Jeffrey Jones
Analyst · Dougherty. Please proceed with your question
Thank you. Good afternoon and welcome to our discussion of Cohu’s most recent financial results. I am joined today by our President and CEO, Luis Müller. Following our opening remarks, we’ll provide details of our performance for first quarter of 2016 as well as our outlook for the second quarter of the year. If you need a copy of our earnings release, you may obtain one from our website cohu.com or by contacting Cohu Investor Relations. Before we begin, you should all be aware that during the course of this conference call, we will make forward-looking statements reflecting management’s current expectations concerning the company’s future business. These statements are based on current information that we have assessed, but which by its nature is subject to rapid and even abrupt changes. Forward-looking statements include our comments regarding the company’s expectations for industry conditions, future operations, financial results, market share gains, expansion into new markets, and any comments we make about the company’s future in response to your questions. Our comments speak only as of today, April 29, 2016 and the company assumes no obligation to update these comments. We encourage you to review the forward-looking statement section of our earnings release as well as Cohu’s filings with the Securities and Exchange Commission, including the most recently filed Form 10-K and Form 10-Q. Cohu assumes no obligation to update these statements as a result of developments occurring after this call. Further, our comments and responses to any questions will not make reference to any specific customers, as we are precluded from disclosing such information by our non-disclosure agreements. Now I’ll turn it over to Luis.
Luis Müller: Thanks, Jeff and good afternoon everyone. In the first quarter of 2016 Cohu again delivered solid financial results and better than forecasted profitability. While semi reported an 11% decline in backend equipment orders in March, measured utilization across installed base, gained a couple points to 81%. We are encouraged by strong orders and substantial progress in the mobility market with key design wins in the growing RF segment, and repeat orders for active thermal handlers for testing mobile processors. In the automotive market, we captured a large European customer with our tri temperature pick-and-place handler. At 39% our total system orders, consumer and mobility was Cohu's strongest market in the first quarter. We introduced a series of products in the last 15 months that we expect will drive significant share gains and for the first time orders in this market surpassed automotive and industrial, historically our largest segment. Cohu's new current systems are well suited for handling and inspection of wafer level and then fragile thin packages that are prevalent in our semiconductors. With these systems, we captured sizeable orders from two new customers, a leading U.S. and a major Japanese semiconductor manufacturer with test operations in China. We plan to fulfill these orders with shipments in the second and third quarters. In the mobile digital general segment we received repeat orders for the eclipse handler for testing power in processes from a leading established customer that qualified this handler in the first half of last year. The majority of these systems will be installed and test of contractors in Taiwan and Korea during the second quarter. As we've shared before, the thermal subsystems business is inherently lumpy and while we expect weaker demand for the next few quarters we received multi-unit orders in the first quarter for testing server processors in orders from a leading mobile customer in early second quarter. In the automotive and industry market was 33% of system orders. We scored a key design win with our matrix pick-and-place handler displacing a European competitor. We expect this new customer to drive about a point share gain for Cohu in the best handler market starting this year. We also have solid demand for handlers testing power semiconductors and NIMs devices, particularly pressure in magnetic sensors that are part of the growing IC content and intelligence in vehicles. Computing was 20% of system orders and stronger than expected. We received additional orders for pyramid handlers in support of testing high-end processes. Solid-state lighting was 8% of system orders. Our current major European customer continue to ramp production and place the multi-unit orders for headless. We had a design win from another large customer for testing five-side emitter LED devices, particularly notable since these devices presents complex challenges for handling and processing. On our market expansion initiatives, we've made good progress and are beginning to develop and deliver solutions for critical customer applications. In RF, the growth of internet traffic and network devices that include wearables, machine-to-machine, and vehicle-to-vehicle or vehicle-to-infrastructure systems demands faster wireless speed that drive higher semiconductor volumes with devices like near field communications, filters, switches and power amplifiers. We are already benefiting from the secular growth trend gaining share with various and also starting to develop new opportunities outside our core handler market. Last July, we introduced the 3D flex vision system for wafer level package inspection. This three-dimensional measurement capability is now a key differentiator enabling share gains and increased AFPs for our third platforms. We recently introduced the RF cash contact and received a first round of orders following several months of qualification at five customers validating this innovative long-life elastomer-free solution for testing high frequency semiconductors over a wide range of temperatures. And we are in customer evaluation over our new WLP program. This system provides delicate handling of their guy wafer level packages reconstituting a ground wafer input onto an optimized forecast, rectangular chuck that enables reuse of existing probe card infrastructure. A full consideration of this platform is also capable of laser marking, final vision inspection, and tapping; eliminating the need for material transfers between equipment reduce working progress and risk of the device damage. We believe this could drive $10 million to $20 million of incremental annual sales starting in 2017. The increasing vertical integration of semiconductors enclosed in a single module that performs various functions known as system-in-package drives the need for comprehensive test solutions that transcends the boundaries of traditional IC desks. In response, we're developing and secured a design win and initial issue order for a new system level platform that is still under development. Such early orders are evidence of the strength of our products solutions, and further validates our strategy to organic growth extent in core adjacent fees. Looking forward, we see positive momentum in the automotive, mobile RF, and IOT markets, as well as customer traction for a new concept of products. Let me know turn it over to Jeff for further details on our first quarter of financial results; and second quarter guidance.