Peter Wennink - President and Chief Executive Officer
Analyst
Thank you, Wolfgang. And so as Wolfgang highlighted, we had a very successful year in 2014 with record sales, record annual gross margins leading to significant EPS growth. Alongside our 2014 financial performance, we can also claim significant successes in product development, new product introduction and product adoption. As Wolfgang also highlighted, we expect our strong second half 2014 sales to continue into the first half of 2015 driven by continued substantial memory spend and an increased spend in the logic sector, which is all supported by our current backlog. Today, we see that foundry is essentially working on three to four nodes at the same time. The 28-nanometer node, the current high-volume node, is still not at its 400% capacity as new demand for this node keeps growing. Therefore, we expect that our two shipments in 2015 will be used for capacity additions at this node in order to meet the growing demand. At 20 nanometers, the first chips are on the market. So, that node has moved into volume at some foundries. The 16-nanometer and 14-nanometer nodes are being qualified for production and as process development happening at the 10-nanometer nodes. As we mentioned in earlier calls, the foundry industry effectively sees the most aggressive ramp of new nodes ever in their quest for faster, more energy efficient and cost effective shrinks for mobile and communications applications. In memory, the industry analysts are expecting both NAND and DRAM markets demands to continue growing at the similar rate of 2014, which means a little under 30% for DRAM and about 35% for NAND. New DRAM fabs are planned and some are already being equipped to meet demand compensating for some loss capacity in DRAM due to device shrink, node complexity and compensating for growing device size with movement from PC to mobile DRAM. Next to the initial introduction of vertical NAND, NAND fabs are continuing their planar node shrinks and are expected to add greater capacity to meet forecasted bit demand. As to our product development and product introduction successes, we have ramped our NXT:1970C immersion product, launched late in 2013, faster than any new product introduction before with over 50 shipments in 2014. Our TWINSCAN immersion system set new productivity records at over 1.5 million 300-millimeter wafers imaged in a 12-month period creating huge value for our customers. And we have had significant success in customer adoption of our new YieldStar metrology products with an installed base of all YieldStar products touching on 200 units. Regarding EUV, we commented in great detail at our Investor Day in November, so I won’t repeat myself too much here. But as a reminder, we have met the 500 wafer per day target that our customers set for us in 2014. As we have now demonstrated, these productivity levels at multiple customers over multiple days. We also demonstrated source power at 100 watts with 96% dye yield, which is a key factor to get to the productivity levels that our customers need for volume production. Our 2015 productivity target remains at 1,000 wafers per day. And importantly for our customers and for our EUV program we received the first two orders for our fourth generation NXE:3350 EUV tools, the first of which is planned for shipment in the middle of this year. Our EUV product focused for 2015 is on improving the stability and availability of the machines in the field and to continue the encouraging progress that we have made with EUV productivity so far. We will furthermore concentrate on shipping the first six NXE:3350s so that our customers can continue their process integration planning and to begin to introduce these tools into their production environments. Before I end my introduction, I would like to comment on some recent events regarding our customer co-investment partners, equity holdings in ASML. All co-investment partners are approaching the end of their ASML equity lockup period whereby they can begin to sell all or part of their holdings if they wish to do so. Each company will act in their own best interest and are generally not obliged to inform us of their decisions. I would like to make it clear, however, that whatever they decide in this regard, it in no way represents a change of support for ASML or ASML and there is no impact on the co-investment R&D contributions committed by each partner company. Now with that, we will be happy to take your questions. I’d like to turn back to you, Craig.