Christian Schwab
Analyst · Craig-Hallum.
No, that's extremely fair answer. But my last question for you guys is in my viewpoint, there seems to be a very strategic shift in value in the semiconductor industry coming to the back end, from the front end, you know, driven by trends, like we've talked about 5G, you know, electric vehicles, but a lot of all that stuff is as you know requires advanced packaging, which increases complexity, which increases test times, etcetera. So I'm curious, you know, as we get to post Moore's Law, if you will, a lot of the type of chips that in applications that you're dealing with, you know, we're just stacking more and more chips, right? Those are chips that we're doing no tricks in, typically. And so it just seems like it doesn't matter whether it's yourselves, you know, or whether it's cool [ph] or whether it's form factor; everybody seems to be benefiting from this trend in my viewpoint. Would you agree with that?
Luis Müller: Yes, yes, I would agree with that. I mean, there's some new technologies coming out in electrification, as you know, silicon carbide has a lot of promise in the way you handle and tasks those are a little bit different than what it was an additional packages or even mosfit [ph]. And the same could be said about processes for ADAS [ph], power anticipation during tasks, the requirement for being hermetically sealed for automotive applications, sensor fusion into modules. So yes, there's a variety of package or packaging technology trends, that are impacting the way you handle and test the silicon or some of the silicon the device itself.