Richard P. Wallace
Analyst · Patrick Ho from Stifel, Nicolaus
Patrick, great question. I would say the following: One, the biggest inflection that would come for reticle inspection would, of course, be EUV and high volume. And we said at SEMICON West and continue to say, we don't see that happening in the foreseeable future. However, we are seeing indication that a sub-20 nanometer, some of the lithography challenges being presented by people having to extend 193 is creating a buying cycle both in -- and certainly, in mask shop, it's not as robust as it would be if it were an entirely new generation of mask. But I think that what we don't know and our customers don't know is how much capacity they're going to need to add. And part of that is how many starts are going to actually happen in the sub-20. But we have seen some support for that. The other thing that goes on is in the fab line. And I think that the customers have enjoyed a holiday, a mask makers holiday, if you will, because of the double patterning on relatively simple mask. But again, when you get to sub-20, there's some challenges associated with that. That business is different, we have different offerings for it, that tends to be more cost competitive and not as high tech. And so there's some challenges in terms of satisfying, and there's more competitive pressure in that market. But we have offerings, and we think we can compete in that market. But it's not going to be as the same as what you've seen in the mask shop. So until high volume, EUV comes in, which is several years out, I do think there's going to be some opportunity as we look at sub-20 and some of the lithography challenges. But frankly, it's new enough that our customers don't yet know exactly the implications for their reticle strategy.
Patrick J. Ho - Stifel, Nicolaus & Company, Incorporated, Research Division: Great. And my follow-up question on the wafer inspection business. You've seen a pickup, and you talked about the record orders this year. You've also mentioned that DRAM spending was up. I think in the past, you've noted that you expect the process control intensity for DRAM to be kind of split between metrology and inspection. I guess, after the last few quarters with DRAM spending has been up, are you seeing more of a bias towards inspection given that metrology is trying to hold steady? Or is that something where metrology will catch up down the line with, I guess, the capacity build on the DRAM side?