Gideon Wertheizer
Analyst · Benchmark. Please go ahead
Thank you Richard and welcome everyone. We are off to a great start for 2015 with first quarter revenue exceeding the high-end for our guidance range. Our top line growth was primarily driven by strong licensing demand for our product. We also continued to show progress on our royalty from both in revenues and new product launches from our customers. Total revenue for the first quarter was $13.8 million slightly higher compared to the first quarter of 2014. Licensing dynamics and deal closure continued to be robust. Licensing revenue came in at the high 7.8 million above our guidance. We signed 12 agreements in total during the first quarter and record high in terms of number of deals signed in a single quarter. Of the 12 agreements signed during the quarter, seven were for the DSP platforms and software and five of the agreements were for our connectivity portfolio. Ten are non-baseband applications, eight are first time customers for CEVA. Our customer target applications include smartphones, LTE routers, Advanced Driver Assistant Systems ADAS, surveillance cameras, wearable and storage systems. Geographically, five of the deals signed were in the U.S. one was in Europe and six in Asia. At this stage let me elaborate on four of the agreements signed in the quarter as both are in indicative of the attractiveness of our offering and the broad market opportunities we are exposed. The first of this agreement, is a lead customer for a U.S. best in breed CEVA-XM4 Intelligent Vision Processor that we announced at the Mobile World Congress earlier this year. Our customer is a well known vertically integrated camera mobile supplier, who designs it's on chips for intelligence camera systems targeting ADAS application for the Tier-1 automotive OEM supply chain. This marks the first time that our vision technology is targeted to be deployed by automotive OEM system a market known for its very high barrier to entry. The second deal is with a major player in the sizable MEMS market, with plans to incorporate our DSP within an upcoming product. The combination of DSP and MEMS offer a very attractive ready proposition both in terms of power and cost for smartphones connected car, wearbands and many other smart devices that as of to date require separate discrete chips for those we operate. The third deal is with high volume analog semiconductor company that China signed up as a lead customer for about [pres 35] next generation Bluetooth 5.0 IP. Our new customer plans to integrate our Bluetooth IP and be ahead in the market for next generation wearband, wireless audio and smart home product. The Bluetooth 5.0 standout is intended to also substantial improvement in range, bit rate and audio capabilities versus the existing Bluetooth 4.0 standard. And the fourth deal of note is with a major Asian semiconductor company that adopted our CEVA-XC DSP for the LTE router market. LTE router is small form factor Wi-Fi hotspot that connects multiple devices to the LTE network simultaneously. There are multiple used cases for LTE router such as Verizon MiFi or mobile Internet in public transportations and taxis. When taking a broader prospective on the driver of for our licensing activities, we can pinpoint two industry related trends that we're capitalizing on. The first is the proliferation of wireless connectivity in the form of LTE Wi-Fi and Bluetooth, which appeal many different devices, including smartphones, tablets, connected cars, smart home, wearband, surveillance and other variance of the IoT segment. Along with this our customers are experiencing a dramatic increase in the complexities; arise for new application centered on video, images, speech and audio. These trends play well to our cost trends and product innovation in the following ways. Our vision product line and in particular our newest CEVA-XM4 Intelligent Vision Processor, set the stage for new era of devices with the ability to learn using advanced android based on UI network. New product category such as autonomous car intelligence, intelligence surveillance system and drones as well as next generation smartphone, the target perceptual computing will all demand the performance in power metrics that the CEVA-XM4 is able to provide. Our widely deploying and highly successful CEVA-TeakLite DSP architecture cultivate new uses for speech and audio such as always on contextual environment speech and audio recognition, natural device introduction, audio emulsion and alike. And our full hardware and software solution for Bluetooth and Wi-Fi connectivity true life and shorter design cycles for those customer looking to innovate in the highly fragmented IoT space. As a result of those, the level of interest in our product and the caliber of companies that we have engaged with; we are optimistic of our licensing prospect for the remainder of 2016. Our unique technology and value position is broadly recognized aligned us move fast and extend our customer base in future growth royalty revenue foundation. Turning to our royalty revenue segment, we recorded a 4% year-over-year quarterly increase in royalties. The first time after more three yields of year-over-year decline. This milestone continued to transition and ship the way from feature phones, tower local smartphone. In Credit Suisse's research overall smartphone market penetration is expected to rise tower 90% over coming years where it was 50% currently with total addressable population in excess of 5 billion by 2017. In addition the machine-to-machine segment is evolving quickly. For new analysis from GSMA intelligence; these segment is forecasted to reach 1 billion connection by 2020 with verticals as such utilities, smart cities and agriculture. In the last few weeks the baseband landscape has become even more favorable for CEVA as new flagship smartphone OEM release new LTE product enabled by CEVA DSP. In particular I'd like to highlight the following key development which I am sure manage to catch your attention as well. Xiaomi the largest smartphone vendor in China announced an affordable version of its popular Redmi brand, the Redmi 2A which is available through China Mobile at a retail price starting at $80. The heart of the Redmi 2A, the [lead] software designed LTE model SoC enabled by CEVA-XC DSP providing cost efficiency and multi-mode support. Samsung in house model design is capturing substantial share in the new Galaxy S6 and S6 Edge. Recent peel down analysis by Chipwork and iFixit show the Samsung Shannon 333 LTE Advance slim modem enabled by CEVA DSP in Galaxy S6 and S6 Edge model shipping as many operators around the world and so for the first time was AT&T and T Mobile in the U.S. Intel introduced the Atom x3 processor product family, formally code named SoFIA its first integrated SoC that combines Intel Atom Application Processor and 3G and LTE modems enabled by CEVA DSP. This integration level allows device manufacturer to deliver full feature 64bit smartphone, tablets and device at affordable prices ranging from $75 for entry level devices up to $200. Intel recently commented that over 45 tablet and smartphone design are in development using the Atom x3 processor. Intel also revealed its third generation LTE slim modem, XMM7360 supporting advance LTE features such as three component carrier to achieve download speed to 450 megabit per second, this chip is targeted for flagship smartphone models. [Broadband] continue to gain traction in smartphone across multiple fields and recently introduced two new chips that are already in mass production. The SC9838 is a five-mode PSoC which will allow the price of LTE smartphone to come down as low as $60. Already the SoC is been certified, with multiple operator in China, India and around the world including China Mobile, China Unicom, Orange and Vodafone. The SC7731G is 3G Wideband CDMA SoC, it is widely deployed at major brand OEM in product such as Samsung's first Tizen OS based phone the Z1, HTC new Desire 326G dual-SIM smartphone and Huawei new Honor Pad 3G tablet. In addition to our cellular business shipments, we are still seeing good momentum with the new chips enabled by our Bluetooth technology. Dialog Semiconductor announced new addition to its SmartBond family of BLE chips targeting a range of products such as sport band, wireless charging, wireless remote control and the like. Xiaomi announced $16 smart weighting scale that tracks your weight and body mass index and share the data via Bluetooth to any smartphone. Action Semi and Beken are deploying our Bluetooth for wireless speaker application. Overall, our Bluetooth shipments are sizeable; we have more than 20 million Bluetooth chips now shipping each quarter by our customers. We expect this growth to continue. With that said, let me hand the call over to Yaniv to discuss our financials and guidance.