters. Finally, we are in a very dynamic, expansionary phase of semiconductor consumption and production. These expansionary periods have occurred in roughly 10-year increments as new uses for semiconductors were adopted. In the 90’s the driver was the global adoption of PCs; in the 2000’s global internet access increased demand, then over the last 10 years, mobility drove a new layer of semiconductor demand. Today, we have several new and meaningful end-applications that are dramatically accelerating semiconductor production capacity. The end-applications driving significant capacity needs today include the worldwide adoption of connected devices, the growth of 5G infrastructure and the next generation of computing power, driven by big data and artificial intelligence. The combination of these structural, technology transitions and broad-industry trends are significantly enhancing the demand for our products, our adjacent market opportunities and our ability to generate value for investors and the communities we serve. During the June quarter we have begun our annual long-term planning process, which provides a more granular view into how these drivers are expected to favorably benefit our business. At a very high-level, over the coming years we anticipate annual semiconductor unit growth to continue running significantly above the long-term, historic 6.5% growth rate. Additionally, we are very confident in our ability to support new higher-growth technology transitions that further extend our market reach and provide new vectors of growth. We currently expect to reach $1.5 billion of revenue this fiscal year and are confident underlying business conditions will extend through fiscal 2022, supporting a multi-year industry expansion. Beyond 2022, our ongoing execution with specific new opportunities supporting advanced display, advanced packaging, APS and new adjacent opportunities, will continue to grow and support a new sustainable level of revenue and profitability. Considering, these broad macro, industry and execution expectations, demand will remain strong supporting average annual revenue of $1.5 billion over the coming years. As a reminder, this new level of revenue is significantly higher, and also more sustainable, than what we shared during our 2018 Analyst Day. Lester will provide some additional details on how this long-term outlook translates to a new level of sustainable shareholder value shortly. We will also provide many more details regarding our business prospects and traction during our upcoming Analyst Day, scheduled for September 23. For today’s discussion, I would now like to provide some commentary to the June quarter’s performance and end market review. During our June quarter, we exceeded the high-end of our revenue expectations and delivered $424.3 million of revenue, 46.1% gross margins and non-GAAP EPS of $1.87, which was up 48% sequentially. This significant sequential improvement highlights our operational leverage and was driven by strong and ongoing demand across all end markets. Within the General Semiconductor space, there are many new sustainable trends supporting this multi-year expansion. A comprehensive underlying trend is related to broadening adoption of 5G. This significant transition is increasing chip content at the smartphone level and also increasing demand for new connected devices. Additionally, this transition is also demanding new high-bandwidth assembly solutions for next generation optical, networking and logic applications. Our development programs, customer engagements and recent market wins have increased access to specific high-growth end-applications, including mobile sensing, mobile application processors, silicon photonics and next generation display drivers for virtual and augmented reality. Looking into next year alone, we anticipate an incremental $40 million of revenue stemming from these end markets. We continue to be very early into global 5G adoption and anticipate this transition will continue providing a tailwind and new equipment needs over the coming years. In addition to our alignment with these very positive and long-term market trends, we are also supporting and benefitting from the growing need for more complex packaging. As mentioned over the past few calls, there is a strong market demand for advanced K&S solutions that support greater transistor density at the package level. Rising front-end design costs and yield challenges have slowed the cadence of node shrink and are directly contributing to the higher level of assembly complexity, which is in turn increasing the capital intensity across our broad-served markets. This underlying market need creates an additional long-term technology-driven demand for our high-volume businesses such as ball and wedge bonding. This transition is also accelerating adoption of higher-growth, more specialized packaging techniques that further extend our significant market presence across semiconductor applications. Approximately 40% of our capital equipment revenue stemmed from advanced packages, including system-in-package, multi-chip module, high-accuracy flip-chip and thermocompression based devices. This mix has changed materially over the past year, and we anticipate it will continue growing long-term, along with our value proposition. Finally, within General Semiconductor, we are focusing R&D investments to expand market reach and also to expand profitability levels across our large and established served markets. We have several exciting product announcements to share over the coming quarters. Equipment sales into the LED market softened slightly in June although remained very strong and are expected to increase further in September. We continued to support ongoing demand for general lighting applications while we are actively supporting the long-term mini and micro-LED transition. Our PIXALUX system continues to be in high demand, and we anticipate strong demand through fiscal 2022 and beyond. We also intend to further capitalize on this new high-growth market by expanding our portfolio of advanced-display solutions. There is a strong market demand for more efficient and the more capable assembly solutions, which provide an opportunity to significantly broaden our customer base. Existing and the new customer interest has been very strong for our next-generation system. We expect to ramp qualifications with multiple customers over the coming two to three quarters. Additionally, this next-generation system also allows us to address multiple process steps required in mini and micro LED. While, the current Pixalux tool is very competitive within the critical final-placement step, there are several additional touch-points necessary for mini-LED backlight assembly including, mixing, sorting and PAM or Pitch-Adjusted-Module assembly. These additional process steps will all be supported by our new mini and the micro LED system, increasing our potential within this fast-growing new market. Progress on the next-generation LED system remains on track and I look forward to providing additional updates on this exciting product release over the coming quarters. The Automotive and Industrial market also remained strong through the June quarter, with revenue near the elevated March quarter’s. Underlying demand is being driven by the growing need for semiconductors in both traditional and emerging automotive applications such as electric vehicles and autonomous driving features. We continue to extend the market reach of our automotive solutions which support high-growth power storage, power distribution and sensing applications necessary to support the autonomous and electric vehicle transitions. We are well positioned to support these long-term transitions across our broad customer base. Finally, demand within memory has improved sharply with June quarter sales above our long-term average. Like our other served end-markets, memory utilization levels have sequentially improved driving the need for additional capacity. We anticipate memory strength to continue into the September quarter. Over the past several weeks our business outlook has improved. We have continued to mitigate a broad-range of dynamic supply-chain challenges as we have significantly ramped our production capacity. Our internal operational and engineering efforts, combined with the key market trends I covered earlier, have enabled us to increase our September quarter outlook dramatically. After market close yesterday, we provided a revenue outlook for September of $465 million, which would mark our third sequential quarter of record revenue and profitability. I would like to also note, that we continue to operate in a very dynamic global supply chain environment, and I am very pleased with our organization’s collective response which allow us to mitigate challenges, continue aggressive development efforts and enhance supply chain flexibility during this period of rapid industry expansion. In summary, the past several years of our R&D investments and market expansion efforts have extended our competencies and solutions to better support several significant, long-term and structural market opportunities. These opportunities are accelerating demand within our broad portfolio of solutions and provide access to new high-growth opportunities in the Semiconductor, Automotive and the Display markets. As we execute on this long-term strategy we are enhancing our ability to create long-term value for customers, and ultimately for shareholders. I would now like to turn the call over to Lester Wong who will cover this quarter’s financial overview in greater detail, Lester?