Fusen Chen
Analyst · Krish Sankar with Bank of America Merrill Lynch. Please proceed with your question
Thanks Joe. Before I begin the business overview. I wanted to spend a few minutes to introduce myself and to share my underlying interest in joining K&S at this unique and exciting time for our industry. For the past 29 years my professional experience has been focused on working with front end semiconductor and equipment technology companies, largely based in Bay Area. I am delighted to join K&S as it is my first U.S. company with its headquarters in Singapore and with such a dominant and entrenched back-end packaging position. While this role is clearly very interesting on a standalone basis, the timing could not have been more perfect to make a move to the back-end. Over the past 50 years the accessibility and proliferation of semi-conductor technologies was largely driven by transistor level cost reductions. These cost reductions were undoubtedly facilitated with front end technology improvements. The most consistent of these improvements was the ability to shrink which allowed more transistors to fit onto each wafer. Due to increasing physical limitations and the challenge surrounding each new node, node shrinking is failing to drive the same cost-benefit as it has in the past. In a effort to supplement these lost benefits, this fundamental industrial-wide challenge has spurred an explosion of investment and interest in backend technologies to create new alternative solutions serving both cost sensitive devices as well as more performance centric devices. Through prudent acquisitions and consistent R&D investments, our Company has positioned itself very nicely to directly address these new advanced packaging opportunities. In addition to the significant advanced packaging growth opportunity triggered by node shrink, K&S is also very aligned with other meaningful trends which are collectively addressed through our non AP business. These trends cover three key areas, first, within the IoT opportunity there is a growing demand within automotive we continue to see for price sensitive small connected devices; second, within automotive we continue to see a proliferation of sensing, control and infotainment driving reliability requirements. And the third, within high current applications we continue to see an increasing need for power control and storage. These all presents promising opportunities as we look into 2017 and beyond. I look forward to sharing our collective progress and our dedication infiltrating these expanding opportunities. Turning to the September quarter update, we are very pleased to have exceeded our revenue guidance range of $135 million to $145 million, with $145.8 of revenue for the fourth fiscal quarter. This was a result of nearly every business exceeding its initial target. While we continue to execute on a relative basis, it's extremely important to acknowledge that the current state of broad industry growth has been very limited. While we are confident demand will rebound into calendar 2017, there are no major macro tailwinds as we look ahead into December quarter. During this period of softer demand, we continue to seek out more near term niche opportunities within our key business lines. Softer demand within our ball bonder business was the major driver on our sequential revenue change. While OSATs generally absorb the incremental capacity requirements of the industry our shifting OSAT sales, which account for 93% of our ball bonders sold in the June quarter and only 66% in the September quarter indicate that there is a fairly widespread reduction. Throughout this softening environment, we have again taken full advantage of the flexibility of our operation, operational and the supply chain to scale in a highly efficient manner. Despite the current environment, our ball bonder business performed better than expected as we continue to be positioned for the growing NAND and LED opportunities. The outlook and expectations on capacity requirement to support a growing NAND market continue to be meaningful with our near term outlook. During the September quarter roughly 30% of ball bonders sold supported memory up from our historical average of about 10%. Also copper configured ball bonders accounted for 84% of machines sold and the LED sales come in stronger than our recent run rate, accounting for approximately 11% of ball bonder sales. Turning to wedge bonder business, we continue to gain meaningful traction and are improving our position with major OEMs. Our future rich, Asterion, and the recent launch Asterion EV platforms, continue to penetrate deeper into the automotive and the alternative energy segment and are expanding our served market beyond our traditional space. Additionally, the growing install base of our wedge solutions has also strengthened our position for recurring consumable sales. Consumable account for nearly 25% of our comprehensive wedge offerings. Turning to advanced packaging, within the APAMA business, we continue to be engaged with a broad set of customers through our global application labs and demo tools in the field. We are working very closely with several specific opportunities and we anticipate to ramp significantly in 2018. For our other advanced packaging business, based on our AP hybrid platform, we completed delivery and acceptance of high volume SiP order which spanned the March and the June quarters, shipments decreased as expected into September. We anticipate that the SiP market will be robust in the coming years and K&S will continue to play a significant role in this process adoption. As a reminder, this hybrid performance stemmed from our January 2015 Assembleon acquisition. This business was purchased for just over 1 times revenue and has dramatically improved our presence in advanced packaging and also traditional mass reflow. It also has significant alignment with longer-term, higher reliability opportunity surrounding the automotive segment and the growing need for more accurate placement within the electronics assembly market. Adjusting for the full-year 2015, we have grown this business by 37% in FY16, with the new market opportunity driven by upcoming R&D synergies. We continue to leverage our reuse approach and the collective bandwidth of our global R&D team, while we are also aggressively adding new R&D capacity to drive SAM expansion and feature development. The development pipeline continued to be interesting while major feature releases planned in our second fiscal half of 2017. While we continue to be in softer current demand period and heading into a seasonal softer quarter, we continue to anticipate the growing 3D NAND market will drive capacity requirement in the short term and the industry recovery to a more normalized semiconductor unit growth rate in the midterm. As discussed in last quarter's commentary, the expectation of calendar year 2017 and 2018 we'll return to a more normalized industry compound growth rate of 7% annually. This improves our optimism as overall package semiconductor unit growth was in the 1% to 2% range over calendar year 2015 and 2016 and is clearly a major driver of capital equipment requirements. I would now like to turn the call over to Jonathan Chou, who will cover this quarter's financial overview in greater detail. Jonathan?