Richard P. Wallace - KLA-Tencor Corp.
Management
Well, as you know, one of the biggest challenges is one of the ones we're trying to address, which is the ability to catch defects in the process. So as a result, when customers have process problems, they have to go through some pretty rigorous engineering analysis to unpack those problems. So you see two things. One, you see actual wafer yield as sometimes probably – it is averaging lower than what you would see on 2D. And it's probably depends on customers, somewhat, how that is, but it is lower. But it's still pretty good. And you see that because they're having success selling them commercially. But the other thing is, you see line yield bus, (43:55) which is a little different, which is when you have a number of wafers that are actually bad, and have to be scrapped, and for many customers, that's very disruptive to their business. So I'd say that, yes, structurally, it's very hard to build these – especially as you're going up in layers, the devices, for two reasons. One, the process technology is very tricky. And the second one, you don't have a lot of visibility into it. And it's kind of like the old days of semiconductor manufacturing, when we didn't have as much in line, and people had to use disruptive means or short loops to try to figure out what was wrong with their process. So there is opportunity. I think we've repeatedly said that, if we could help with solutions that help customers gain a few points of yield, that's easily justifiable on their end. But I would say, yields are in the range of probably, if you'd see them over 90% in 2D, you'd see similar yields at, say, 10 points lower, say 80% or so for – and maybe they are even higher than 90% in 2D, so you'd see a degradation as you go to the 3D.