David Wang
Analyst · Needham and Company. Please go ahead
Thanks Gary and welcome everyone to today’s call. Our third quarter results mark another quarter of great financial results, new product development, and strategic progress. We delivered record revenue, record shipments, strong bottom line growth and we’re strengthening our balance sheet. This result validated our technology, our spending product portfolio, and our ability to scale production. We remain focused on our mission to become a major proprietor of technical equipment to the semiconductor industry. Revenue growth of $33 million, up 44%, our customers push us to deliver high volume tools in the third quarter as they scale their own production capacity, with some key delivers accelerated from the fourth quarters. Shipments were $43 million, up 33% year-over-year. This includes First Tool for new product to existing customer and also SAPS-V product to our newest and the fifth major customer, an emerging China-based DRAM producer. We expect this First Tool to translate into revenue upon acceptance in future quarters, and more importantly, drive growth as they’re moving into production. We ended the quarter with $47 million of cash, up from $27 million last quarter. We took the opportunity to build our balance sheet to better align with our corporate mission. We are pleased with our U.S. capital reach, which has put us in a strong position to support our growth plans. This cash balance does not include the stock market, private equity investments, which we have chosen to segregate and hold in reserves. Let’s move to recent customer activity and technology developments. Please turn to Slide 4. First, YMTC, we are working close to support YMTC’s 3D NAND production ramp in Wuhan. Industrial analysts predict that YMTC will ramp its monthly wafer production from 6,000 to 20,000 in 2019 and to 50,000 or more in 2020. We believe we are YMTC’s largest single-wafer wet cleaning supplier. ACM tools are being deployed in a significant number of cleaning steps and we anticipate strong demand from YMTC in the quarters ahead. Second is Huali, also known as HLMC. It is a part of the Huahong Group, a leading advanced foundry in China. Huali is in early to middle stage of a multiyear capacity expansion. They are one of our key strategic customers with a production near our shanghai headquarters. Huali is adding capacity at a leading-edge node and is completing the build out of a new fab in Wuxi. We are participating in both projects, as they scale capacity and deploy our tools in their production. We also have a number of First Tool demo systems at Huali for our newer product offerings. Next, we added our fifth front end customer and a large China base entrance to DRAM industry. In July, this new customer placed the first order for SAPS-V First Tool. We delivered the tool in Q3. This led us for compelling value proposition, yearly improvements, and a solid technology roadmap. This DRAM customer is in the early stage of their multiyear production plan and we feel well positioned to participate as they scale in 2020 and beyond. Let’s turn to Slide 5. We see great growth opportunity with our new product. Let me start with an update on our Ultra-C Tahoe. Technical trials are progressing well. Our leading customer for Tahoe has moved its First Tool into the production environment. Initial reports confirm that Tahoe delivers the same cleaning performance of competitor’s high temperature sulfuric acid single-wafer cleaner, but with much less consumption of sulfuric acid. We anticipate customer acceptance and revenue recognition from Tahoe in the coming quarters. We remain confident that Tahoe tool will become a mainstream product that will solve current and future environmental challenges faced by customers. For TEBO, we continue with our development work. This quarter, we made great technical progress to meet customer requirements for the combined removal of bigger small particles for 3D-patterned structure without damaging. As a result, our TEBO tool has been qualified for field production cleaner step with higher particle remove efficiency without damaging. We expect a good order for TEBO in 2020. Let’s now turn to Slide 6. We delivered 2 ECP AP tools during the third quarter to one of our major packaging customers. Their Ultra ECP AP is a back end assembly tool used for applying copper, tin, nickel to wafers at die level for packaging. The APs delivered more uniform metal layer in a large by incorporating our proprietary technology. This uniformly is critical and it has delivered better yield and greater cleaning efficiency. It will be deployed not only in pumping but also in fan-out, 2.5D, 3D, in the portal and other 3D advanced packaging applications. All of our products, SAPS, Tahoe, TEBO, and ECP share the same philosophy. ACM focuses around bringing new technology to solve the problems of major semiconductor manufacturers. This product and our financial results demonstrate ACM’s capability to address production challenges in more advanced nodes and complex architectures. Now, let’s turn to several strategic developments. To start, we are pleased with the reception of our [indiscernible] equity offering. We intend using the capital primarily to fund our business outside of China and for strategic M&A. Industry analysts predict China will represent over a quarter of industrial spending in 2020, making China the top spending country ahead of South Korea, Taiwan, Japan, and North America. We have increased our effort to address the non-China market with the addition of a senior sales manager in North America, Southeast Asia. We also plan to ramp our marketing efforts out of China beginning this quarter. We are also making steady progress with our Shanghai stock market listing. We are encouraged by performance of the first batch of 34 IPOs on the stock market. Even with volatility, the valuation remains quite favorable and we are still targeting a listing of ACM Shanghai shares in the second half of next year. Finally, an update on our longer term production plans. As we said on our last call, we are moving forward with plans for long-term production capacity. We are in later stage negotiation with the Shanghai Government Authorities for agreement to purchase land for new factory and R&D centers. To conclude, I remain positive on the opportunities ahead of us and our ability to participate in a build-out of next-generation fabs for years to come. We expect to win new customers around the world as industrial progress to more advanced nodes, free dimensional architecture, and 3D advanced packages. I would like to thank our customers, partners, and the shareholders for their continued support and confidence in ACM Research. I especially want to thank our employees for their hard work and dedication. I will now turn the call over to Lisa, who will discuss financial results in more detail.