Jeff Jones
Analyst · Dougherty
Thank you and good afternoon and welcome to our discussion of Cohu’s most recent financial results. I am joined today by our President and CEO, Luis Müller. Following our opening remarks, we will provide details of our performance for the first quarter of 2015 as well as our outlook for the second quarter of this year. If you need a copy of our earnings release, you may obtain one from our website, cohu.com, or by contacting Cohu Investor Relations. But before we get started, I must remind you that during the course of this conference call, we will may forward-looking statements reflecting management’s current expectations concerning certain aspects of the company’s future business. These statements are based on current information that we have assessed, but which by its nature is subject to rapid and even abrupt changes. Forward-looking statements include our comments regarding the company’s expectations regarding industry conditions, future operations, financial results and any comments we make about the company’s future in response to your questions. Our comments speak only as of today, April 30 2015 and the company assumes no obligation to update these comments. We encourage you to review the forward-looking statements section of the earnings release as well as Cohu’s filings with the Securities and Exchange Commission, including the most recently filed Form 10-K and Form 10-Q. Cohu assumes no obligation to update these statements as a result of developments occurring after this call. Further, our comments and responses to any questions will not make reference to any specific customers, as we are precluded from disclosing such information by our non-disclosure agreements. And now, I will turn it over to Luis.
Luis Müller: Thanks, Jeff and good afternoon, everyone. In Q1 sales were $68.1 million up 5% year-over-year and above our guidance of approximately $63 million. Orders increased 52% sequentially to $92.3 million driven by strong product momentum in the mobility in automotive markets. Semi conductor equipment accounted for 93% of total orders in the system distribution by key markets in Q1 was consumer and mobility 51%, automotive and industrial 30%, computing and memory 11% and solid state lighting 8%. Early in January we received another follow on order this time for $17.8 million for key core thermo subsystems that enabled testing of mobile processors for smartphones and tablets. These next generation devices need advanced thermo control to mitigate over heating during test. Our products actively manage device temperature enabling customers to achieve improved yields that maximise degrading and value. These sub systems will ship in Q2 and Q3 satisfying demand from our leading company that has grown share in the smartphone market over the last six months. We also reached an important milestone with acceptance from a top-tier U.S. fabless customer of our new Eclipse pick-and-place handler incorporates the same key core technology. This customer outsources device manufacturing and we made initial shipments of Eclipse to one of its test sub contractors in Korea during the first quarter. Additionally, evaluation handlers were installed at three other tests of contractors in Taiwan and Korea that we expect to convert into sales in the coming months. As we mentioned in an earlier quarter, next generation mobile processors increasingly require active thermo controller test. And we project continued growth in this segment for our key core based products replacing existing installed base of equipments. Additionally, we received repeated turret handler orders and continued to see strong demand for testing and inspecting RF devices like, near field communications, filters, switches and power amplifiers. These semiconductors play a critical role in connectivity especially in feature rich smartphones designed to operate across multiple bands like 2G, 3G and 4G LTE networks as well as Wi-Fi blue tooth and GPS. The exponential growth in mobile data is driving a sharp increase in RF device content for phone and consequently increasing test CapEX. We’re not only capturing near term sales opportunities with our handlers, but also developing in partnership with our leading customers an innovative new product as an alternative to traditional wafer probing. This system enables much needed and sort after singulated die and wafer level package testing capability that will improve yield and integrated optical die inspection providing our customers a cost effective solution and further competitive advantage. This new die prober will give us an entry point into the $450 million wafer test market that we don’t currently participate in. Turning to automotive, we received repeat orders from several customers for our matrix pick-and-place system and also gravity feed handlers and we want additional business as a result of increase and demand for pressure and magnetic MEMs test units integrated with our handlers, captured a design win for our Jupiter system for testing large power devices and receive repeat orders for a 32 station third handler from a new customer, a leading Japanese integrated device manufacturer. We also booked repeat orders for the new Saturn gravity handler from two key European customers. A large automotive customer selected our products for testing next-generation radar sensors that operate at near 80 gigahertz frequency. These sensors are part of new active safety systems aimed at reducing traffic fatalities. The higher frequency creates an increasing interesting challenge at test and we’re playing a key role in this market that links radar signal with adaptive cruise control in collision warning systems. Also in Q1, we made the first shipment of a new versatile third handling. This system handles a wider range of devices, integrates our new 3 dimensional vision inspection technology based on fast, more [Indiscernible] and provides customers with flexible module configure ability options. The new vision technology enables more accurate detection of micro VSAT and makes precise topographical measurements particularly on bump dies and wafer level packages. We expect share gains in the estimated 120 million inspection market with this advanced vision system integrated on our more flexible handler platform. The new handler is under evaluation at two leading U.S. headquarter customers and we have multi system backlog for shipment in Q2. In the computing market, device overheating during test is a complex problem. And our proprietary key core technology continues to be key to customers achieving target yields. We received repeat orders for our pyramid handler for testing server processors and we expect to start shipments in Q3. The European customer in this solid state lighting market placed a multi unit order for bringing configuration turret [ph] handlers. This customer is a leader in high power LEDs for automotive applications. This market is still under very stage with only 3% of the 87 million vehicles produced last year having high power LEDs in headwinds. We see continued momentum towards this technology and expect further orders for LED test handlers in Q2. In operations, the first gravity handler built in Asia shipped to Germany for quality check prior to reaching its final destination of the customer facility. This handler incorporates sub assemblies from Asia CMs and a key module built at our Philippines operation with final integration and test at our Malaysia facility. We are ahead of schedule on this manufacturing transition, thanks to our experienced team and established supplier base in Asia. We plan to continue quality check verifications in Germany incurring some incremental cost most likely through Q3 as the production process matures in Asia. Earlier this year we formed the new business union within our semiconductor group called ITS, Integrated Test Solutions. This groups charter is to profitably grow contact for sales in this last volatile higher gross margin 650 million consumables market by leveraging our market leadership positioning handlers, global sales and customer support channel in key technology capabilities to solve the challenges in testing ICs and LEDs. We believe we have an excellent opportunity to expand sales in this segment of the market. Our handler product line has never been stronger and I’m optimistic about our growth prospects in wafer level package inspection, die probing and test contacting. Combined, they will expand our total available market from $850 million to about $2 billion; further diversify our product offering in few new opportunities to drive top line revenue and earnings growth. Let me now turn it over to Jeff for further details on our first quarter financial results and update on our progress towards improved gross margins and Q2 guidance.