Shih-Jye Cheng
Analyst · David Haberle with Susquehanna. Please proceed with your question
Yeah, thank you, David. Welcome everyone to our fourth quarter and full year 2018 conference call. Hopefully, you all had time to review our earning release. 2018 was marked by significant accomplishment for ChipMOS. Our accomplishments were on our business operation, financial, company structure and strategy. Taken together, [operation] [ph] have been meaningful and position us for success in 2019. We are pleased that we achieved a higher gross margin at 22.8% in Q4, up from 19.5% in Q3. We delivered this significant improvement of modest revenue growth, this show the leveraging our business and benefit of higher price level, a favorable mix and ongoing operation efficiency improvement. Our focus on profitability has helped us to move through up and down in the market. That there has been industry softness in Niche DRAM, related to ongoing conservative behavior around the trade tensions, for ChipMOS our end-market customer and geography diversity put us on a growth path and help isolate our business. We continue to have a higher utilization rate and our balance sheet remaining strong. We are able to invest in the area of our business, thus will drive our near and long term growth, while keeping the financial healthy to operate in up- and down-turn markets. Our result in 2018 benefits from the main growth in TDDI products. This is the major driver for our business, because TDDI allow customers to upgrade performance while reducing cost. This is the perfect value offering. And that we continue to see growth in narrow bezel panel requirement in new smartphone, particularly the COF format. In addition, large-size TV driver IC continues to increase due to the higher 4K TV penetration rate. Overall revenue in 2018 growth above 3% compared to 2017 and gross profit margin also increased to 18.6%. DDIC was a fuzzy area for us. Our DDIC business grows about 18.2% in 2018, compared to 2017. And that represented about 31.6% of our total 2018 end-year revenue. Demand continued to outpace capacity through 2018 and allow to [multi-city] [ph] increase pricing. The other positive outcome was customer move to set up the long-term capacity contracts to secure the capacity. This agreement helped us to streamline our CapEx trend and helped to reduce typical volatility. For Q4, DDIC product represented about 34.2% of total revenue, while gold bumping represent about 17.6%. The COF format packaging growth and represent about 60% of the DDIC revenue in the fourth quarter. And at same time, the TDDI product grows to 28.3% of DDIC revenue in Q4 from 22.8% of Q3. And there are around 21% of TDDI products, our packaging in COF format in Q4 from around 13% of Q3. The other area of our business was mixed, compared to 2017 price product benefit from higher automotive demand and other new applications such as smart speaker and gaming. Product revenue growth around 12% in 2018 compared to 2017 and represent about 21.5% of 2018 revenue. Memory product revenue however declined about 5% in Q4 compared to Q3, and represent around 38% of total Q4 revenue. This is in line with the broader market trend [further reported] [ph]. As we look into first quarter of 2019, Q1 normally represent the lowest period for the year, for the industry, followed by revenue growth in Q2, Q3 and Q4. This is due to fewer working days around Chinese New Year holiday and typically semiconductor churn inventory rebalancing. ChipMOS is in a strong position, entering 2019, having fortified our balance sheet and secured long-term financial agreement on favorable trends from our banking partners. We secured a new syndication credit line, NT$ 12 billion, with a five-year term in May 2018, will allow ChipMOS to refinance its existing banking debt on favorable financial terms, while maintaining financial flexibility to support company working capital for future growth and expansion. It is also important to know that, because we complete our 2018 capital reduction plan in Q4 2018, there was around 15% reduction of the number of common share in ADS. This will result in higher return to the shareholder and allow us to award shareholder distribution of NT$1.5 per company share, together with a cash dividend of NT$0.3. We are confident, we will be able to outgrow as we benefit from strong demand in our DDIC business, particularly with COF. We also encouraged by our progress in cooperation project with customer on OLED panel driver IC and DDIC for automobile application. Wherever you look semiconductor content and device complexity is increasing. For ChipMOS, we have to say in the past, the driver like TDDI require significantly higher testing time. Also more and more sales from auto shift to TDDI. We benefit from the volume upside and potential revenue per device. The same is true for automobile. The semiconductor content in the motor today has never been higher. It take incredible advanced system to make the entertainment and driver comfortable. And this does not even get into what is required with the vehicle connected to the cloud and self-driving auto. The 5G buildout is expected to be the main catalyst later in 2019 and in two years. Interconnection is not possible without higher reliability. Only specific large OSAT company like ChipMOS gain profitability making a critical ongoing R&D investment required to support the new technology requirement. We had a critical place in the supply chain and we are relied upon by customer worldwide. To support the strategic growth, we will continue to carefully invest in our DDIC testing and 12-inch COF assembly capacity to meet the strong TDDI demand environment. As I mentioned earlier, we have been able to eliminate market risk around adding capacity because TDDI customer are seeking long-term agreement to secure the needed capacity support for their expected growth. This adds further visibility and stability to our business and derisk our investment. Overall we are focused on achieving profitable annual revenue growth in 2019. Finally, before I turn the call to Silvia, I'm pleased to report that our board of directors had approved a cash dividend distribution to shareholder of around NT $1.2 for commercial or around US$0.78 per ADS. Shareholder will be able to approve at our AGM in June 2019. This is the [message that in similar operation] [ph] by ChipMOS over the passing two years to reward shareholders and to build, create value for shareholders. We appreciate your support as we continue to execute our business strategy. Now let me turn the call over to Ms. Silvia Su to review the full quarter and full year 2018 financial results. Silvia, go ahead.