Lip-Bu Tan
Analyst · Needham & Company. Your line is open
Good afternoon, everyone. Thank you for joining us today. I'm pleased to report that Cadence delivered a strong Q4, achieved excellent operating results for the year. For 2019 amidst environmental headwinds, we delivered 9% year-over-year revenue growth and 32% non-GAAP operating margin with strength across our product lines. John will provide more details shortly. Macro uncertainty and geopolitical headwinds persist into 2020, but strong design activity continues at both advanced nodes as well as More-than-Moore front. This is being driven by generational technology drivers. 5G, AI and machine learning, hyperscale computing, industrial IoT and autonomous vehicles which have all helped semiconductors at their foundation and are propelling the need for next-generation computing, connectivity and storage. I believe these trends in addition to system companies developing custom silicon, domain-specific processing, computing, silicon start-ups and digital transformation of vertical segments like industrial, and aerospace and defense will continue to fuel silicon renaissance over the next few years. In 2019, we unveiled our Intelligent System Design strategy that will enable us to maximize these opportunities, while tripling our TAM through proliferation in foundational design excellence segment and expanding beyond EDA into system innovation and pervasive intelligence. We achieved strong growth in design excellence, which is comprised of core EDA and IP fueled by the launch of several innovative products, as well as wide-ranging expansion of our solutions particularly at market shipping customers. Our digital and signoff business achieved double-digit revenue growth for the year, as strong proliferation continued, driven by customer demand for solutions offering best-in-class, performance, power, area, and time to market capabilities. Our market shipping global mobile company expanded their partnership with us, through a, large and comprehensive EDA software booking, which included a significant expansion of our digital footprint. Building upon successful, 7-nanometer designs, Cadence and Broadcom expanded, their collaborations to include the creation of 5-nanometer designs, using Cadence digital implementation solutions. We have about 50 new full flow wins in 2019, including a recent full flow competitive win, for new advanced node designs, with a leading maker of FPGA chips. During the year we announced successful -- successes in our digital business with customers such as, MediaTek, Samsung, Socionext, Innovium, Mellanox and Uhnder. Verification is one of the top challenges of our customers. And our verification suite had several wins across multiple vertical segments, in 2019. Our Xcelium parallel simulator with this innovative rocket tech technology continues to proliferate and recently had a noteworthy win at the leading U.S. computing company. Our hardware family comprised of Palladium Z1 emulator. And recently introduced Protium X1, FPGA-based prototyping platform provides a comprehensive solution across IP and SOC verification, hardware-software regressions and earlier software development. Due to a common, front-end compiler this complementary platforms when working in tandem deliver even more compelling value to our customers. And we are getting strong traction with Protium X1 being deployed at Palladium accounts. Hardware had a record year with significant expansion at several customers, while adding 19 new Z1 and 11 new X1 customers, over the year. Including a global marquee customer that plays one of the largest hardware orders ever for Cadence. 2019 was an outstanding year for our IP business, with 16% year-over-year revenue growth. As our focus strategy and strong portfolio leveraged the continuing IP outsourcing trend, while enabling customers to accelerate their innovation, and time to market. It was an especially strong quarter and year for our Tensilica products, with wins in audio, imaging, computer vision and machine learning. Loyalty growth was strong. Particularly in the audio market where Tensilica, HiFi, DSP processor are increasingly proliferating in True Wireless studio-based earbuds and in the next-generation smart speakers. Design IP had a great year as well with strength in DDR, PCIe and our 112-gig SerDes products, as we fully proliferate with customers in AI, 5G and cloud computing. Early in the year we augmented our partnership with a marquee U.S. semiconductor company, through our largest IP agreements -- arrangements ever, which included Tensilica processor IP 112-Gig SerDes IP as well as additional memory and interface IP products. Now let us move on to the system innovation segment of our Intelligent System Design strategy. In 2019, we entered the system analysis market. An estimated $5 billion TAM opportunity by introducing two exciting new products: The Clarity 3D Solver, the next-generation solution for electromagnetic field simulations; and Celsius Thermal Solver, the industry first complete electrothermal co-simulation solution. Increasing system complexity and time to market pressures are driving the need for far more engineering simulations, while underscoring the significant performance and capacity limitation of existing industry solutions. Both Clarity and Celsius are based on proven massive parallel architecture that delivers up to 10 times faster performance, while maintaining gold standard accuracy. We are extremely pleased with the ramp of these innovative products with well over 90 evaluations underway and more than 20 customers to-date including Micron, STMicro, TÜV SÜD, Realtek and Ambarella. Generational industry trends are driving the need for increasing -- increased heterogeneous integration coupled with a slowing down of Moore's Law drove strong demand for our advanced packaging solutions leading to double-digit year-over-year growth. There are growing challenges in designing products for complex high-frequency RF application, especially in the 5G wireless, aerospace and defense and automotive segments. To that end, we acquired AWR a leader in high-frequency RF solution. We also acquire Integrand Software, which provide a leading RF solution for analysis and extraction. Integrating these technologies with our Virtuoso and Allegro platforms will enable us to offer a comprehensive platform for RF millimeter wave products from initial design to simulation, implementation, verification and manufacturing. We entered into a strategic alliance agreement with National Instruments which is focused on the design to test flow enabling customers to improve quality and reduce time to market. Lastly we extended our cloud leadership in EDA providing customers with compelling productivity, flexibility and scalability benefits. Adoption of our cloud portfolio accelerated and we passed the 100 customer mark. TSMC partnered with Cadence and Microsoft on the first TSMC IC layout contest. Cadence delivered CloudBurst space Azuro environment that allows several hundreds of students to simultaneously compete using Cadence layout tools. With that, I will now turn the call over to John to review the financial result and provide our updated outlook.