Steve Kelley
Analyst · Deutsche Bank. Your line is now open
Good afternoon. Thanks for joining the call. Today, I'll review our third quarter performance and fourth quarter outlook, then provide color on some of the markets and technologies, which are driving our second half revenue growth. I'll also review Amkor's strong position in the fastest growing parts of the semiconductor market. Third quarter revenue was above the high end of our guidance because of stronger-than-expected demand for advanced packages. Operating income, net income and EPS also exceeded guidance, largely due to our 21% sequential revenue growth and continued cost discipline. Successful launches of flagship phones with high Amkor content drove our sales in the communications market. In the consumer market, we benefited from the ramp of a new high volume advanced SiP product. Our revenue in the automotive and industrial market increased 10% sequentially with roughly equal gains in advanced and mainstream packages. ADAS and other digital intensive applications fuel demand for advanced packaging. Pipeline replenishment and new product launches drove growth in mainstream automotive packaging. In the fourth quarter, we expect revenue and profitability similar to the third quarter. At the midpoint of our fourth quarter guidance, we expect second half 2019 revenue to be 22% higher than the first half. Amkor's strong position in the communications, high volume consumer and automotive markets are driving that growth. Despite our revenue gains in advanced packaging, we have not yet seen a similar recovery in the overall mainstream business. We expect our mainstream business to improve in 2020 as channel inventory issues are resolved. The return of mainstream demand to normal levels should provide a substantial upside opportunity for Amkor. As we look to 2020 and beyond, we are pleased with our position in many of the fastest growing areas of the semiconductor market. In communications, the deployment of 5G technology will spur a new smartphone upgrade cycle, driving up unit demand. 5G technology will also be deployed in cars and factories and in other applications which require high speed wireless connectivity. Advanced package technology from Amkor has been chosen for many key 5G circuits and modules, including AP, baseband, RF, power management transceiver, sensor and antenna functions. We also see significant growth potential in the high volume consumer market. Amkor's advanced SiP technology can be used to increase the functionality and improve the reliability of wearable and other small form factor products. In automotive, we are benefiting from the widespread adoption of advanced packages for ADAS, infotainment and other digital intensive high pin count products. Amkor's Flip Chip, Advanced SiP and wafer-level fan-out packages are all being used by automotive customers. Our automotive Flip Chip and SiP packages are built in high volume in our Korea factories, which for years have delivered outstanding quality and yield performance to a wide variety of demanding customers. Wafer-level fan-out products for automotive applications are built in our Portugal factory, which has a strong quality orientation well-suited for the automotive market. In summary, our focus on delivering advanced technology, high quality and high yields has allowed us to establish a leadership position in many of the fastest growing semiconductor markets. These markets have been key to our revenue growth in the second half of 2019, and we expect them to drive revenue growth in future years. Megan will now provide more detailed financial information.