David Li
Analyst · Longbow Research. You may begin
Thanks Trisha, good morning everyone and thanks for joining us. This morning we announced strong results for our third quarter of fiscal 2016 which reflect improved semiconductor industry demand as expected and discussed during our second quarter conference call in April, as well as the continued successful execution of our strategic business initiatives. In particular, we continue to support our customer’s transitions to advance logic and memory applications using our tungsten slurries. Customer adoption of our CMP pad solutions and qualification of our new high performing dielectric slurries. We realized revenue of $108.2 million, approximately 11% higher than in the same quarter last year, including the benefit of our October 2015 acquisition of NexPlanar Corporation. We achieved record quarterly revenue on our tungsten slurry product area and also significant year-over-year revenue growth in our pads and dielectric slurry product areas. Our gross profit margin was 48.1% of revenue and 49.2% on a non-GAAP basis, excluding amortization expense related to NexPlanar. We achieved diluted earnings per share of $0.76 which represents an increase of approximately 95% compared to the prior year. Non-GAAP earnings per share were $0.79 excluding NexPlanar acquisition related costs and amortization expense. In addition, we continued our strong cash flow generation trend with cash flow from operations of $25.1 million. Bill will provide more detail on our financial results later in the call. Let me start with some perspectives on the global semiconductor industry environment. As forecasted by some of our customers and industry analysts, industry demand strengthen during the June quarter and our results are consistent with this. Reports suggest that the stronger demand was driven by inventory replenishments and preparation for new product launches. As a result, exiting the June quarter, most IC inventories related to smartphone, wireless, network, automotive and gaming markets were at normal seasonal levels. PCD ram device inventories appear to still be in moderate over supply due to soft PC demand. We expect that semiconductor device manufacturers will continue to adjust capacity utilization and output to actively manage inventories in the supply chain. Looking ahead, based on all of this, some of our customers and industry analysts have reported expectations of continued solid demand during our fourth fiscal quarter. This is consistent with what I heard during my recent visits to Korea and Taiwan and we have seen continued healthy demand for our CMP consumables products in July. Bill will provide more detail on our orders to date. The view from SEMICON West earlier this month in San Francisco, appear to support this industry outlook. The overall tone was generally bullish for stronger second half of 2016 and also for longer term demand. This appears to be based in part on the outlook for 3D memory and FinFet. We believe that both of these technology advancements represent growth opportunities for us, since they require more CMP polishing steps for both tungsten and dielectrics applications. And we’re seeing the benefit of our customers early ramp up production. After several years of delays, it appears that 3D NAND is now more broadly ramping in high volume manufacturing. As a result, 3D transitions from traditional planner or 2D are creating an overall tight NAND supply environment, due to relatively strong demand for high end mobile devices and solid state drives. As memory manufactures convert 2D capacity to 3D NAND. For 3D NAND we believe there is currently one leading memory player in high volume manufacturing, and reports suggest that three other manufacturers are converting lines from 2D to 3D. We would expect these manufacturers to transition towards high volume production over the next six to 12 months. In FinFet we believe there are few leading logic players that are on high volume manufacturing. Reports suggests that they continue to focus on improving yields which is likely contributed to the slower ramp of production. Further, some of these manufacturers are also actively preparing for 10 nanometer and smaller technologies. For both 3D NAND and FinFet, we continue to collaborate with our customers and expect that others will migrate to these applications overtime. Another industry dynamic that we’re closely monitoring is semiconductor industry development in China. This region continues to be in the spot light with a number of fab expansions announced and significant domestic and international investment in both logic and memory capacity expected in the future. Semiconductor industry growth in China should be a strong driver of CMP consumables over the next several years and we look forward to continuing to participate in growth in this region. We remain confident about the important role, highly engineer materials and highly formulate CMP solutions like ours will play in the semiconductor industry going forward. We believe our global resources, capabilities and infrastructure uniquely position us to deliver innovative solutions to our customers around the world. Within that semiconductor industry context, now let me to company related matters. During the quarter, we experienced robust demand for our tungsten and dielectric slurries and pad solutions. This drove approximately 13% year-on-year revenue growth from our IC CMP consumables products and contributed to nearly 50% growth in China. During the quarter, we continue to support our strategic customers transitions this 3D NAND and FinFet technologies using our tungsten slurries. As a result, we achieved record quarterly revenue in our tungsten slurry product area which grew 7% year-over-year. In tungsten, we have developed an expensive portfolio of unique, high performing solutions which embody broad and deep technology, covering a wide range of applications and technology nodes, including the most advanced applications within accompanying vibrant intellectual property portfolio. This technology along with our expensive experience in tungsten CMP solutions, our supply chain capabilities and quality systems along with our global technical support infrastructure have enabled the leadership position we have earned in this area. From this strength we expect continue growth in our tungsten product area, as the industry continues to move to advanced applications. Turning now to dielectric slurries, this quarter we continue to advance the broad transformation of this product area to drive profitable growth. Our progress on this initiative over the last several quarters was a key contributor to the approximately 14% year-over-year revenue growth we achieved. During the quarter, we continued qualification of our new high performing colloidal silica and ceria-based dielectric slurries. We believe these CMP solutions provide benefits of higher removal rates, improved deep activity and lower cost of ownership. We have a strong pipeline of active opportunities around the world, covering logic, memory and foundry customers on both 300 and 200 millimeter platforms, and we look forward to winning more business with these products in the future. Turning now to pads, this quarter we grew our CMP pad revenue by almost 82% year-on-year to approximately $14 million including $6.4 million from NexPlanar. During the quarter, we combined elements of both our Cabot Microelectronics and NexPlanar technology to expand our product offerings. As a result, we made further progress on the qualifications we discussed last April and in our third fiscal quarter, one new pad business in Korea with an existing leading memory customer. We also completed our transition to a direct sales model and are now utilizing our global sales channel to broaden the commercialization and adoption of our pad solutions. Through business wins, we’ve also expanded our customer list and are now selling pad products to 8 of the top 10 semiconductor manufacturers in the world, versus six previously. We continue to have a rich pipeline of new business opportunities with a wide range of customers on both 300 and 200 millimeter platforms and including combined slurry and pad consumable sets. In addition, we continue to experience significantly shorter qualification times for our NexPlanar pads, on the order of six months versus 18 months with our prior efforts. We are pleased with the momentum we have generated in our pad product area since completing the NexPlanar acquisition and we look forward to continuing this momentum and growth in the future. To summarize, we continue to make progress on the execution of several strategic initiatives to drive profitable growth for our company. We believe that our focused business model, along with our global resources, capabilities and infrastructure, differentiate our company as the leader among suppliers to the semiconductor industry. Based on this and general expectations of industry participants for continued solid near term demand, we believe we are well positioned for continued strong performance during the remainder of our fiscal year. And with that, I will turn the call over to Bill for more detail on our financial results.