S.J. Cheng
Analyst · Caffeine Holdings. Please proceed with your question
Yes, thank you, David. We appreciate everyone joining our call today. We are pleased with our result for the third quarter 2020 and continued progress, the quarter development in line with our expectations. Demand in our end market remaining strong with positive utilization labor. This was the important quarter for us, as we drive Q3 revenue through the fifth year’s record highs. Revenue was up 4.8%, compared to Q2 and growth 5.3% compared to Q3 2019, even more impressive is the 13% revenue growth we achieved for the first nine months of 2020 with a gross margin up 290 basis points to 20.9%. Let me give some color on this. Our Q3 assembly utilization labor significantly increased to 80%, as we benefit from demand in gaming, consumer, electronics and slightly rebound in auto and industry and led the tightened utilization of assembly wire bonder. Our 8-inch COF utilization remains soft. This was more than offset by strong TDDI demand, which was drove utilization of our middle high-end wafer testing platform hires to full utilization. We are also pleased to see DDIC utilization increased to 76% in Q3 after a decline in Q2. We continue to benefit from higher bumping demand led by our [indiscernible] bumping and other in our driver business. Our overall utilization level was 79% in Q3, up from 74% in a year ago and higher than 76% in Q2. Regarding our manufacturing side, assembly represented 25% of Q3 revenue. Package testing and wafer sort represented around 32% and wafer bumping represented around 23% of Q3 revenue, up from 19.1% in Q2. On the product segment basis, our DDIC, including COG and COF, our segment was around 30% of revenue and gold bumping increased significantly to represent around 19.5% revenue. Revenue from DRAM and SRAM represent 19.2% and our flash segment grew significantly to represent 23% of Q3 revenue. Mixing on segment revenue increase and represents around 8.5% of Q3 revenue. In terms of adding colors, our memory product revenue grew more than 3% and represents around 42% of total Q3 revenue. DRAM revenue was up 15% year-over-year, but declined 10% compared to the Q2. This reflects broader inventory level adjustments in the channel. Total price revenue grew 18% compared to Q2. We benefited from significantly growth of no and [indiscernible] strong demand from gaming. Lastly, our NAND flash business continued to grow and represent about 29.5% of total Q3 product revenue. As for driver IC-related product, we continue to benefit from new 5G smartphone launch, particularly large HD-grade panel model, driver IC-related product revenue increased around 10.7% compared to Q2 and represent around 49% of total Q3 revenue. [indiscernible] revenue grew significantly around 26% compared to the Q2. [indiscernible] supply limitation. Overall, DDIC revenue grew in Q3 compared to Q2 as we benefit from strong demand for DDIC, given the high penetration of HD-grade panel. As a result, TDDI business represents 34.3% of Q3 DDIC revenue with middle to high-end wafer ??????? ????????, fully utilization currently. When we look at our target end market, revenue increased in both smartphone and consumer, while TV declined and both computing and automobile and industry whole rate compared to Q2. As we look forward into the fourth quarter of 2020, we are encouraged by end market and inventory trend in our [indiscernible] market. Long-term opportunity like ongoing 5G buildout are positive for the industry and ChipMOS. New smartphones are likely to drive higher volume demand, while the global work from home trend and led the uptick in demand for consumer, electronic and gaming, We expect revenue from two major product segments, memory and DDIC related, will continue to grow and growth of the DDIC related product will be better than memory segment. As we benefit from increased demand, capacity addition and higher testing price in Q4. In memory, we expect DRAM will remain the similar momentum from Q3 and our product business, including NOR flash and NAND flash will continue to grow by global work from home trend. We are investing some wire bonder due to the patent wire bonder capacity. We expect the assembly deceleration could be maintained the healthy labor because the new increase wire bonder are all booked by our customers. In DDIC, we expect demand from middle large-sized panels for TV will remain healthy in the four quarters. For the small size panel, demand is being driven by increased demand for middle, low end new 5G smartphones and strong demand for TDDI from the higher penetration ratio of HD-grade panel. As I mentioned, the wafer test play from are fully utilized. We expect to maintain this level into 2021 based on the customer forecast. We are carefully investing in the new high-end test play phone capacity to meet strategic customers' request. Finally, given the tightened capacity utilization level with related wafer testing price on October 1. This will benefit our DDIC revenue growth and profitability in the Q4 2020. We are working with our customer and committed to providing the capacity they need, similar to the situation in second half in 2018 and 2019, our new testing capacity additionally are all secured by customer contract guarantee to reduce the investment risk. Before I turn the call to Ms. Silvia Su, I would just like to highlight the comment we made in our Q3 result conference call noticed last month. Starting in calendar year 2021, ChipMOS will be – being hosting only one [indiscernible] during the timing and resource issues. To ensure transparency and to facilitate a better understanding of the financial results and operating environment of the company for English-speaking investors. We plan to provide a English translate audio following the lending call on East West side. Silvia, please go ahead.