We have now started however to see some signs where overall need for capacities catching up with the installed based. There is indeed some spurt semiconductor demand you would have heard from China at this point. There is some inventory catch-up leading to increase utilization, but most importantly, we see the technology transition activity not yet orders, but activity is picking up. Certainly, the fact that the end customer semiconductor demand is starting to stabilize with an every growing mix towards a new product, and that means transition to new notes, is forcing installed based upgrades. As of last year only the leaders had invested a bit of capacity in 45 nanometer flash, 55 nanometer DRAM or 45 nanometer foundry and Logic. The rest of the market is now organizing their conversions during this year, 2009, and during this year the leaders themselves, who had already started these conversions, are now involved in even more aggressive conversion, mainly 75 nanometer Flash and 45 nanometer DRAM development and these things will materialize also this year. The founding of TMC in Taiwan, although certainly not resolving the DRAM industry consolidation that some have expected, is in any event clarifying the playing field and is triggering technology investment planning by the different players, who have been holding their investment waiting to see what TMC’s influence would be. We have modeled the market needs for the lithography technology transition. As you know it’s our old traditional model and as Peter confirmed again today, we believe, that in our revenues between EUR 400 million and EUR 500 million per quarter, would support these technology transitions that we expect this year. We believe that we will receive this level of lithography equipment revenue, therefore which is reached within the second half of 2009. In other terms, we confirm our viewers voice at the beginning of the global economic crisis, that after numbers of months of extraordinary low level of sales, like we are having in Q1, ASML will stabilized on technology buy levels, until capacity picks up. So in other terms we saw three phases; a very low sales phase that we are currently suffering through; a stabilization at a higher level when the industry even through recession, if you need a minimum number of technology transitions, which are the numbers we just mentioned, EUR 400 million to EUR 500 million per quarter; and then only after we get out of recession the capacity is picking up and adding up to these basis. We are certainly not seeing the capacity pickup at this time, but we see the broad technology buy backs. We are therefore continuing our investments in new products, targeting introduction of our new cost effective platform called the XT4, and the new Double Patterning platform called the NXT this year, as well as delivery of five EUV tools that we have on order for 2010. We are also introducing a new suite of lithography, designing and manufacturing tools supported by our Brion subsidiary, and to making full use of the litho hardware architectures that we have provided. This quarter we have even proved a first in the industry. We’ve proved an EUV imaging, with first full field system at image size of 28 nanometer dense lines, which were presented at the SPIE Advanced Lithography Conference in February. In summary we’ve been confronted with a demand freeze in the very short term and we now see the first signs now preparing for a pick-up of technology purchases. These sales levels will enable us to continue our downturn management strategy, while we prepare for a broader recovery of the semiconductor industry in general. During this period we intend to not burn cash, maintain our technology investment leadership and work on our cost structure efficiency for the future. So with this, Peter and I would be pleased to take your questions. Thank you.