David Wang
Analyst · Patrick J Ho from Stifel
Thanks, Gary. Good morning, and welcome, everyone, to today's call. 2020 was a very productive year for ACM. We are faced several challenges, such as the COVID-19 pandemic and trade tensions. We overcame these challenges through hard work and good execution and a positive tailwind in China semiconductor industry. We focused on what we could control. We managed our supply chain. We executed our customer deliveries. We expanded capacity. We introduced new products, and we made great progress with new customers. We also moved forward with our long-term facility plan in Lingang and completed the [apartment] for employee housing development. Before getting into detail, I would like to thank our employees for their hard work and dedication. I also want to thank our customers, partners and shareholders for their continued support and confidence in ACM Research. For the full year, we had a record revenue of $156.6 million, up 46% and a record shipment of 182 million, up 58%. Non-GAAP operating margin was 17.3%, and we ended the year with a $71.7 million in cash and additional $28.2 million from our holdings of SMS, STAR Market shares. Our success starts with our customer. Please turn to Slide 4. We have 5 major front-end customers across foundry and DRAM as well as several back-end wafer packaging and assembly customers. Our new customer, manufacturer of analog devices, they choose ACM technology to optimize their own production capability. We'll help them achieve the operational excellence they needed to compete in today's global semiconductor markets. Let me discuss our key customers. I will start with the Shanghai Huali and Huagong Semiconductor, also known as Huali Huagong Group. They are leading advanced foundry in China and our customers in 2020 and 37% of total sales. They are great customers and neighbors with production near on Shanghai headquarters. Shanghai Huali is a leader of a multiyear capacity expansion, making good progress in 20. While on semiconductor is adding capacity and is truly edge fab in Asia. Their major products are CIS and power devices, and capacity will be more than 80,000 per month by end of this year, up from 30,000 per month at the end of last year. We are participating in both projects. We have several first group -- first demo system in Huali for some of our newer product offerings. Next, YMTC. YMTC is our the seventh largest customer, contributing to 27% of the total sales in 2020. We are working closely to support YMTC 3D mass production line in Wuhan. Public reports say that YMTC give its production capacity to 50,000 wafer per month in 2020, and they are expected to add another 25,000 to 50,000 in 2021 and convert from 64 layers to 128 layers. We believe they are, YMTC, the largest single-wafer supplier. ACM too are being employed in a significant number of cleaning fab. So we continue to expect strong demand from YMTC as they scale their production capacity in Wuhan and other major facilities to come. ACM's further largest customer was SMIC, the largest foundry in China. It is 12% of the sales in 2020, up from single digits in 2019. While it's in Shanghai and the flexibility to deliver SMIC, our business level also depends on other new suppliers to gather license to ship their own tools to AMC. We are well positioned with a range of the tool SMIC, but are factoring in just a small amount from SMIC in our 2021 outlook. Now let's touch on our other significant customers. I will begin with SK Hynix, the #2 global DRAM supplier. SK Hynix was ACM's first major customers, a strong testament to our proven fast cleaning technology and ability to improve production yields. We started with just a few production steps at SK Hynix. Now our tools are used more than 20 steps as a progress to more advanced nodes. SK Hynix was less than 10% of our sales in 2020, down from about 20% in 2019, as expected due to pause in DRAM cycle. SK Hynix implemented several technology updates in 2020, and we expect them to return as a 10% customer for 2021 and beyond through technology upgrades and capacity additions. Next, in XMP, a nonChina-based entrant to the DRAM industry. We deliver our first SAPS-V tool to them in later 2019 and recommend revenue in Q4 of 2020 upon acceptance. They select us for compelling value preparation, proven ability to improve yields and solid technology road map. XMP is in the early stage of a multiyear production plan. We are positioned to participate in the SAPS, Tahoe, very critical cleaning pools, ECP and other tools when they scale up in 2021 and beyond. Finally, we have 2 new analog power IC customers. We delivered multiple first tool in the third quarter -- third and fourth quarter of 2020 and recognized some revenue in Q4. The first tool, including our semi critical tools, scrubber, wafer, backside cleaning tools and ultra [indiscernible] SAPS cleaning tools and Ultra FM Furnace tools for cleaning process. With this, we have penetrated 2 of the 5 key cleaning edge nodes and other PIC and CIS manufacturing in China. I'm happy to see we are very active with all of the remaining 3 players and expect to receive orders from them this year. We believe these customers alone represent a significant opportunity for ACM. Many of them are still in early or middle stage of multiyear capacity expansion and are buying just a friction of our products. We think our current customer base alone can support solid growth for years to come, as these customers add capacity with our tool in additional production fabs and buy more ACM products. Innovation will enable us to capture new and improved large market opportunity. Please turn to Slide 5. As an emerging suppliers, we're focused on delivering advanced technology at competitive cost. We have a strong R&D team in Shanghai and Korea, and one of the largest service teams for semicon equipment employees in China. This puts a critical mass of near some of the newer and larger semiconductor projects on the planet. We consider this a great opportunity. We have not yet stretched the scope the next few years, a landgrab period, to expand our product line and scale our business as new major semiconductor products build their produce, build their business in China. We intend to gain market share by expanding our product line and gaining new customers both in China and around the world. We estimate our current product portfolio address about USD 5 billion of the global wafer cleaning market. This includes DRAM, 3D NAND, foundry, power devices and analog applications. Our cleaning tools adjust about $2.5 billion or 80% of our a $3 billion total wafer cleaning market. We start with our flagship, SAPS, TEBO and Tahoe, of course, coupled with our semi-critical cleaning tools. Our new product added another $2.5 billion, including $1.7 billion by Furnace, $5 million by our ECP and more than $30 million by our strategy polishing products, wafer manufacturing and other advanced packaging process equipment, including coder, developer, [indiscernible], scrubber and [indiscernible]. In 2020, we spend 12% of sales or about $18 million in R&D, up 55% from 2019 levels. That spending enabled us to expand our offering beyond SAPS and TEBO and Tahoe, semi-critical tools, ECP, and most recently, Furnace products. Our ECP tools are off to a very good start. In 2020, we delivered a handful of first tool to front-end and back-end packaging customers and had a greater revenue contribution for the year. Our key products, including ECP AP for advanced packaging and ECP MAP for copper interconnections, ECP [indiscernible] for front end. Our secret force is the ability to provide uniform playing outer center layer. For advanced packaging, we have developed a proprietary high-speed carboplatin technology with the patent pending to significantly improve copper pillar plating. To place metal film [indiscernible] or tools, SAPS [indiscernible] at a high speed and better reformatting is a major challenge around 3D plating applications today. Historically copper plating for pillar and high trading rate due to the mass transfer limitation that reduced preparation rates and generally the uneven top profile of a pillar. Our new high-speed plating technology solved the mass transfer challenges while achieving a better pillar for profile and delivering the best heights in quality less than 3% as well as the high throughput. The CCGT is high-speed plating rate, together with our SAPS copper polishing pool, will become major wining products in coming 3D advanced packages. We are also excited about our Furnace opportunities in 2020. We delivered full foster tools to 2 companies, and they plan to deliver several more in the first quarter this year. Furnace has been jointly developed by our Chuansha and Shanghai team. Both teams have worked seamlessly to solve their alpha and beta tool issues and the teaming process to meet customer requirements. They have made a significant progress in improving this process, including HDL, cleaning and a high vacuum of cleaning process. Our teams continue to develop [indiscernible] and high-temperature oxidation buses. Our next step is develop such autonomous layer separation, ALD process, which is the most challenging and promising product for advanced manufacturing nodes. We have successfully implemented our multiple product strategy and expanding our product portfolio from wet products as wet SAPS, with joint product and vertical Furnace, which make our first entry to dry products and more to come in the near future. For 2021, to prepare for new opportunity ahead, we plan to accelerate our R&D to about 14% of our sales, redoubling total market addressed by our products from $5 billion today to more than $10 billion. We are too early to offer details. I can see that our team has begun work on serving new major products that can get us close to the $10 billion addressable market growth in the next couple of years. Next, I will comment on our efforts on winning major first tier of new customers. Our investments in our global sell team are making steady progress, we hired a US-based team of sales in April of 2020 as well as several other key hires. During the year, we delivered our very first win in few labs, with a lab of the equipment player that needs to separate cleaning with its own process. Thanks to the greater execution of service team, the customer formally accepted the tool, and we booked the revenues in Q4. The team is actively building a sales pipeline with regular engagement, such as technology discussion in the U.S. and the Taiwan players. We are confident that, in fact, TEBO, Tahoe and high-speed copper plating as well as SAPS, we can secure wins at one or more major first-tier of customers during 2021. To fulfill our growth ambitions, we will need capacity. Let me update on our progress. Please turn to Slide 6. Our original facility in Shanghai remains. The headquarter is in Shanghai. It includes our R&D, SG&A and prototyping and production of new products. We stated that we started production at our second factory in Tensa during September of 2018. We quickly see and added the second floor to production in Q3 2020. We now have a 300 million of annual revenue capacity at tensa. We believe that we can further expand to more than 5 million of revenue capacity by leasing additional space. Our new Lingang facility will include production and R&D with a planned 1 million square space of growth space. We will have ability to increase our production capacity to 1.5 billion. During 2020, we purchased 50-year land rights in Lingang. We expect additional architectural and design work in the first half of 2021 with initial production expected in later 2022. Ventures in our Lingang operation is low-cost employee housing. While not common in the U.S., it is expected as a practice for large companies in China, particularly in Shanghai. We offer housing to attract and maintain key and experienced employees. We train many of our key engineers and managers to more than a decade. We need keep these key employees to secure our future growth and technology development. During 2020, we deposit $40 million towards the purchasing of 152 housing units. We paid for -- these are over half of the amount from ACM Shanghai cash balance. We financed the other half with a 10-year loan facility. Before I provide our 2021 outlook, let's discuss the status of the Star Market IPO of ACM Shanghai. Progress in steady from slower than expected. Soon after '18, Shanghai complication of 2 -- the Shanghai Stock Exchange Commission or SEC on September 30, 2020, events in the U.S. caused a delay in IPO. It is stated with the short sale report issued on October 8, 2020, followed by a class-action lawsuit by December 21, 2020. We have previously discredited our disagreements with the short seller report, and we, therefore, believe there is no substance to losses, which is largely based on the short sale report. The SEC, which is not familiar with this kind of report and a lawsuit want to better understanding the U.S. legal process. As we have also previously described, we responded with a 5 points verification report to the short seller report. And [indiscernible] the report was accepted by SEC on December 11, 2020 and released publicly in both China and the U.S. Before our administration application should be filed with the China Securities Regulatory Commission, or CSRC, however, the civil suit was fired, and we ran that as SEC would again require additional information. Our team is now in the process of providing secondary response to report to SEC to plan the class action lawsuit. We are confident that we will go over this hurdle and complete our IPO. But SEC does not provide us with the timetable for this review and would enable us to predict the precise timing. Now let's move to our 2021 outlook on Slide 7. Our values reflect optimism about our growth prospects for 2021. The report that we offer preliminary guidance in early January, which is unchanged. We expect revenue to be in the range of $205 million to $230 million, which present 39% annual growth in cleaning business. Our outlook 2021 is based on several key assumptions. First, the global COVID-19 situation improves in the coming months; second, U.S.-China trade policy stabilize; third, a range of spending scenarios for the production lending of key customers; fourth, variance in the trajectory of DRAM recovery; and finally, a range of outcomes for the timing of customer acceptance of the first tool. Our results and outlook demonstrate the successful execution of our strategy. Our strong growth is providing the capability to accelerate our R&D spending in new products. We are building a global sales and marketing resource to penetrate new customers in new regions and we're scaling production capacity to support our long-term growth plan. We are increasing operation spending to take advantage of their growth opportunity ahead. Our mission remains to become a major equipment supplier to the global semiconductor industry. I will now turn the call over to Mark to discuss the financial results in more detail.