Peter Wennink
Analyst · Citi and thanks for taking my question
Thank you, Wolfgang. As Wolfgang highlighted, our first quarter results were very much in line with expectations and our business is developing along the lines that we'd communicated on the last two quarters. While, Wolfgang gave a qualitative outlook for 2016 with combined memory appearing flattish half over half, with combined logic up in H2 over H1, and with combined services up half over half as well. We do see trends and developments that we believe are worthwhile mentioning. First of all, despite a difficult pricing environment in DRAMP. Our forecast has further strengthened a bit in support of a continued drive by our customers to keep shrinking costs and specifically for long [ph] 20 nanometer and sub 20 nanometer nodes. It is resulted in our current flattish half over half sales view for our combined memory business. For 3D NAND, shipments continue to new fabs and to fabs repairing for 2D to 3D conversions. And of course, we're watching with interest, the developments in the volume introduction of the cross-point architecture. As it will become quietly though intensive in time versus the 3D NAND architecture [ph]. Secondly, as mentioned in previous earnings calls and evidenced by our backlog. It is clear, that our sales to our combined logic customers will become more important starting in the second quarter. As we'll continue, as we're expecting a continued increase in logic orders in the coming quarter in support of initial 10 nanometer node Ramps. And as a result, we now forecast the significant increase in combined system and service and field option sales in Q2 to be at the level of €1.7 billion. Also of note in the first quarter, we saw shipments for 28 nanometer logic capacity additions continue and I would like to make an observation here regarding logic node ramp behaviour. Looking at the ramp speed, size and length of the latest most advance nodes. It appears to us, that the rollout pattern of such nodes is changing. Previously, node transitions followed each other in a rather unpredictable pattern throughout our entire logic customer base. Whereby new node ramp quickly in turn ending the capacity ramp of the previous nodes concurrently. What we see today, effectively starting with 28 nanometer node is that the initial new node ramp is done by a very limited number of customers, but with greater intensity meaning speed and initial size of the ramp. Then the rest of the node ramp is executed over a prolong period, where by the rest of the logic customer base follows the initial customers in phases. Current evidence of this trend, is the aforementioned continued shipments for 20 nanometer logic capacity additions. It is still continuing more than four years after the initial introduction. In discussions with our logic customers, we see similar capacity in expansion behaviour overtime for future nodes. With little intensity, rising significantly node by node, the initial node transitions are lengthening into three years, with the aforementioned longer tail end of previous nodes. This will likely make shipment and order patterns for a specific node, as well as the ultimate wafer capacities, less transparent overtime. However, based on the input from industry analyst forecast of end markets developments. We believe, that our long-term assumption of a 10% node on node reduction of the ultimate installed wafer capacity is still appropriate. As you'll know, this was one of the previous underlying [indiscernible] leading to our €10 billion sales target by 2020. As for the 10 nanometer node. Its introduction is clearly progressing. The speed and initial size of this ramp can be explained by the value proposition provided by the significant shrink of this node versus the prior node. The ultimate spend levels for logic in 2016 will depend on amongst other things. Both the level and demand and the rate at which our customers will be able to execute their ramps. This is why, it is still a bit too early to predict the overall 2016 spend levels today. For field options and services, we see continued strength in 2016 and this should show growth as previously estimated in the range of 10% over 2015. On the ASML product side, we continue to focus R&D spend on the quality products that are essential to the ramp of our current and advanced processes. In Deep UV addressing the growing little challenges of complex and lithography intense multi-pass patterning. Our recently launched, TWINSCAN NXT:1980 with significant improvements in all key performance metrics, has rapidly reached productivity of more than 4,000 wafers per day. Demonstrating the maturity of our latest NXT platform. In Holistic Lithography, we started rolling out our YieldStar 350E, integrated metrology system. YieldStar enables highly accurate metrology for subsequent analysis in ASML's Holistic Lithography software, which allows customers to control leading-edge production processes for increased yield. Holistic Lithography products are now extending into EUV processes. The customers evaluating our EUV source mask optimization software for development of 7 and 5 nanometer logic technologies. In EUV, you're all aware that our continued focus has been on improving EUV stability, availability and productivity. The key performance metrics that drive new technology production. Expect no changes in this focus, for the foreseeable future. In the past three months, we again demonstrated improved productivity and availably moving EUV towards manufacturing readiness. By way of example, we achieved productivity of more than 1,350 wafers per day in our factory on NXT:3350 bringing us closer to our 1,500 wafer per day target for 2016. Separately three customers showed availably of more than 80% on average for four weeks on the NXT: 3300's. In addition, industry leading customer presented an abundance of EUV results, at the SPIE Advance Lithography Conference this past quarter, that reinforced the need for EUV and demonstrated real and significant process in key two performance areas, making increased customer confidence in EUV for manufacturing insertion at that. ASML's commitment remains to do everything within our capability and power to bring EUV to manufacturing readiness. Now with that, we'll be happy to take the questions.